B14-10 B87 Search Results

Contextual Info: T&B Catalog Number: UPC Number: Description: B14-10 Status: Active 78621080324 Non-Insulated Ring Terminal For Wire Range 18-14 Stud Size #10, Metallic WEB_USE -US Cutsheet PDF Catalog Link Features - These non-insulated ring terminals are made of electrolytic copper

Burndy penetrox Electric Joint Compound MSds

Abstract: Burndy penetrox E electric Joint Compound MSds ASTM A46 Burndy penetrox A Burndy penetrox Bolt Torque M32 Penetrox A Electric Joint Compound PENA13 brahma 458 A312H
Contextual Info: BURNDY Reference TABLE OF CONTENTS Introduction Compact ACSR Cable . . . . . . . . . . . . . O-15 Basic Connection Principles . . . . . . . . . . . . O-2 ACSR/TW Cable Trap Wire . . . O-15 - O-16 Hardware Data AAC/TW Cable (All Aluminum Trap Wire) . . . . . . . . . O-16

SN74LVC8T245

Abstract: 10Kohm 33OHM R58 B48 DD10 DD11 DD12 DD15 N-7075 NC7S04M5X
Contextual Info: 6 DMARQ3 DMACK_N 5 EXTINT3 INTRQ 4 obsolete P1 PCI edge connector should have v-cut to make insertion in PCI connector easier. B14 B15 B16 B17 B18 B19 B20 B21 B22 B23 B24 B25 B26 B27 B28 B29 B30 B31 B32 B33 B34 B35 B36 B37 B38 B39 B40 B41 B42 B43 B44 B45 B46

D1N916

Abstract: la1 d22 a65 d1n916a EPM 205 thermal printer controller jeida v4.1 GD75232SOP virge GD75232S txc 14.318MHZ GD 75232 DATASHEET
Contextual Info: Point of Sale Terminal Design Guide Application Note May 1998 Order Number: 273170-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability

81A8

Abstract: 7C68 11PROGRAMMING AN2106 b123 diode code B124
Contextual Info: AN2106 APPLICATION NOTE How to Program and Personalize the XRA00 ePC Global Class 1b Memory Chip This Application Note explains how to program a valid 96-bit ePC code to Class 1b Radio Frequency Identification RFID tags based on the STMicroelectronics XRA00 UHF ePC Global Class 1b memory chip.

GP014

Abstract: LTC1117 74LCT14 a39 diode GAD4 -GAD3 HCT A33 LGS260-DO b141 sa2 la R1556 hct 123 e
Contextual Info: A B C D 4 5. A20M#, INIT, SLP, IGNNE NMI,INTR, STPCLK# and SMI are now pulled up to VCC_CMOS. 6. A20M#, INIT, SLP, IGNNE NMI,INTR, STPCLK# and SMI have series resistors and 680 ohm pullups from 2.7K pullups. 7. Removed Pullup on FERR#. Processor assembly or interposer

PAD61

Abstract: CAP0805 GND12 PAD35 GND-10 5v1 ct led par64 74LVC04 PAD49 ad09
Contextual Info: A B C D E F G H 1 1 2 2 PCI {02,03,04,05} +5V +5V +3V 5V {02,03,04} +3V 5V {02,03,04} +3V +3V +3V +3V 3 3 PCI BUS0 +12V CONNPCI_64 3.3V B1 PTCK B2 B3 B4 B5 B6 4 INTB# {02,03,05} B9 C9 1 TDO +5V3 +5V4 B11 PRSNT1 PAD17 B32 PC/BE2# B33 PTMS B34 PTDI PIRDY# B35

CMX865

Abstract: CMX865D2 transistor b1412 PLC coupling transformer midcom 82111 DTMF encoder 1N4004 CM7291 fsk dtmf circuit diagram "FSK modulator"
Contextual Info: CML Microcircuits COMMUNICATION SEMICONDUCTORS CMX865 FSK Modem and DTMF Codec D/865/3 November 2005 Provisional Issue Features Applications • V.23 1200/75, 1200/1200, 75, 1200 bps FSK • Wireless Local Loops • Bell 202 1200/150, 1200/1200, 150, 1200 bps FSK

zener DIODE A112

Abstract: ZENER A29 B26 ZENER DIODE zener Diode B23 diode ZENER A26 2A3 zener diode a37 zener b37 zener B23 ZENER DIODE ZENER A26
Contextual Info: A B C D E 440LX CUSTOMER REFERENCE DESIGN 4 PAGE TITLE 3 2 THESE SCHEMATICS ARE PROVIDED "AS IS" WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE ARISING OUT OF PROPOSAL, SCHEMATIC OR SAMPLE.

Contextual Info: CML Microcircuits COMMUNICATION SEMICONDUCTORS CMX865 FSK Modem and DTMF Codec D/865/3 November 2005 Provisional Issue Features Applications  V.23 1200/75, 1200/1200, 75, 1200 bps FSK  Wireless Local Loops  Bell 202 1200/150, 1200/1200, 150, 1200 bps FSK

au38

Abstract: ae38 diode ae38 Aj36 G37 IC AJ-38 satellite a75 AH36 n38 transistor MB2198-10
Contextual Info: FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-71060-1E DSU-FR EMULATOR LQFP-64P HEADER TYPE 2 MB2198-304 OPERATION MANUAL PREFACE Thank you for purchasing the LQFP-64P*1 header type 2 MB2198-304 for the DSU-FR emulator. This product is used together with the BGA-660P adapter for the DSU-FR emulator (MB2198300)*2 to connect the DSU-FR emulator (MB2198-01)*3 and DSU-FR cable (MB2198-10)*4 to a

AD 149 AE9

Abstract: transistor pnp a111 transistor pnp a110 a106 capacitor CD110 capacitor CD100 transistor hd a101 pin configuration 74hct14 not gate dated sheet SOT-23 la22 ON B34
Contextual Info: A B C D E 440LX DUAL PROCESSOR 4 PAGE TITLE 3 2 THESE SCHEMATICS ARE PROVIDED "AS IS" WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE ARISING OUT OF PROPOSAL, SCHEMATICS OR SAMPLE.

marking B43 diode SCHOTTKY

Abstract: mosfet a06 marking B26 diode SCHOTTKY marking B34 diode SCHOTTKY LGS260-DO DIODE B93 950554-00x marking B47 diode SCHOTTKY diode marking j35 be1 marking diode
Contextual Info: 5 4 3 2 1 Evaluation Platform System Electronic s Board D D Revision D THIS SCHEMATIC IS PROVIDED "AS IS" WITH NO WARRANTIES WHATSOEVER,NCLUDING I ANY WARRANTY OF MERCHANTABILITY, FITNESS FOR ANY PARTICULAR PURPOSE , OR ANY WARRANTY OTHERWISE ARISING OUT OF PROPOSAL, SPECIFICATION OR

Contextual Info: CMX865A Telecom Signalling Device D/865A/5 May 2012 CMX865A – DTMF CODEC AND TELECOM SIGNALLING COMBO Features Applications • V.23 1200/75, 1200/1200, 75, 1200 bps FSK  Wireless Local Loops  Bell 202 1200/150, 1200/1200, 150, 1200 bps FSK  SMS Phones

optocoupler B119

Abstract: cmx869 CMX869A D869 PLC modem 1N4004 CMX869D2 IN4148 PS2701-1
Contextual Info: CMX869 CML Microcircuits Low Power V.32 bis Modem COMMUNICATION SEMICONDUCTORS D/869/4 July 2004 Provisional Issue Features Applications • V.32 bis/V.32/V.22 bis/V.22 automodem. 14400, • Telephone Telemetry Systems 12000, 9600, 7200, 4800, 2400, 1200 bps duplex

CMX865AD4

Abstract: CMX865A CMX865AE4 design of wireless data modem using fsk modulation bell 100n CMX865 AUDIO RECORDER with plc microphone ag1170
Contextual Info: CMX865A Telecom Signalling Device D/865A/5 May 2012 CMX865A – DTMF CODEC AND TELECOM SIGNALLING COMBO Features Applications • V.23 1200/75, 1200/1200, 75, 1200 bps FSK  Wireless Local Loops  Bell 202 1200/150, 1200/1200, 150, 1200 bps FSK  SMS Phones

B-701

Abstract: a69 156
Contextual Info: 64MB RIMMTM Module with 128/144Mb RDRAMs Direct Rambus RIMM™ Memory Module Specification GENERAL DESCRIPTION This document outlines specifications for HCD’s Direct Rambus RIMM Module which consists of 128Mb / 144Mb Direct Rambus DRAM devices. HCD supports applications with 600, 700 and 800 MHz speed grades in both ECC and nonECC modules.

HR256E16B

Abstract: HR256E16C HR256E16D HR256E16E HR256N16B HR256N16C HR256N16D HR256N16E
Contextual Info: 256MB RIMMTM Module with 128/144 Mb RDRAMs Direct Rambus RIMM™ Memory Module Specification GENERAL DESCRIPTION This document outlines specifications for HCD’s Direct Rambus RIMM Module which consists of 128Mb / 144Mb Direct Rambus DRAM devices. HCD supports applications with 600, 700 and 800 MHz speed grades in both ECC and nonECC modules.

I82559ER

Abstract: PTC1111 T2D19 CAPT3216 14C431 PM66EN sad48 CAPT7343 CAP1206 C101
Contextual Info: A B C D E F G H 1 1 80312/Coyanosa DECOUPLING SPCI DECOUPLING IC DECOUPLING +3V +3V SDRAM DECOUPLING +3V +3V +3V +3V +5V +3V +5V C68 1 2 C139 1 2 C61 1 2 C161 1 2 2 4 5 CAP0805 0.1uF C154 2 1 CAP0805 0.1uF C117 2 1 CAP0805 0.1uF C22 2 1 CAP0805 0.1uF C12 2 1

32 QAM Transmitter block diagram

Abstract: NEC 24 pin uP
Contextual Info: CMX869 CML Microcircuits Low Power V.32 bis Modem COMMUNICATION SEMICONDUCTORS D/869/1 January 2003 Advance Information Features Applications • V.32 bis/V.32/V.22 bis/V.22 automodem. 14400, • Telephone Telemetry Systems 12000, 9600, 7200, 4800, 2400, 1200 bps duplex

siemens a55

Abstract: siemens A70 marking b28 siemens a57 siemens b38
Contextual Info: HYR16xx30/HYR18xx20G Rambus RIMM Modules Direct RDRAM RIMM Modules with 128/144 Mb RDRAMs Perliminary Information Rev. 0.9 Overview Form Factor The Direct Rambus RIMM™ module is a general purpose high-performance memory subsystem suitable for use in a broad range of applications including

A35 equivalent

Abstract: tp084 74AS07 TP096 IC 74HC112 FDC37C932 CRYSTAL 14.318MHZ processor pentium 1 82443BX CK100
Contextual Info: A B C D E Intel 100 MHz Pentium tm II processor/440BX AGPset Uniprocessor Customer Reference Schematics 4 Revision 1.0 4 * Please note that these schematics are subject to change. PAGE TITLE 3 2 1 COVER SHEET 1 BLOCK DIAGRAM 2 SLOT 1 CONNECTOR 3,4 CLOCK SYNTHESIZER

c151A

Abstract: C273A C342A r133a C327A R227A C337A c347a BC147A C352A
Contextual Info: A INTEL PENTIUM® II/PENTIUM® III PROCESSOR SC242 / INTEL 810e CHIPSET UNIPROCESSOR CUSTOMER REFERENCE SCHEMATICS REVISION 1.0 Title A Page Cover Sheet 1 Block Diagram SC242 Connector 2 Clock Synthesizer 5 82810e Display Cache 6, 7, 8 9 System Memory

ld33 smd

Abstract: SMD LD33 193A920390 LM78L05 TO92 STS-B5 l117l head3x2 parallel port db25 USB5X2-254DV RXD485
Contextual Info: E D 4 C VCC VCC B A 4 VCC_AUDIO SOM1A PCICLK3 19 PCICLK1 20 19 PCIREQ#3 PCIGNT#2 PCIREQ#2 PCIREQ#1 PCIGNT#0 AD0 AD1 AD4 AD6 19,20 C/BE#0 AD8 AD10 AD11 AD12 AD13 AD14 AD15 3 19,20 C/BE#1 19,20 19,20 19,20 19,20 19,20 19,20 19,20 PAR PERR# PME# LOCK# TRDY# IRDY#