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    90Pb 10Sn solder paste

    Abstract: underfill with or without underfill Flip Chip Substrate nitto chip
    Text: APPLICATION NOTE Solder bumped ICs AN01028 Philips Semiconductors Application information Solder bumped ICs AN01028  Koninklijke Philips Electronics N.V. 2001 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright


    Original     		AN01028 SCA73 853503/01/pp20 90Pb 10Sn solder paste underfill with or without underfill Flip Chip Substrate nitto chip PDF