AMKOR CABGA 56 Search Results
AMKOR CABGA 56 Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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amkor CABGA 56
Abstract: chiparray amkor CABGA 8X8 CTBGA CABGA 17 x 17 thermal resistance CABGA CVBGA MO-195 8x8 64 footprint amkor cabga
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Contextual Info: solution copper wire bonding technology Copper Cu Wire Bonding Copper (Cu) wire has long been used as a method of connecting a silicon die to the package terminals. With the recent increase in gold (Au) wire cost, Cu wire is an attractive way to manage overall package cost. |
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40mil 55/60nm 45/40nm 28/22nm | |
E700GContextual Info: Data Sheet LAMINATE fcCSP fcCSP Packages Amkor Technology offers the Flip Chip CSP fcCSP package – a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or |
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DS577G E700G | |
A2E5Contextual Info: LH7A404 32-Bit System-on-Chip Data Sheet FEATURES • Three Programmable Timers • 32-bit ARM9TDMI RISC Core – 16KB Cache: 8KB Instruction and 8KB Data Cache – MMU Windows CE™ Enabled – Up to 266 MHz; See Table 1 for speed/temp options • Three UARTs, one with Classic IrDA (115 kbit/s) |
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LH7A404 32-bit 10-bit SMA02004 A2E5 | |
amkor CABGA 56
Abstract: lpp 68 g1
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LH7A404 32-bit 10-bit SMA02004 amkor CABGA 56 lpp 68 g1 | |
TSMC 0.18 um MOSfet
Abstract: M38510 10102BCA IDT7204L 5962-8768401MQA 0.18um LDMOS TSMC sl1053 TSMC 0.25Um LDMOS UT63M125BB SMD RTAX250S-CQ208 5962-04221
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QML-38535 MIL-PRF-38535 MIL-STD-790 MIL-STD-690 -581DSCC QML-38535 TSMC 0.18 um MOSfet M38510 10102BCA IDT7204L 5962-8768401MQA 0.18um LDMOS TSMC sl1053 TSMC 0.25Um LDMOS UT63M125BB SMD RTAX250S-CQ208 5962-04221 |