ASSEMBLY FACILITY Search Results

Contextual Info: Vv autoassembly autosplice Assembly Service i Automatic Assembly of Components into PC Boards or Housings Let Autosplice meet your assembly needs and produce your products in our facility. This assembly service is ideal for prototype through volume production.

Contextual Info: FASTECH SYSTEMS GENERAL ASSEMBLY PRACTICES This section describes the assembly of FASTECH connectors. This not only serves to familiarize the reader with connector assembly, but also shows the need for specialized assembly equipment. The following sections describe both mechanical and solder

22SNAP

Abstract: array Opto Sensor Opto 22 OPTO 22 480D45-12 OPTO-22
Contextual Info: RACKS CLASSIC STANDARD DATA SHEET Form 040-010208 Assembly page 1/1 Part Number Description PB4MOA 4-Channel Switch Assembly PB4MOA SWITCH ASSEMBLY-INTRODUCTION The PB4MOA is a four-channel switch assembly that connects directly to the barrier strip of any standard Opto 22 I/O mounting

pneumatic arm

Abstract: hex head screws molykote daily production pa 17105-3608 INTRODUCTION ROLLER BEARING Tyco Electronics Instruction Sheet Crimping 679-3
Contextual Info: Instruction Sheet Pneumatic Head Assembly 408-4070 679304-1 Used with 626 Pneumatic Tooling Assemblies 16 OCT 07 Rev C Quick Pin(S) 354425-1 (Ref) Pneumatic Head Assembly 679304-1 Tool Holder Assembly 189767-1 (Ref) Figure 1 1. INTRODUCTION Pneumatic Head Assembly 679304–1 (shown in

20L-28L

Abstract: Millennium
Contextual Info: Addition of Millennium Microtech, Thailand for PLCC & SOIC Package Assembly Product Change Notice PCN1203 v1.0 January 20, 2012 Overview The purpose of this notification is to announce the addition of Millennium Microtech, Thailand assembly facility for Plastic

arinc 825

Abstract: HI-3113 HI-1573 HI-3583A
Contextual Info: Addition of SPEL Semiconductor, India for QFN, TSSOP & SOIC Package Assembly Product Change Notice PCN1202 v1.0 January 20, 2012 Overview The purpose of this notification is to announce the addition of SPEL Semiconductor, India assembly facility for QFN, TSSOP

TMS320C54x, instruction set

Abstract: TMS320C541 TMS320C542 TMS320C548 TMS320C549 HEX500 EXORCISER motorola
Contextual Info: TMS320C54x Assembly Language Tools User’s Guide 1997 Digital Signal Processing Products Printed in U.S.A., January 1997 SDS SPRU102B User’s Guide TMS320C54x Assembly Language Tools 1997 TMS320C54x Assembly Language Tools User’s Guide Literature Number: SPRU102B

TMS320C54x, instruction set

Abstract: TMS320C541 TMS320C542 TMS320C548 TMS320C549 EXORCISER
Contextual Info: TMS320C54x Assembly Language Tools User’s Guide 1997 Digital Signal Processing Products Printed in U.S.A., January 1997 2617677-9761 revision D SPRU102B User’s Guide TMS320C54x Assembly Language Tools 1997 TMS320C54x Assembly Language Tools User’s Guide

DS21S07A

Abstract: 18704
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS21S07A Nov-96 9627 B2 ANAM, PI. DK623631ABA2 0.8µ NITRIDE 20 TSSOP STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C):

9648

Abstract: P-19193
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS21S07A Feb-97 9648 B2 ANAM, PI. DK636057AAB1 0.8µ NITRIDE 20 TSSOP STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C):

HI-3593

Abstract: HI-3717 arinc 825 QR114 QR-1140 HI-3113 HI-8593 HI-6131
Contextual Info: Addition of Greatek Electronic, Taiwan for QFN, TQFP, TSSOP & SOIC Package Assembly Product Change Notice PCN1101 v1.0 December 01, 2011 Overview The purpose of this notification is to announce the addition of Greatek Electronic, Taiwan assembly facility for QFN, TQFP,

18704

Abstract: P-18701
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS21S07A Nov-96 9627 B2 ANAM, PI. DK623631ABA2 0.8µ NITRIDE 20 TSSOP STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C):

19195

Abstract: DS21S07A
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS21S07A Feb-97 9648 B2 ANAM, PI. DK636057AAB1 0.8µ NITRIDE 20 TSSOP STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C):

LA 76810 OR EQUALANT

Abstract: tms320c50 mnemonic description str f 6467 lc 7265 la 4142 STR 6467 Stag Programmers ic 6116 datasheet from texas instruments sti 5202 Intel MCS-86
Contextual Info: TMS320C1x/C2x/C2xx/C5x Assembly Language Tools User’s Guide 1995 Microprocessor Development Systems Printed in U.S.A., March 1995 SDS SPRU018D TMS320C1x/C2x/C2xx/C5x Assembly Language Tools 1995 User’s Guide TMS320C1x/C2x/C2xx/C5x Assembly Language Tools

tms320xx

Abstract: SPRA021 TMS320 TMS320C32 TMX320C40 spru035d
Contextual Info: TMS320C3x/C4x Assembly Language Tools User’s Guide 1998 Digital Signal Processing Solutions Printed in U.S.A., June 1998 SPRU035D TMS320C3x/C4x Assembly Language Tools 1997 User’s Guide TMS320C3x/C4x Assembly Language Tools User’s Guide Literature Number: SPRU035D

transistor manual substitution FREE DOWNLOAD

Abstract: transistor manual substitution CL30 LA 76810 Architecture of TMS320C4X FLOATING POINT PROCESSOR GE Substitution Manual INSTRUCTION SET of TMS320C4X Intel MCS-86 LA 76810 B INTERNAL DATA SPRA021
Contextual Info: TMS320C3x/C4x Assembly Language Tools User’s Guide 1997 Digital Signal Processing Solutions Printed in U.S.A., March 1997 SDS SPRU035C TMS320C3x/C4x Assembly Language Tools 1997 User’s Guide TMS320C3x/C4x Assembly Language Tools User’s Guide Literature Number: SPRU035C

TMS320

Abstract: TMS320C32 sprt125 a32b HEX30
Contextual Info: TMS320C3x/C4x Assembly Language Tools User’s Guide 1997 Digital Signal Processing Products Printed in U.S.A., March 1997 2576328-9761 revision C SPRU035C User’s Guide TMS320C3x/C4x Assembly Language Tools 1997 TMS320C3x/C4x Assembly Language Tools User’s Guide

TMS320

Abstract: TMS320C32 Tektronix asg 100 HEX30 Intel MCS-86
Contextual Info: TMS320C3x/C4x Assembly Language Tools User’s Guide 1997 Digital Signal Processing Products Printed in U.S.A., March 1997 2576328-9761 revision C SPRU035C User’s Guide TMS320C3x/C4x Assembly Language Tools 1997 TMS320C3x/C4x Assembly Language Tools User’s Guide

DSPHEX

Abstract: SPRU011 SPRU014 SPRU018D SPRU052 TMS320 TMS320C1x TMS320C5X assembler
Contextual Info: TMS320C1x/C2x/C2xx/C5x Assembly Language Tools User’s Guide 1995 Microprocessor Development Systems Printed in U.S.A., March 1995 SDS SPRU018D User’s Guide TMS320C1x/C2x/C2xx/C5x Assembly Language Tools 1995 TMS320C1x/C2x/C2xx/C5x Assembly Language Tools

tms320c26bfn

Abstract: transistor manual substitution FREE DOWNLOAD instruction set tms320c50 lc 7265 tms320c50 mnemonic description MAKING CODE A00A MCS 4040 sti 5202 6E20 a00a
Contextual Info: TMS320C1x/C2x/C2xx/C5x Assembly Language Tools User’s Guide 1995 Microprocessor Development Systems Printed in U.S.A., March 1995 SDS SPRU018D TMS320C1x/C2x/C2xx/C5x Assembly Language Tools 1995 User’s Guide TMS320C1x/C2x/C2xx/C5x Assembly Language Tools

P-18354

Abstract: p18354 0228
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2502 Sep-96 9635 A6 CARSEM DM624784AUA1 1.2µ OX/NI EPROM 08 SOIC 150 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C):

DS21S07A

Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS21S07A Aug-97 9720 B2 CARSEM DM709276AAA 0.8µ NITRIDE 20 TSSOP STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase

Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2107A Jan-97 9639 A6 HYUNDAI DL611233ACA1 1.2µ NITRIDE 16 SOIC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase

Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2107A Apr-96 9612 A6 CARSEM DM546248AAA 1.2µ NITRIDE 16 SOIC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase