AND HEATSINK Search Results

Contextual Info: AN10376 Philips Semiconductors Mounting and soldering recommendations for CATV modules 1. Introduction This document deals with the mounting and soldering of CATV modules. 2. Mounting and soldering recommendations 2.1 Mounting The heatsink surface must be flat, free of burrs and oxidation and be parallel to the

Star Delta Control panel wiring

Abstract: 1A48A RN30 AC51 AC53a star delta wiring RN23 1A48D50
Contextual Info: Solid State Relays 1- and 2 Pole SOLITRON With Integrated Heatsink • AC Solid State Contactor, 1- and 2 poles • Zero switching RN1A for heating and motor applications • Instant-on switching (RN1B) • Rated operational current: 1-pole: 30 A, 50 A and 63 A

NTE5728

Abstract: 7150a
Contextual Info: NTE5728 Powerblock Module Description: The NTE5728 uses high voltage power thyristors/diodes and is electrically isolated from the metal base, allowing common heatsinks and compact assemblies to be built. This device is intended for general purpose applications such as battery chargers, welders and plating equipment and where

AC53a

Abstract: Star Delta Control panel wiring 1A23D50 AC51 5V piezo buzzer 1A48D50 RN1A23A50
Contextual Info: Solid State Relays 1- and 2 Pole SOLITRON With Integrated Heatsink • AC Solid State Contactor, 1- and 2 poles • Zero switching for heating and motor applications • Instant-on switching • Rated operational current 30 A, 50 A and 63 A • Rated operational voltage 230 VAC, 400/480 VAC

18650 charger

Abstract: welder circuit diagram 18650 NTE6232
Contextual Info: NTE6232 Powerblock Module Description: The NTE6232 uses 2 power diodes in series and the semiconductors are electrically isolated from the metal base, allowing common heatsinks and compact assemblies to be built. This device is intended for general purpose applications such as battery chargers, welders and plating equipment

400 watt audio amplifier MOSFET

Abstract: MTK300PL MTK300F star sound audio amplifier circuit diagram TK-300 The Watt Stopper
Contextual Info: MTK SERIES DATASHEETS PRODUCT TYPE: MTK300F 300 WATT MOSFET POWER AMPLIFIER The Prism MTK300F Power Amplifier module is an encapsulated and electronically protected power amplifier module with integral heatsink and five electrical connections. The circuit uses components of the highest quality and is assembled using predominantly

SIL-PAD 1000 TO 247

Abstract: SIL-PAD to-247 A228 SIL-PAD density MA-102-55E
Contextual Info: M Series Heatsinks For TO-264 and TO-247 1.34" 34.1mm 1.52" (38.6mm) Features Ohmite introduces the M series, patented (Pat. No. 7,151,669), high performance, low cost, configurable, scalable and compact heat sink with matrix clip system for TO-247 and TO-264 packages. This powerful heat sink

SIL-PAD 1000 TO 247

Abstract: Tgon 800 SIL-PAD to-264 C1260-40 C126 C264-058 SIL-PAD density TO220 land pattern "Tgon 800" TO220 SMALL heatsink
Contextual Info: HEATSINK C Series TO-126, TO-247, TO-220 and TO-264 Package Heatsinks Ohmite introduces the C series Pat. Pending . This series offers high performance, low cost and a compact heat sink with an integrated camming clip system for TO-126, TO-220, TO-247 and TO-264

Diode LT n5

Contextual Info: Modules GS Series AW Version The GS Series reduces switching noise by use of an improved free-wheeling diode. Features • High speed and low saturation voltage • Low noise due to built-in free-wheeling USFD Ultra Soft and Fast Recovery Diode • Isolated heatsink between terminal and base

Contextual Info: M L 4000 SERIES HIGH CW POWER PLATED HEATSINK PIN AND NIP DIODES This series of PIN and NIP diodes apply our unique plated heat sink PHS process in order to reduce both thermal resistance and series resistance. The reduced series resistance makes the low capacitance versions ideally suited to high

High Voltage Bus-bars

Abstract: Vishay Power resistor LPS600 LPS600 LPS300 DOW 340 lps80 QPAD
Contextual Info: VISHAY SFER NICE Resistive Products Application Note Mounting Instructions and Thermal Considerations 1. HEATSINK SPECIFICATION The mounting area on the heatsink and the bottom of the LPS must be free of particles. Surfaces in contact must be carefully cleaned in order to obtain the maximum thermal conductivity between the component and the heatsink.

MA1012

Abstract: MA-302-55E 6063T5 Tgon 800 MV301 SIL-PAD density a366
Contextual Info: HEATSINK Heatsink with clips for TO-264 and TO-247 F e at u r e s Ohmite introduces the M series, patented Pat. No. 7,151,669 , high performance, low cost, configurable, scalable and compact heat sink with matrix clip system for TO-247 and TO-264 packages. This powerful heat sink provides the easiest assembly, largest

V5592

Abstract: TOP-66 5598 transistor 8617 diode DIN 53505 marking code to3 diode marking J5P SOT TO-126 mounting V7387 8630F
Contextual Info: ASSMANN Die-cast-Heatsinks Electronic C om ponen ts Thermal Conductive Ceramic Pads Technical data Applications: Electro- and electronic-industry i. e. computers, TV sets, VTR, medical equipment, measuring instruments, motor car- and machineindustry, photovoltanie, aviation.

SGS bridge

Abstract: BF3506TV
Contextual Info: BF3506TV FULL 50-60Hz RECTIFICATION BRIDGE MAIN PRODUCT CHARACTERISTICS . . . IF AV 35A VRRM 600V VF (max) 1.3V PRELIMINARY DATASHEET + FEATURES AND BENEFITS - COMPACT ISOTOP DESIGN COMPATIBLE WITH FAST DIODES, TRANSISTORS AND PASSIVE COMPONENTS. EXCELLENT THERMAL TRANSFER JUNCTION TI HEATSINK

D-PAK package

Abstract: D2Pak Package copper heatsink 7106d 7109D dpak code SMH013D SMH008D SO10 SO10 package
Contextual Info: HEATSINKS & MOUNTINGS HEATSINKS, Surface Mount DPAK package D 3PAK package Also covers POWER SO10 and POWER SO20 7106D A surface mount copper heatsink, with solderable finish, designed for use with a single DPAK package. Available loose or taped and reeled.

TK20

Abstract: TN15
Contextual Info: TK/TN Series SPECIFICATIONS Material Resistive element: Thick or thin film chip resistor Terminals: Tin plated copper 100Sn Case: Ryton Heatsink plate: Black anodized aluminum 20 and 15 Watt TO-220 Package Thick and Thin Film 0.394" (10mm) 0.177" (4.5mm)

MB166

Contextual Info: TMB16xS Series Triac Bidirectional Triode Thyristor Features and Benefits Description ▪ Exceptional reliability ▪ Small fully-molded SIP package with heatsink mounting for high thermal dissipation and long life ▪ VDRM of 600 V ▪ 16 ARMS on-state current

CB20S5-50

Abstract: CB20S1-50 3240S
Contextual Info: RF Components CB Series Power Combiners and Splitters Pin-Terminal and Connector Types FEATURES • Designed for medium power applications. • When all terminals are connected to matched loads, no heatsinking is required. However, if the two inputs are largely out

Contextual Info: UltraCap Module 110 F/ 56 V, with heatsink Ordering code: Date: B48621F9115Q024 September 2005 EPCOS AG 2005. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.

TMA86G-L

Contextual Info: TMA86G-L Triac Bidirectional Triode Thyristor Features and Benefits Description ▪ Exceptional reliability ▪ Small SIP package with heatsink mounting for high thermal dissipation and long life ▪ VDRM of 600 V ▪ 8 ARMS on-state current ▪ Uniform switching

Contextual Info: TMB20x Series Triac Bidirectional Triode Thyristor Features and Benefits Description ▪ Exceptional reliability ▪ Small fully-molded SIP package with heatsink mounting for high thermal dissipation and long life ▪ VDRM of 600 V ▪ 20 ARMS on-state current

TMA36G-L

Contextual Info: TMA36G-L Triac Bidirectional Triode Thyristor Features and Benefits Description ▪ Exceptional reliability ▪ Small SIP package with heatsink mounting for high thermal dissipation and long life ▪ VDRM of 600 V ▪ 3 ARMS on-state current ▪ Uniform switching

star sound audio amplifier circuit diagram

Abstract: PSU100 MTK100F mtk 47 k
Contextual Info: prism audio I The full spectrum of sound MTK SERIES DATASHEETS PRODUCT TYPE: MTK1 OOF 100 WATT POWER AMPLIFIER The Prism MTK100F Power Amplifier module is an encapsulated and electronically protected power amplifier module with integral heatsink and five electrical connections.

Contextual Info: TK/TN Series Specifications Material Resistive element: Thick or thin film chip resistor Terminals: Tin plated copper 100Sn Case: Ryton Heatsink plate: Black anodized aluminum 20 and 15 Watt TO-220 Package Thick and Thin Film 0.394" (10mm) 0.177" (4.5mm)