AMKOR WAFER LEVEL MOLD COMPOUND Search Results
AMKOR WAFER LEVEL MOLD COMPOUND Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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CS-USBAA00000-002 |
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Amphenol CS-USBAA00000-002 Molded USB 2.0 Cable - Type A-A 2m | Datasheet | ||
CS-USBAB00000-001 |
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Amphenol CS-USBAB00000-001 Molded USB 2.0 Cable - Type A-B 1m | Datasheet | ||
CS-USBAB00000-002 |
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Amphenol CS-USBAB00000-002 Molded USB 2.0 Cable - Type A-B 2m | Datasheet | ||
CS-USBAA00000-003 |
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Amphenol CS-USBAA00000-003 Molded USB 2.0 Cable - Type A-A 3m | Datasheet | ||
CS-USBAA00000-005 |
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Amphenol CS-USBAA00000-005 Molded USB 2.0 Cable - Type A-A 5m | Datasheet |
AMKOR WAFER LEVEL MOLD COMPOUND Datasheets Context Search
Catalog Datasheet | MFG & Type | Document Tags | |
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Untitled
Abstract: No abstract text available
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DS550R | |
JEDEC Jc-11 free
Abstract: PSVFBGA FCCSP 0.3mm pitch csp package Amkor Technology amkor flip Amkor CSP mold compound Amkor Wafer level mold compound 0.65mm pitch BGA mold cap
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wirebon00 JEDEC Jc-11 free PSVFBGA FCCSP 0.3mm pitch csp package Amkor Technology amkor flip Amkor CSP mold compound Amkor Wafer level mold compound 0.65mm pitch BGA mold cap | |
JEDEC Jc-11 free
Abstract: PSVFBGA Amkor Wafer level mold compound 1415B jedec package standards Amkor CSP mold compound PoP PACKAGE TESTING Die B3
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vFBGA* 96 bALL
Abstract: Amkor Wafer level mold compound amkor cabga thermal resistance BGA 256 PACKAGE thermal resistance Amkor Technology CABGA CTBGA MO-195 BGA PACKAGE thermal resistance amkor cabga
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E679
Abstract: Amkor CSP mold compound chiparray amkor MO-192 Amkor mold compound Amkor Wafer level mold compound amkor polyimide
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HL832N
Abstract: FCCSP HL832 Amkor CSP mold compound cu pillar amkor cabga thermal resistance CABGA 6x6 flip chip bga 0,8 mm BGA 64 PACKAGE thermal resistance amkor Cu pillar
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cu pillar
Abstract: Flip Chip Substrate HL832 ds7409 FCCSP amkor flip chiparray amkor HL832N CABGA 48 7x7 amkor cabga thermal resistance
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Amkor Wafer level mold compound
Abstract: l2aa CCL-HL-832 JEDEC tray standard 13 SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY Ablestik 2300 4-Layer tepbga-2 CO-029
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Untitled
Abstract: No abstract text available
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DS571J | |
SOT23 JEDEC standard orientation
Abstract: SOT23 JEDEC standard MO-223A c 3421 transistor SOT23 JEDEC standard orientation pad size JEDEC 95 sot packages MO-193D 193d Amkor G600 SC sot23
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MO-193D. SOT23 JEDEC standard orientation SOT23 JEDEC standard MO-223A c 3421 transistor SOT23 JEDEC standard orientation pad size JEDEC 95 sot packages MO-193D 193d Amkor G600 SC sot23 | |
amkor CABGA 56
Abstract: chiparray amkor CABGA 8X8 CTBGA CABGA 17 x 17 thermal resistance CABGA CVBGA MO-195 8x8 64 footprint amkor cabga
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BGA 64 PACKAGE thermal resistance
Abstract: FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45
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63Sn/37Pb) BGA 64 PACKAGE thermal resistance FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45 | |
l2aa
Abstract: tepbga-2 CO-029 Amkor mold compound Amkor Wafer level mold compound GE-100L Amkor Technology pbga moisture GE-100-L UM2219 mold compound
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CO-029) l2aa tepbga-2 CO-029 Amkor mold compound Amkor Wafer level mold compound GE-100L Amkor Technology pbga moisture GE-100-L UM2219 mold compound | |
E700G
Abstract: No abstract text available
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DS577G E700G | |
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JEDEC MS-026
Abstract: MS-026 Amkor mold compound lqfp 7x7 tray jedec MS-026-A
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MS-026 JEDEC MS-026 MS-026 Amkor mold compound lqfp 7x7 tray jedec MS-026-A | |
MO-153
Abstract: MO-187 MO-194 PPF leadframe MO153 MO-153 Packages JEDEC MO-187 JEDEC MO-153 38 Amkor mold compound tssop
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leadframe C7025
Abstract: Ablestik 84-1 EME7351T Ablestik 84-1 lmis-r4 74LCXR162245MTX Ablestik LMISR4 FSTUD16211MTDX Sumitomo 7351T Ablestik leadframe Cu C7025
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20033907-B epax02 6437211EXT 74VCXH16374MTDX 74VHC161284MTD FIN1108MTDX FIN1216MTD FIN1217MTDX FIN3383MTD FIN3385MTDX leadframe C7025 Ablestik 84-1 EME7351T Ablestik 84-1 lmis-r4 74LCXR162245MTX Ablestik LMISR4 FSTUD16211MTDX Sumitomo 7351T Ablestik leadframe Cu C7025 | |
CS-007
Abstract: Amkor Electronics Amkor mold compound
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nitto GE-100L
Abstract: GE-100L Nitto GE 100 nitto GE CCL-HL-832 CCL-HL832 HL832 pcb material datasheet 100L CO-029 MS-034
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GE100LFCS
Abstract: HL832nxa HL-832NXA HL832NX-A BFG81 Ablestik 2000 aus308 HL832 nx-a AUS-308 JESD22-A110
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A1008-05 82V2082BFG 82V2082BFG8 CABGA-81 FPBGA-289 JESD22-A110 JESD22-A104 JESD22-A103 JESD22-A113 GE100LFCS HL832nxa HL-832NXA HL832NX-A BFG81 Ablestik 2000 aus308 HL832 nx-a AUS-308 JESD22-A110 | |
nitto GE
Abstract: GE-100L nitto GE-100L Nitto GE 100 313 pin PBGA te2 219 Ablestik 2300 NITTO GE- 100L CO-029
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lqfp 7x7 tray
Abstract: MS-026 7X748LD amkor
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MS-026 lqfp 7x7 tray MS-026 7X748LD amkor | |
STMicroelectronics marking code date
Abstract: CHN G4 chn 509 marking code stmicroelectronics Date Code Marking STMicroelectronics CHN 450 SUMITOMO G700 ablebond 8290 Part Marking STMicroelectronics ST MICROELECTRONICS DATE CODE MARKING
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MPG-EEP/04/578 M50FW, M50LPW, M50FLW TSOP40 MPG/EE/0086 MPG/EEP/04/450. STMicroelectronics marking code date CHN G4 chn 509 marking code stmicroelectronics Date Code Marking STMicroelectronics CHN 450 SUMITOMO G700 ablebond 8290 Part Marking STMicroelectronics ST MICROELECTRONICS DATE CODE MARKING | |
STMicroelectronics marking code date
Abstract: Date Code Marking STMicroelectronics ST MICROELECTRONICS DATE CODE MARKING sumitomo crm epoxy Part Marking STMicroelectronics Ablebond 8360 marking code stmicroelectronics ablestik 8360 device Marking STMicroelectronics 1076E
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MPG-EEP/04/451 PLCC32 M50FW M50LPW M50FLW 30-Apr-2004 30-May-2004 STMicroelectronics marking code date Date Code Marking STMicroelectronics ST MICROELECTRONICS DATE CODE MARKING sumitomo crm epoxy Part Marking STMicroelectronics Ablebond 8360 marking code stmicroelectronics ablestik 8360 device Marking STMicroelectronics 1076E |