ALUMINUM 7075 Search Results

BSC27

Abstract: SS-BGA672B-02 aluminum 7075
Contextual Info: Features Top View Directly mounts to target PCB needs tooling holes with hardware A Minimum real estate required Compression plate distributes evenly Clamshell lid Materials: 1 Clam Shell Lid: Black anodized 7075 Aluminum. Height = 20 mm. 2 Socket Base: Black anodized 7075 Aluminum.

ASTM nut and bolt

Abstract: 38x150 durium bolt nut washer thread ASTM307 50x200 7075-T6 aluminum 38x125 burndy TMH267
Contextual Info: BURNDY Hardware TABLE OF CONTENTS DURIUM Hardware Bolts . . . . . . . . . . . . . . . . . . . . . . . . . . . . D-2 Aluminum Hardware Bolts . . . . . . . . . . . . . . . . . . . . . . . . . . . . D-6 Nuts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D-3

POGO

Abstract: SS-BGA1156A-01
Contextual Info: Features Top View Directly mounts to target PCB needs tooling holes with hardware Minimum real estate required A Compression plate distributes evenly 57.225mm [2.253"] Clamshell lid Materials: 1 Clam Shell Lid: Black anodized 7075 Aluminum. Height = 20 mm.

SS-LGA376A-01

Contextual Info: Top View Features Directly mounts to target PCB needs tooling holes with hardware Minimum real estate required A Compression plate distributes evenly 49.225mm [1.938"] Clamshell lid Materials: A 42.60mm [1.677"] 11 1 Clam Shell Lid: Black anodized 7075 Aluminum.

SS-BGA625A-01

Abstract: pogo
Contextual Info: Top View Features Directly mounts to target PCB needs tooling holes with hardware A Minimum real estate required 57.225mm [2.253"] Compression plate distributes evenly Clamshell lid Materials: A A 50.60mm [1.992"] 1 Clam Shell Lid: Black anodized 7075 Aluminum.

SS-QFN144A-01

Contextual Info: Top View Features Directly mounts to target PCB needs tooling holes with hardware A Minimum real estate required 39.23mm [1.544"] Compression plate distributes evenly Clamshell lid A Materials: 11 1 Clam Shell Lid: Black anodized 7075 Aluminum. Height = 20 mm.

SS-BGA800A-01

Contextual Info: Features Top View Directly mounts to target PCB needs tooling holes with hardware Minimum real estate required A Compression plate distributes evenly 57.225mm [2.253"] Clamshell lid Materials: A A 11 50.60mm [1.992"] 1 Clam Shell Lid: Black anodized 7075 Aluminum.

pogo pin application note

Abstract: SS-BGA95A-01
Contextual Info: Top View Features Directly mounts to target PCB needs tooling holes with hardware Minimum real estate required A 49.225mm [1.938"] Compression plate distributes evenly Clamshell lid Materials: A 42.6mm [1.677"] 11 Side View (Section AA) 1 Clam Shell Lid: Black anodized 7075 Aluminum.

SS-BGA772A-01

Contextual Info: Top View Features Directly mounts to target PCB needs tooling holes with hardware Minimum real estate required Compression plate distributes evenly 57.225mm [2.253"] Clamshell lid Materials: A 11 Side View (Section AA) 50.60mm [1.992"] 1 Clam Shell Lid: Black anodized 7075 Aluminum.

SS-BGA256E-01

Contextual Info: Top View Features Directly mounts to target PCB needs tooling holes with hardware A Minimum real estate required 39.23mm [1.544"] Compression plate distributes forces evenly Clamshell lid A Materials: 11 32.60mm [1.283"] Side View (Section AA) 1 Clam Shell Lid: Black anodized 7075 Aluminum.

CG-BGA-4002

Abstract: 4002 ic
Contextual Info: Top View Features Directly mounts to target PCB needs tooling holes with hardware Minimum real estate required Compression plate distributes forces evenly A 49.225mm [1.938"] Clamshell lid Materials: A 1 42.60mm [1.677"] 10 2 Side View (Section AA) Socket Base: Black anodized 7075 Aluminum.

qfn68

Abstract: BOX21151 SS-QFN68A-01
Contextual Info: Top View Features Directly mounts to target PCB needs tooling holes with hardware A Minimum real estate required 30.23mm [1.190"] Compression plate distributes forces evenly Clamshell lid A Materials: 11 25.48mm [1.003"] Side View (Section AA) 1 Clam Shell Lid: Black anodized 7075 Aluminum.

pogo pin application note

Abstract: BOX21151 SS-BGA62C-01 pogo pin
Contextual Info: Top View End View Features Directly mounts to target PCB needs tooling holes with hardware Minimum real estate required A Compression plate distributes evenly 39.23mm [1.544"] Clamshell lid A Materials: 11 32.60mm [1.283"] Side View (Section AA) 4 1 Clam Shell Lid: Black anodized 7075 Aluminum.

225G

Abstract: SS-BGA225G-01 BGA OUTLINE DRAWING
Contextual Info: Top View Features Directly mounts to target PCB needs tooling holes with hardware A Minimum real estate required 39.23mm [1.544"] Compression plate distributes evenly Clamshell lid A Materials: 11 1 Clam Shell Lid: Black anodized Aluminum. Height = 20 mm.

Contextual Info: SIEM ENS 47E D • fl53SbDS GOSbBflH T ■ SIE6 RP-12C Mask-Diffused GaAsP LED PART NO. 2680-7075 -P M f P-metal anode Diffusion Barrier Epitaxial Layer Substrate N-metal (cathode) DESCRIPTION TYPICAL DEVICE PARAMETERS Siemens RP-12C is a mask-diffused GaAsP lightemitting diode. With a bright and uniform 655 nm

Contextual Info: OPTO SIEM ENS MME D • ÖE3b32b DD OM b^ M S IE X h RP-12C Mask-Diffused GaAsP LED PART NO. 2680-7075 W '9? P -m e ta l a node D iffu sio n Barrier Epita xia l La y e r Substrate N -m e ta i (cathode) DESCRIPTION TYPICAL DEVICE PARAMETERS Siemens RP-12C is a mask-diffused GaAsP lightemitting diode. With a bright and uniform 655 nm

RP-12C

Abstract: 655-nm
Contextual Info: SIEM ENS 47E D fl235fc>D5 G 0 2 b ô ô 4 T » S I E G RP-12C Mask-Diffused GaAsP LED PART NO. 2680-7075 P-metal anode Diffusion Barrier Epitaxial Layer Substrate N-metal (cathode) DESCRIPTION TYPICAL DEVICE PARAMETERS Siemens RP-12C is a mask-diffused G aA sP lightemitting diode. With a bright and uniform 655 nm

PEM SOS-632-8

Abstract: SOS-440-10 7075-T6 aluminum sos-6440-4 SOS-832-16 SOS-632-12 SOS-440-12 BSOS-440-10 SO-440-6 SOS-440-8
Contextual Info: S ELF-CLINCHING S TA N D O F F S SELF-CLINCHING STANDOFFS These standoffs, which use the proven self-clinching design, install with a squeeze in punched or drilled round holes – and become permanently mounted in the thin sheet. PEM brand standoffs are installed with their heads flush with one surface

SS-QFE128SD-01

Contextual Info: Features Top View Directly mounts to target PCB needs tooling holes with hardware Minimum real estate required Compression plate distributes forces evenly A 49.225mm [1.938"] Clamshell lid Materials: A 11 42.60mm [1.677"] Side View (Section AA) 4 Assembled 44mm +/-2

Contextual Info: S ER IES 97 0 POWERTRIP CONNECTORS THE POW E R C ON N E CT OR FO R EX TREM E EN V I RO NMENT S FIRST EDITION • MARCH 2013 SERIES 970 HIGH CURRENT, HARSH ENVIRONMENT POWERTRIP ™ The power connector for extreme environments Protect circuits with Series 970 PowerTrip™ connectors

SS-QFE176SC-01

Abstract: pogo pin 4-26MM 11351
Contextual Info: Features Top View Directly mounts to target PCB needs tooling holes with hardware Minimum real estate required Compression plate distributes forces evenly A 49.225mm [1.938"] Clamshell lid Materials: A 42.60mm [1.677"] 11 Side View (Section AA) 4 Assembled 44mm +/-2

Burndy PAT750-18V parts breakdown

Abstract: BURN GI CONDUIT lp 1610 for door bell Burndy Y35 hypress parts breakdown ci an 7591 NEC c317 KPC 45 94V SAE-AS7928 burndy Y35 Hypress owner manual burndy patriot pat750-18v replacement parts
Contextual Info: Master Catalog Solutions for the Electrical Industry Experience. Technology. Answers. TM Customer Service Department 7 Aviation Park Drive Londonderry, NH 03053 1-800-346-4175 1-603-647-5299 International Canada 1-800-361-6975 (Quebec) 1-800-387-6487 (All other provinces)

bga676

Abstract: 1mm pitch BGA socket BGA-676 BGA 27X27 pitch 27X27MM 7075-T6 aluminum 180C 7075-T6 SBT-BGA-6002 1mm pitch BGA
Contextual Info: SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS Features • • • • 6 7 • 12 14 13 • Wide temperature range -55C to +180C High current capability (up to 8A) Excellent signal integrity at high frequencies Low and stable contact resistance for reliable

7075-T6 aluminum

Abstract: 7075-T6 high current pogo pin aluminium 7075 180C SBT-BGA-7000 high current high temperature pogo pin
Contextual Info: SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS Features 10 14 9 7 8 6 • • • • • • 5 13 12 4 15 3 1 2 11 Primary dimension units are millimeters, Secondary dimension units are [inches]. Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches from true position