ASTM D575 Search Results

Contextual Info: L37-3L Low Bleed Thermal Pad Features Low bleed High insulation strength Long term stability Low thermal resistance Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc.

Contextual Info: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE

d412

Contextual Info: TG4040S High Performance Thermal Interface Materials Features Low hardness Naturally tacky Low oil bleed Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc. DDR II Module / DVD Applications / Hand-Set applications etc.

Contextual Info: L37-3L Low Bleed Thermal Pad Features Low bleed High insulation strength Long term stability Low thermal resistance Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc.

Contextual Info: TG2030S Series High Performance Thermal Interface Materials Features Low hardness Naturally tacky Low oil bleed Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc.

Contextual Info: H48-2K Thermal Conductive Pad Features No carrier Low contact thermal impedance Non-Oil Blead High dielectric breakdown voltage Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc.

Contextual Info: H48-2K Thermal Conductive Pad Features No carrier Low contact thermal impedance Non-Oil Blead High dielectric breakdown voltage Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc.

ASTM D5470

Abstract: ASTM D412 ASTM D2240 D2240
Contextual Info: H48-2K Thermal Conductive Pad Features No carrier Low contact thermal impedance Non-Oil Blead High dielectric breakdown voltage Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc.

Contextual Info: H48-2K Thermal Conductive Pad on rolls Features No carrier Low contact thermal impedance Non-Oil Blead High dielectric breakdown voltage Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /

Contextual Info: L37-5S Thermal Conductive Silicone Gel Pad on rolls Features Ultra soft Low Oil Bleeding Low Contact Resistance Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device / Wireless Hub etc.

Contextual Info: Gap Pad 1500S30 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500S30 • Thermal conductivity: 1.3 W/m-K PROPERTY Color • Highly conformable / low hardness Reinforcement Carrier

E1269

Abstract: ADHESIVE GAP PAD SIL-PAD heat capacity ASTM d792 GPVOUS-0.100-AC-0816-NA SIL-PAD D575 SIL-PAD density young D149
Contextual Info: SEL_SP_0906_Chpt1.qxp 10/20/2006 10:19 AM Page 11 Gap Pad VO Ultra Soft Ultra Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO ULTRA SOFT PROPERTY Color • Thermal conductivity: 1.0 W/m-K

Contextual Info: Gap Pad 1500R Thermally Conductive, Reinforced Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500R PROPERTY Color • Thermal conductivity: 1.5 W/m-K • Fiberglass reinforced for puncture, shear and tear resistance • Easy release construction

ASTM D374

Abstract: 1500S30
Contextual Info: Gap Pad 1500S30 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500S30 • Thermal conductivity: 1.3 W/m-K • Highly conformable / low hardness PROPERTY Color IMPERIAL VALUE

Contextual Info: Introducing RMW Rugged, medium wall RMW tubing is specifically designed for use in a broad range of low-voltage applications. RMW is tough and flexible, making it particularly suited for the insulation and protection of cable joints in low voltage electrical systems as well as for cable repair. Uncoated RMW provides insulation

ASTM d792

Abstract: astm D150 conductivity meter circuit for second tear C351 D149 D150 D2240 D257 D374
Contextual Info: Gap Pad 1500R Thermally Conductive, Reinforced Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500R • Thermal conductivity = 1.5 W/mK • Fiberglass reinforced for puncture, shear and tear resistance • Easy release construction

Contextual Info: Gap Pad 5000S35 High thermal conductivity plus “S-Class” softness and conformability Features and Benefits • High thermal conductivity: 5 W/m-K • Highly conformable,“S-Class” softness TYPICAL PROPERTIES OF GAP PAD 5000S35 PROPERTY Color IMPERIAL VALUE

Contextual Info: Gap Pad 1500R Thermally Conductive, Reinforced Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500R PROPERTY Color • Thermal conductivity: 1.5 W/m-K • Fiberglass reinforced for puncture, shear and tear resistance • Easy release construction

a3000

Contextual Info: Gap Pad A3000 Thermally Conductive, Reinforced Gap Filling Material Features and Benefits • Thermal conductivity: 2.6 W/m-K • Fiberglass reinforced for puncture, shear and tear resistance • Reduced tack on one side to aid in application assembly • Electrically isolating

Contextual Info: Gap Pad VO Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO • Thermal conductivity: 0.8 W/m-K • Enhanced puncture, shear and tear resistance • Conformable gap filling material • Electrically isolating

Contextual Info: Gap Pad HC1000 “Gel-Like” Modulus Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD HC1000 PROPERTY Color • Thermal conductivity: 1.0 W/m-K • Highly conformable, low hardness • “Gel-like” modulus • Fiberglass reinforced for puncture,

Contextual Info: Gap Pad 1500 Thermally Conductive, Un-Reinforced Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500 PROPERTY Color • Thermal conductivity: 1.5 W/m-K • Un-reinforced construction for additional compliancy • Conformable, low hardness

Contextual Info: Gap Pad A2000 High Performance,Thermally Conductive Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD A2000 PROPERTY Color • Thermal conductivity: 2.0 W/m-K • Fiberglass reinforced for puncture, shear and tear resistance • Electrically isolating

Contextual Info: Gap Pad 2000S40 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2000S40 PROPERTY Color • Thermal conductivity: 2.0 W/m-K • Low “S-Class” thermal resistance at very