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    AMKOR WAFER LEVEL MOLD COMPOUND Search Results

    AMKOR WAFER LEVEL MOLD COMPOUND Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-USBAA00000-002 Amphenol Cables on Demand Amphenol CS-USBAA00000-002 Molded USB 2.0 Cable - Type A-A 2m Datasheet
    CS-USBAB00000-001 Amphenol Cables on Demand Amphenol CS-USBAB00000-001 Molded USB 2.0 Cable - Type A-B 1m Datasheet
    CS-USBAB00000-002 Amphenol Cables on Demand Amphenol CS-USBAB00000-002 Molded USB 2.0 Cable - Type A-B 2m Datasheet
    CS-USBAA00000-003 Amphenol Cables on Demand Amphenol CS-USBAA00000-003 Molded USB 2.0 Cable - Type A-A 3m Datasheet
    CS-USBAA00000-005 Amphenol Cables on Demand Amphenol CS-USBAA00000-005 Molded USB 2.0 Cable - Type A-A 5m Datasheet

    AMKOR WAFER LEVEL MOLD COMPOUND Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Data Sheet LEADFRAME CABGA/fBGA Features ChipArray Packages Amkor’s ChipArray® Ball Grid Array CABGA packages are laminate based packages that are compatible with SMT mounting processes worldwide. The near chip size CABGA fine-pitch BGA (fBGA) offers a


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    PDF DS550R

    JEDEC Jc-11 free

    Abstract: PSVFBGA FCCSP 0.3mm pitch csp package Amkor Technology amkor flip Amkor CSP mold compound Amkor Wafer level mold compound 0.65mm pitch BGA mold cap
    Text: LAMINATE data sheet Package on Package PoP Family Bottom PoP Technologies: Features: After three years of development in package stacking technology and infrastructure, Amkor launched the multiple award winning PSvfBGA platform in the 4th quarter of 2004. The next four years saw many new


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    PDF wirebon00 JEDEC Jc-11 free PSVFBGA FCCSP 0.3mm pitch csp package Amkor Technology amkor flip Amkor CSP mold compound Amkor Wafer level mold compound 0.65mm pitch BGA mold cap

    JEDEC Jc-11 free

    Abstract: PSVFBGA Amkor Wafer level mold compound 1415B jedec package standards Amkor CSP mold compound PoP PACKAGE TESTING Die B3
    Text: LAMINATE data sheet Package on Package PoP Family PSvfBGA Package Stackable Very Thin Fine Pitch BGA (PSvfBGA): After 3 years of development in package stacking technology and infrastructure, Amkor launched the multiple award winning PSvfBGA (base PoP) platform during the 4th quarter of 2004. The next two years saw


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    vFBGA* 96 bALL

    Abstract: Amkor Wafer level mold compound amkor cabga thermal resistance BGA 256 PACKAGE thermal resistance Amkor Technology CABGA CTBGA MO-195 BGA PACKAGE thermal resistance amkor cabga
    Text: LAMINATE data sheet CABGA/CTBGA/CVBGA Features: ChipArray Packages: ChipArray® BGA CABGA / LFBGA Thin ChipArray® BGA (CTBGA / TFBGA) Very Thin ChipArray® BGA (CVBGA / VFBGA) Amkor’s ChipArray® packages are laminatebased Ball Grid Array (BGA) packages that are


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    E679

    Abstract: Amkor CSP mold compound chiparray amkor MO-192 Amkor mold compound Amkor Wafer level mold compound amkor polyimide
    Text: LAMINATE data sheet Stacked CSP Features: Stacked CSP SCSP : The Stacked CSP (SCSP) family leverages Amkor's industry leading ChipArray Ball Grid Array (CABGA) manufacturing capabilities. This broad high volume infrastructure enables the rapid deployment of advances in die stacking


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    HL832N

    Abstract: FCCSP HL832 Amkor CSP mold compound cu pillar amkor cabga thermal resistance CABGA 6x6 flip chip bga 0,8 mm BGA 64 PACKAGE thermal resistance amkor Cu pillar
    Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or


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    cu pillar

    Abstract: Flip Chip Substrate HL832 ds7409 FCCSP amkor flip chiparray amkor HL832N CABGA 48 7x7 amkor cabga thermal resistance
    Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or


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    Amkor Wafer level mold compound

    Abstract: l2aa CCL-HL-832 JEDEC tray standard 13 SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY Ablestik 2300 4-Layer tepbga-2 CO-029
    Text: LAMINATE data sheet PBGA Innovative designs and expanding package offerings provide a platform from prototype-to-production. Features • Custom ball counts up to 1521 • 1.00, 1.27 & 1.50 mm standard ball pitch available other ball pitches available upon request, (e.g. 0.8mm


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    Untitled

    Abstract: No abstract text available
    Text: Data Sheet LEADFRAME ExposedPad TSSOP/MSOP/SOIC/SSOP Thermal Performance Forced Convection, Single-layer PCB ExposedPad Thin Shrink Small Outline Package TSSOP , Micro Small Outline Package (MSOP), Small Outline IC Package (SOIC), Shrink Small Outline (SSOP)


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    PDF DS571J

    SOT23 JEDEC standard orientation

    Abstract: SOT23 JEDEC standard MO-223A c 3421 transistor SOT23 JEDEC standard orientation pad size JEDEC 95 sot packages MO-193D 193d Amkor G600 SC sot23
    Text: LEADFRAME data sheet SOT / SC Features: Thermal Resistance: Standard Outline Transistor SOT23 and Single Chip (SC70) Packages: Amkor’s 1.0 mm thick, 3, 5, 6, and 8 lead SOT23 and 5 and 6 lead SC70 packages offer gullwing lead, subminiature, SMT performance


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    PDF MO-193D. SOT23 JEDEC standard orientation SOT23 JEDEC standard MO-223A c 3421 transistor SOT23 JEDEC standard orientation pad size JEDEC 95 sot packages MO-193D 193d Amkor G600 SC sot23

    amkor CABGA 56

    Abstract: chiparray amkor CABGA 8X8 CTBGA CABGA 17 x 17 thermal resistance CABGA CVBGA MO-195 8x8 64 footprint amkor cabga
    Text: LAMINATE data sheet CABGA/CTBGA/CVBGA Features: ChipArray Packages: Amkor’s ChipArray® packages are laminatebased Ball Grid Array BGA packages that are compatible with established SMT mounting processes. The near-chip-size standard outlines offer a broad selection of ball array pitch, count,


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    BGA 64 PACKAGE thermal resistance

    Abstract: FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45
    Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package — a flip chip solution in a CSP package format. This package construction utilizes eutectic tin/lead (63Sn/37Pb) flip chip interconnect


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    PDF 63Sn/37Pb) BGA 64 PACKAGE thermal resistance FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45

    l2aa

    Abstract: tepbga-2 CO-029 Amkor mold compound Amkor Wafer level mold compound GE-100L Amkor Technology pbga moisture GE-100-L UM2219 mold compound
    Text: LAMINATE data sheet PBGA Features: • Custom ball counts up to 1521 • 1.00, 1.27 & 1.50 mm ball pitch available other ball pitches available upon request • 13 mm to 40 mm body sizes • Thin Au wire (0.5mil or Cu wire compatible • Large mold cap for quality enhancement


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    PDF CO-029) l2aa tepbga-2 CO-029 Amkor mold compound Amkor Wafer level mold compound GE-100L Amkor Technology pbga moisture GE-100-L UM2219 mold compound

    E700G

    Abstract: No abstract text available
    Text: Data Sheet LAMINATE fcCSP fcCSP Packages Amkor Technology offers the Flip Chip CSP fcCSP package – a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or


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    PDF DS577G E700G

    JEDEC MS-026

    Abstract: MS-026 Amkor mold compound lqfp 7x7 tray jedec MS-026-A
    Text: LEADFRAME data sheet LQFP Features: Low Profile Quad Flat Pack LQFP Packages: Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers


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    PDF MS-026 JEDEC MS-026 MS-026 Amkor mold compound lqfp 7x7 tray jedec MS-026-A

    MO-153

    Abstract: MO-187 MO-194 PPF leadframe MO153 MO-153 Packages JEDEC MO-187 JEDEC MO-153 38 Amkor mold compound tssop
    Text: LEADFRAME data sheet TSSOP Features: Thin Shrink Small Outline Package TSSOP : With the evolution of smaller, denser, faster and lighter end products, Amkor not only shrunk the SOP by decreasing the lead pitch, but also made it thin - 0.9 mm thin! Amkor invested time and research


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    leadframe C7025

    Abstract: Ablestik 84-1 EME7351T Ablestik 84-1 lmis-r4 74LCXR162245MTX Ablestik LMISR4 FSTUD16211MTDX Sumitomo 7351T Ablestik leadframe Cu C7025
    Text: Date Created: 4/21/2004 Date Issued: 5/3/2004 PCN # 20033907-B DESIGN/PROCESS CHANGE NOTIFICATION - FINAL This is to inform you that a design and/or process change will be made to the following product s . This notification is for your information and concurrence.


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    PDF 20033907-B epax02 6437211EXT 74VCXH16374MTDX 74VHC161284MTD FIN1108MTDX FIN1216MTD FIN1217MTDX FIN3383MTD FIN3385MTDX leadframe C7025 Ablestik 84-1 EME7351T Ablestik 84-1 lmis-r4 74LCXR162245MTX Ablestik LMISR4 FSTUD16211MTDX Sumitomo 7351T Ablestik leadframe Cu C7025

    CS-007

    Abstract: Amkor Electronics Amkor mold compound
    Text: LEADFRAME data sheet FusionQuad Body Exposed Pad Size mm Size (mm) 176 ld 14 x 14 6.5 x 6.5 A Electrical: Theta JA (°C/W) by Velocity (m/s) 1.0 2.5 24.6 19.9 17.9 Body Pad Size Size Pkg (mm) 14 x 14 Inductance Capacitance Resistance (mm) Lead 6.5 x 6.5 176 ld


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    nitto GE-100L

    Abstract: GE-100L Nitto GE 100 nitto GE CCL-HL-832 CCL-HL832 HL832 pcb material datasheet 100L CO-029 MS-034
    Text: LAMINATE data sheet MCM-PBGA Features: MCM-PBGA Packages: The MCM-PBGA Multi-Chip Module Plastic Ball Grid Array by Amkor incorporates the latest technology in high-density plastic IC packaging. The high-speed performance and thermal advantages of the PBGA


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    GE100LFCS

    Abstract: HL832nxa HL-832NXA HL832NX-A BFG81 Ablestik 2000 aus308 HL832 nx-a AUS-308 JESD22-A110
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1008-05 DATE: September 24, 2010 MEANS OF DISTINGUISHING CHANGED DEVICES: 82V2082BFG & 82V2082BFG8 built in 8 mm x 8mm CABGA-81


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    PDF A1008-05 82V2082BFG 82V2082BFG8 CABGA-81 FPBGA-289 JESD22-A110 JESD22-A104 JESD22-A103 JESD22-A113 GE100LFCS HL832nxa HL-832NXA HL832NX-A BFG81 Ablestik 2000 aus308 HL832 nx-a AUS-308 JESD22-A110

    nitto GE

    Abstract: GE-100L nitto GE-100L Nitto GE 100 313 pin PBGA te2 219 Ablestik 2300 NITTO GE- 100L CO-029
    Text: LAMINATE data sheet PBGA Features: Plastic Ball Grid Array PBGA : Amkor’s PBGAs incorporate the most advanced assembly processes and designs for today’s and tomorrow’s cost/performance applications. This advanced IC package technology allows application


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    lqfp 7x7 tray

    Abstract: MS-026 7X748LD amkor
    Text: LEADFRAME data sheet LQFP Features: Low Profile Quad Flat Pack LQFP Packages: Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers


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    PDF MS-026 lqfp 7x7 tray MS-026 7X748LD amkor

    STMicroelectronics marking code date

    Abstract: CHN G4 chn 509 marking code stmicroelectronics Date Code Marking STMicroelectronics CHN 450 SUMITOMO G700 ablebond 8290 Part Marking STMicroelectronics ST MICROELECTRONICS DATE CODE MARKING
    Text: PRODUCT/PROCESS CHANGE NOTIFICATION PCN MPG-EEP/04/578 M50FW, M50LPW, M50FLW Firmware Hub and Low Pin Count Product Families, TSOP40 Environmental Friendly Package and Assembly Location Change WHAT IS THE CHANGE? The present PCN replaces and upgrades PCN MPG/EE/0086 / CPCN MPG/EEP/04/450.


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    PDF MPG-EEP/04/578 M50FW, M50LPW, M50FLW TSOP40 MPG/EE/0086 MPG/EEP/04/450. STMicroelectronics marking code date CHN G4 chn 509 marking code stmicroelectronics Date Code Marking STMicroelectronics CHN 450 SUMITOMO G700 ablebond 8290 Part Marking STMicroelectronics ST MICROELECTRONICS DATE CODE MARKING

    STMicroelectronics marking code date

    Abstract: Date Code Marking STMicroelectronics ST MICROELECTRONICS DATE CODE MARKING sumitomo crm epoxy Part Marking STMicroelectronics Ablebond 8360 marking code stmicroelectronics ablestik 8360 device Marking STMicroelectronics 1076E
    Text: PRODUCT/PROCESS CHANGE NOTIFICATION PCN MPG-EEP/04/451 FWH AND LPC FAMILY PLCC32 PACKAGE ENVIRONMENTAL FRIENDLY AND ASSEMBLY LOCATION CHANGE 2004/02/12 PCN MPG-EEP/04/451 Product Family /Commercial Product M50FW M50LPW M50FLW Type Of Change Multiple types of changes


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    PDF MPG-EEP/04/451 PLCC32 M50FW M50LPW M50FLW 30-Apr-2004 30-May-2004 STMicroelectronics marking code date Date Code Marking STMicroelectronics ST MICROELECTRONICS DATE CODE MARKING sumitomo crm epoxy Part Marking STMicroelectronics Ablebond 8360 marking code stmicroelectronics ablestik 8360 device Marking STMicroelectronics 1076E