AMKOR TECHNOLOGY MLF Search Results

laptop ic list

Abstract: NS6040 contactor Amkor Technology handler
Contextual Info: data sheet TEST CONTACTOR FusionQuad Test Contactor Test Hardware List: Amkor FusionQuad® Test Contactor: Amkor Technology is now offering the FusionQuad® Test Contactor Amkor’s FusionQuad® represents a breakthrough in leadframe-based plastic packaging through the effective

amkor

Abstract: amkor exposed pad
Contextual Info: LEADFRAME data sheet FusionQuad Features FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a

amkor exposed pad

Abstract: exposed QFP 128 amkor exposed QFP 144
Contextual Info: LEADFRAME data sheet FusionQuad Features: FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a cost-effective platform for increased lead count in a small

QFN 76 9x9 footprint

Abstract: QFN 64 8x8 footprint qfn 44 PACKAGE footprint 7x7 DIe Size QFN 56 7x7 footprint DUAL ROW QFN leadframe qfn 44 PACKAGE footprint 7x7 qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint QFN 48 7x7 footprint footprint mlf
Contextual Info: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses

DUAL ROW QFN leadframe

Abstract: amkor mlf qfn QFN 56 7x7 footprint qfn 44 PACKAGE footprint 7x7 DIe Size qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint qfn 48 7x7 footprint QFN Shipping Trays qfn 44 PACKAGE footprint 7x7 156 qfn
Contextual Info: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features: Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This

MEMS blood pressure sensor

Abstract: "Blood Pressure Sensor" MEMS pressure sensor silicon mems microphone capacitor mems gas sensor mems microphone mems amkor microphone MEMS Filter MEMS optical tunable filters
Contextual Info: solution microelectromechanical systems technology MEMS Technology Microelectromechanical systems MEMS are micron-size devices that can sense or manipulate the physical world. MEMS are created using micro machining processes, similar to those used to produce integrated

copper wire datasheet

Abstract: copper wire 1mm Amkor Technology ATP3 ATP1 au wire copper bond wire copper bond wire amkor
Contextual Info: solution copper wire bonding technology Copper Cu Wire Bonding Copper (Cu) wire has long been used as a method of connecting a silicon die to the package terminals. With the recent increase in gold (Au) wire cost, Cu wire is an attractive way to manage overall package cost.

22V10A

Abstract: LVCMOS33 LVCMOS18 QFN PACKAGE thermal resistance LVCMOS25 QFN footprint amkor mlf qfn
Contextual Info: Using the ispGAL22V10A in the QFN Package April 2003 Application Note AN8074 Introduction Lattice’s ispGAL 22V10A device in the QFN package provides several added capabilities to the standard 22V10 architecture. The QFN Quad Flat pack, No lead package, also known as the MLF (Micro Lead Frame) package, is

22V10

Abstract: 22V10A LVCMOS25 LVCMOS33 ABEL plastron
Contextual Info: Using the ispGAL22V10A in the QFN Package November 2007 Application Note AN8074 Introduction Lattice’s ispGAL 22V10A device in the QFN package provides several added capabilities to the standard 22V10 architecture. The QFN Quad Flat pack, No lead package, also known as the MLF (Micro Lead Frame) package, is

HCP0703

Abstract: B230A RLF7030-1R0 SSA23L
Contextual Info: MIC4782 Evaluation Board Dual 2A Buck Regulator General Description The Micrel MIC4782 is a high efficiency dual PWM buck step-down regulator that provides up to 2A of output current for each channel. The MIC4782 operates at 1.8MHz and has proprietary internal compensation that

CS-007

Abstract: Amkor Electronics Amkor mold compound
Contextual Info: LEADFRAME data sheet FusionQuad Body Exposed Pad Size mm Size (mm) 176 ld 14 x 14 6.5 x 6.5 A Electrical: Theta JA (°C/W) by Velocity (m/s) 1.0 2.5 24.6 19.9 17.9 Body Pad Size Size Pkg (mm) 14 x 14 Inductance Capacitance Resistance (mm) Lead 6.5 x 6.5 176 ld

L512 led

Abstract: Adjustable Current Regulator With Enable Control
Contextual Info: MIC2210 Micrel MIC2210 Dual µCap LDO with Open-Drain Driver Final General Description Features The MIC2210 is a dual µCap low dropout regulator with an open-drain driver and power-on reset circuit. The first regulator is capable of sourcing 150mA, while the second regulator can source up to 300mA and includes a power-on reset

CY7C65630

Abstract: CY4602A CY4602 CY4605 CY7C65620 CY7C65640A CY7C656XX usb esd eye pattern
Contextual Info: Application Note AN5044 CY7C656xx PCB Design Recommendations Author: Keith Klepin Associated Project: No Associated Part Family: CY7C65620/30 Software Version: N/A Associated Application Notes: None Abstract This application note presents recommendations for designing with the Cypress Semiconductor CY7C65640A, CY7C65630,

PIC16F73

Abstract: PIC16C73B PIC16C72A AC164031 PIC16F76
Contextual Info: PICmicro Microcontrollers in Small-Scale MLF Packages Ideal For Applications Where Space is Vital Microchip Technology Inc. is producing a number of the company’s popular PICmicro® OTP and Flash microcontrollers in a new competitively-priced, space-saving MicroLeadframe MLF package.

CY4602

Abstract: physical layer design for USB 2.0 USB 2.0 HUB CY7C65630 "4 port" passive hub magic eye schematic diagram 48v dc motor speed controller usb common mode choke CY7C65620 CY7C65640A
Contextual Info: Application Note AN5044 CY7C656xx PCB Design Recommendations Author: Keith Klepin Associated Project: No Associated Part Family: CY7C65620/30 Software Version: N/A Associated Application Notes: None Abstract This application note presents recommendations for designing with the Cypress Semiconductor CY7C65640A, CY7C65630,

Contextual Info: solution copper wire bonding technology Copper Cu Wire Bonding Copper (Cu) wire has long been used as a method of connecting a silicon die to the package terminals. With the recent increase in gold (Au) wire cost, Cu wire is an attractive way to manage overall package cost.

CY7C65630

Abstract: CY7C65620 CY4602 CY4605 CY7C65640A CY7C656XX
Contextual Info: Application Note AN5044 CY7C656xx PCB Design Recommendations - AN5044 Author: Keith Klepin Associated Project: No Associated Part Family: CY7C65620/30 Software Version: N/A Associated Application Notes: None Abstract This application note presents recommendations for designing with the Cypress Semiconductor CY7C65640A, CY7C65630,

MIC2214

Contextual Info: Complete Portable Power Management Solution in Tiny MLF Package! 1/ THE SIZE OF THE 3 CURRENT SOLUTION! MIC2214 Baseband PMIC in MLF Actual Size Thickness: SC-70 SOT-23 0.95mm 1.3mm MLF 3mm x 3mm 0.85mm The Good Stuff ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆

CY7C65630

Abstract: CY4602 CY4605 CY7C65620 CY7C65640A CY7C656XX
Contextual Info: EZ-USB Hubs CY7C656XX PCB Design Recommendations AN5044 Author: Keith Klepin Associated Project: No Associated Part Family: CY7C65620/CY7C65630/CY7C65640A Software Version: None Associated Application Notes: None Application Note Abstract AN5044 presents recommendations for designing with the Cypress Semiconductor CY7C65640A, CY7C65630, and

microleadframe amkor

Abstract: TM0011
Contextual Info: ᆅগॐࠓႊೌप‫ހ‬ጎ LFCSP ยऺᇑ዆ሰኸళ ፕኁǖGary Griffin ణ୤ ०঻ ०঻ . 1 ӱยऺ੊୯ . 2

Amkor Technology MLF

Abstract: MIC2288 MIC2289 MIC2290 MIC2292 MIC2293 "White LED Drivers"
Contextual Info: Power and System Management for Battery Powered Applications Organic Boost Regulators 2mm x 2mm MLF TM VIN OFF ON VIN VOUT 2" OEL PANEL OFF • >1A Switch Current MIC2288 • 1.2MHz PWM Operation 1" OEL PANEL MIC 2290 ON • >500mA Switch Current (MIC2290)

Contextual Info: MIC5166 3A High-Speed Low VIN DDR Terminator Benefits Features • 3mm x 3mm MLF package • Tiny size allows closer placement to DDR memory • High-side NMOS output stage offers very low impedance and very high bandwidth • Stable with two 10 uF ceramic output capacitors

Contextual Info: SY84402L Product Brief 4.25Gbps VCSEL Driver Description The SY84402L is a 3.3V VCSEL driver for applications up to 4.25Gbps. The driver comes in a 2mm x 2mm MLF package which makes it less than half the size of any other driver operating at that rate. The variable output swing on

Contextual Info: SY89251V Product Brief Enhanced Differential Receiver Description The SY89251V is a differential PECL/ECL receiver/buffer in a space saving 2mm x 2mm MLF package. The device is functionally equivalent to the SY100EL16VC, except for an active HIGH enable pin and a 70% smaller