AN-304 NATIONAL Search Results
AN-304 NATIONAL Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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LM4946SQ/NOPB |
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Output Capacitor-Less Audio Subsystem with Programmable National 3D 24-WQFN -40 to 85 |
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LM4546BVH/NOPB |
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AC ''97 Rev 2.1 Codec with Sample Rate Conversion and National 3D Sound 48-LQFP -40 to 85 |
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LM4550BVH/NOPB |
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AC ''97 Rev 2.1 Codec with Sample Rate Conversion and National 3D Sound 48-LQFP -40 to 85 |
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LM4549BVH/NOPB |
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AC ''97 Rev 2.1 Codec with Sample Rate Conversion and National 3D Sound 48-LQFP -40 to 85 |
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LM4550BVHX/NOPB |
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AC ''97 Rev 2.1 Codec with Sample Rate Conversion and National 3D Sound 48-LQFP -40 to 85 |
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AN-304 NATIONAL Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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Contextual Info: * QUINT AND/NAND GATE SYNERGY SY100S304 SEMICONDUCTOR FEATURES DESCRIPTION Max. propagation delay of 1050ps The SY100S 304 is an ultra-fast quint AN D /N AN D gate designed for use in high-perform ance ECL system s. This device also fe a ture s a Function F output which is the w ireNOR of the AND gate outputs. T he inputs on the device |
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SY100S304 1050ps SY100S 75KC1 TDD13B1 SY100S304DC D24-1 SY100S304FC F24-1 | |
F100K
Abstract: SY100S304 SY100S304DC SY100S304FC SY100S304JC
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SY100S304 1050ps of-60mA F100K SY100S304 TD013Ã SY100S304DC D24-1 SY100S304FC F100K SY100S304JC | |
Contextual Info: <o> ai 1m CmC i m w lC m m m •v i 00 S 304 “-.j U I N î AimD' N A N D i j A î E ^JSS W S E M /C O N D U C T O P m ssM FEA TU R E S The SY100S304 is an ultra-fast quint AND/NAND gate designed for use in high-performance ECL systems. This device also features a Function F output which is the wireNOR of the AND gate outputs. The inputs on the device |
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1050ps SY100S304 75Ki2 F10QK 304FC SY100S 304JC D24-1 F24-1 | |
balco 500 ohm resistance vs temperature
Abstract: rosemount 1144 yellow springs thermistors
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18E-4-80
Abstract: payne 18ez control schematic scr controls schematic payne 18D 18E-SW 18EZ-4-450 5299s PAYNE Potentiometer 75K 18D-1-10I 18D-4-80SW2 temperature control schematics payne Model 18D
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PKG.4B.340.LLLM92Z LEMO
Abstract: EGG.2b.655.zzm FGG-4B-304 LEMO 5B560 3B422 GBA.2S.250.FN FGG.3B.310 m300bt FFM.0S.130.LC
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YL 69 moisture
Abstract: lemo HEG 0K M14x1
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Contextual Info: UNIPOLE & MULTIPOLE CONNECTORS No reproduction or use without express permission of editorial or pictorial content, in any manner. LEMO reserve the right at all times to modify and improve specifications without any notification. Printed in Switzerland, 2010 LEMO SA |
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lemo HEG 0K
Abstract: LEMO FGG.2B LEMO fvb.00 LEMO MIL-C-22520/1-01 LEMO EGG.2B lemo FGG.4K lemo connector LEMO FGG.0B lemo FGG.0K
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lemo connectors
Abstract: FGG.1B.556.ZZC GCA.1S.255.LT O RING 010 75 FKM VITON lemo FGG.0K LEMO FGG.1B.306 IEC 60093 EXP.1S.304.HLN LEMO FFA.00 circular connector
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water BALL VALVE
Abstract: BY289 water inlet valve ball valve PN 16 B105-C BALL VALVE
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LEMO FGG.1B
Abstract: LEMO FFA-00 0b303 araldite EPG.00.303 EPL.0S.302.HLN lemo HEG 0K M7x0.5 m12x100 M009
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FGG-4B-304
Abstract: EXG-1B STYCAST Redel Stycast W 67 LEMO GMA.0B.045 bend relief QUADRAX FGG-1B305 3B302 1B556
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Evg 175 DC
Abstract: O RING 010 75 FKM VITON lemo connector lemo FGG.0K LEMO FGG.0B MIL-C-22520/1-01 LEMO hep 154 ECG 3041 LEMO fvb.00
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PCB footprint cqfp 132
Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
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XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 PCB footprint cqfp 132 schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318 | |
footprint jedec MS-026 TQFP 128
Abstract: schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208
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XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208 | |
TEMPILSTIK
Abstract: TEMPILSTIK294F 146C 195 msds TEMPIL
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pwm circuit with lm324
Abstract: hfptr DD107 keyboard to DTMF 840C AN-666 C1995 COP820C LM324
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COP820C 20-3A pwm circuit with lm324 hfptr DD107 keyboard to DTMF 840C AN-666 C1995 LM324 | |
LEMO FFA 1S
Abstract: ffa 2e 675 cta LEMO fvb.00 LEMO EGG.2B LEMO LEMO FGG.1B LEMO FGG.2B flat gasket viton Amphenol HV STYCAST 2850
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LEMO fvb.00
Abstract: LEMO FGG.1B LEMO LEMO FGG.4B LEMO 2B.319 lemo HEG 0K LEMO EGG.2B LEMO connector fvb socket LEMO connector esg LEMO FGG.0B
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zzm amphenolContextual Info: LEMO’s Environmentally Sealed Connectors K Series - Mechanical Keying E Series - Hermaphroditic Keying 2005 Expect Success. Spec LEMO. A Global Leader Since its beginning in Switzerland in 1946, LEMO® has evolved into a worldwide leader in the design and manufacture of circular connectors, with products sold |
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CKE0305 zzm amphenol | |
Contextual Info: Bi-Metal Thermometers Rugged and Reliable The all metal construction, except for the optically clear crystal of DiaITemp thermometers and their heliarc welded fabrication make them virtually unbreakable. The type 304 Stainless Steel stems offer exceptional protection against |
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CAM023Contextual Info: 物位开关LBFS 特点 接液部件采用不锈钢材和PEEK 紧凑设计 高精度开关点(无需校准) 介质温度-40 .115 °C 可测量DK值>1.5的介质 适用于介质分离 可通过FlexProgrammer 9701调节 |
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AISI304æ AISI316Læ PFOFSI3-B25100-ALG-LSï EN/121122 CAM023 | |
PE-65351
Abstract: PE-65340 pe-64952 PE-65835 PE65351 PE-65388 PE-68862 ST5069 ST5201 PE-65612
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PE-64995 PE-65495 PE-64999 MTC2072, MTC20172 PE-65795/T5007 LP/ST5069 MTC20276/77 PE-65351 PE-65340 pe-64952 PE-65835 PE65351 PE-65388 PE-68862 ST5069 ST5201 PE-65612 |