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77313-185-34LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 34 Positions |
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77313-185-06LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 06 Positions |
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77313-185-20LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical Header, Through Hole, Double Row, 20 Positions |
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131-8516-21D
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Amphenol Communications Solutions
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Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Left Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate. |
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54111-408031850LF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 3 Positions, 2.54mm (0.100in) Pitch. |
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