B352F110T30 Search Results

710 opto coupler

Abstract: D496 D505 W1696
Contextual Info: B352F110T30 BCMTM Bus Converter • 352 V to 11 V V•I ChipTM Converter • Typical efficiency 95% • 300 Watt 450 Watt for 1 ms • 125°C operation (TJ) • High density – up to 1036 W/in3 • <1 µs transient response • Small footprint – 260 W/in2

Contextual Info: B352F110T30 BCMTM Bus Converter Module • 352 V to 11 V V•I ChipTM Converter • Typical efficiency 95% • 300 Watt 450 Watt for 1 ms • 125°C operation • High density – up to 1036 W/in3 • <1 µs transient response • Small footprint – 260 W/in2

Contextual Info: B352F110T30 BCMTM Bus Converter • 352 V to 11 V V•I ChipTM Converter • Typical efficiency 95% • 300 Watt 450 Watt for 1 ms • 125°C operation • High density – up to 1036 W/in3 • <1 µs transient response • Small footprint – 260 W/in2

D496

Abstract: D505
Contextual Info: B352F110T30 BCMTM Bus Converter • 352 V to 11 V V•I ChipTM Converter • Typical efficiency 95% • 300 Watt 450 Watt for 1 ms • 125°C operation (TJ) • High density – up to 1017 W/in3 • <1 µs transient response • Small footprint – 260 W/in2

Contextual Info: PRELIMINARY V•I Chip Bus Converter Module B352F110T30 BCM V•I Chip – BCM Bus Converter Module TM • 352 V to 11 V V•I Chip Converter • Typical efficiency 95% • 300 Watt 450 Watt for 1 ms • 125°C operation • High density – up to 1095 W/in3

ACCI

Contextual Info: B352F110T30 BCMTM Bus Converter • 352 V to 11 V V•I ChipTM Converter • Typical efficiency 95% • 300 Watt 450 Watt for 1 ms • 125°C operation (TJ) • High density – up to 1036 W/in3 • <1 µs transient response • Small footprint – 260 W/in2

Contextual Info: B352F110T30 BCMTM Bus Converter • 352 V to 11 V V•I ChipTM Converter • Typical efficiency 95% • 300 Watt 450 Watt for 1 ms • 125°C operation (TJ) • High density – up to 1036 W/in3 • <1 µs transient response • Small footprint – 260 W/in2

D496

Abstract: D505
Contextual Info: B352F110T30 BCMTM Bus Converter • 352 V to 11 V V•I ChipTM Converter • Typical efficiency 95% • 300 Watt 450 Watt for 1 ms • 125°C operation (TJ) • High density – up to 1017 W/in3 • <1 µs transient response • Small footprint – 260 W/in2

Contextual Info: PRELIMINARY V•I Chip Bus Converter Module B352F110T30 BCM V•I Chip – BCM Bus Converter Module TM • 352 V to 11 V V•I Chip Converter • Typical efficiency 95% • 300 Watt 450 Watt for 1 ms • 125°C operation • High density – up to 1095 W/in3

Contextual Info: Not Recommended for New Designs - BCM352x110T300B00 Recommended B352F110T30 BCMTM Bus Converter • 352 V to 11 V V•I ChipTM Converter • Typical efficiency 95% • 300 Watt 450 Watt for 1 ms • 125°C operation (TJ) • High density – up to 1017 W/in3

Contextual Info: V•I Chip Bus Converter Module B352F110T30 BCM V•I Chip – BCM Bus Converter Module TM • 352 V to 11 V V•I Chip Converter • Typical efficiency 95% • 300 Watt 450 Watt for 1 ms • 125°C operation • High density – up to 1036 W/in3 • <1 µs transient response

Contextual Info: B352F110T30 BCMTM Bus Converter Module • 352 V to 11 V V•I ChipTM Converter • Typical efficiency 95% • 300 Watt 450 Watt for 1 ms • 125°C operation • High density – up to 1036 W/in3 • <1 µs transient response • Small footprint – 260 W/in2

Contextual Info: EU Declaration of Conformity Vicor Corporation 25 Frontage Road Andover, MA 01810 USA Declare under sole responsibility that the VI Chip High Voltage BCM Models: B384F120T30, B352F110T30, VIZ0002 DC-DC Component Power Supply designed for Building-In, to which this declaration relates, meets the essential health and safety

BCM reflow

Contextual Info: V•I Chip Bus Converter Module B352F110T30 BCM V•I Chip – BCM Bus Converter Module TM • 352 V to 11 V V•I Chip Converter • Typical efficiency 95% • 300 Watt 450 Watt for 1 ms • 125°C operation • High density – up to 1036 W/in3 • <1 µs transient response

Contextual Info: APPLICATION NOTE | AN:016 Using BCM Bus Converters in High Power Arrays Paul Yeaman Director, VI Chip® Application Engineering Februrary 2011 Contents Page Introduction Introduction 1 This application note provides methods and guidelines for designing BCM® bus

VIZ0002

Abstract: VIZ00 vicor MA01810 BCM reflow VIZ0033 B048F120T20 VTM 48 B048F030M21 B048F030T21 B048F060M24
Contextual Info: Product Change Notice Notice: #100118 update to PCN #090804 Date: January 18, 2010 To Our Valued Customers: We appreciate your use of V•I Chip products. Our commitment to customer satisfaction is demonstrated by our notification to you of a product enhancement.

Contextual Info: Application Note AN:016 Using BCM Bus Converters in High Power Arrays By Paul Yeaman Manager, V•I Chip Applications Introduction Contents Page Introduction 1 Theory 1 Design 1 Symmetrical Input / 2 Output Impedances ROUT Matching 2 Uniform Cooling 2 Arrays Powered

Contextual Info: 6,6 0.26 V•I Chip BCM B u s C o n v e rt e r M o d u l e s TM • E ff i c i e n c y : u p t o 9 7 % –In +In PC RSV TM 22,0 0.87 • Cur r e n t s h a r i n g : 5 % • Input: 48 V and HV 350 / 380 V • Power Density: >1000 W/in BCM • Isolation: 2,250 Vdc

Contextual Info: 6,6 0.26 V•I晶片 BCM 48V 母线转换模块 TM –In +In PC RSV TM ·均流精度 : 5% ·隔离 : 2,250Vdc ·引脚 : 1.1in 2 ·高效率 : 达97% ·输入 : 48V及高压350 /380V ·功率密度 : >1000W/ in 3 BCM ™ 22,0 0.87 S RoHS C NRTL US U.S. & FOREIGN PATS. AND PATS. PENDING. MADE IN U.S.A.

B384

Abstract: D505 VIC 945 B352 B352F110T24 B384F120T30 D496 B-384
Contextual Info: 6,6 0.26 V•I Chip BCM HV Bus Converter TM TM • Efficiency: up to 95% –In +In PC RSV TM VICOR CORP. MADE IN USA BCM ™ • Current sharing: 5% 22,0 0.87 S RoHS • Input: HV 350 / 380 V C • Isolation: 4,242 Vdc 3 • Power Density: >1000 W/in NRTL

VIC 945

Abstract: B048F030T21 B048F040T20 B048F060T24 B048F080T24 B048F096T24 B048F120T30 B048F160T24 B048F480T30
Contextual Info: 6,6 0.26 V•I Chip BCM Bus Converter TM TM –In +In PC RSV TM VICOR CORP. MADE IN USA • Efficiency: up to 96% BCM ™ • Current sharing: 5% 22,0 0.87 S RoHS • Input: 48 V and HV 350 / 380 V C • Isolation: 2,250 Vdc 3 –Out 2 • Power Density: >1000 W/in

Contextual Info: Application Note AN:016 Using BCM Bus Converters in High Power Arrays By Paul Yeaman Manager, V•I Chip Applications Introduction Contents Page Introduction 1 Theory 1 Design 1 Symmetrical Input / 2 Output Impedances ROUT Matching 2 Uniform Cooling 2 Arrays Powered

VIZ0002

Abstract: VIZ00 VIZ0020 BCM reflow V048F240M012 VIZ0032 B384F120T30 MV036F240M005 VTM 48 020C
Contextual Info: Product Notice Notice: #090804 Date: August 4th 2009 To Our Valued Customers: We appreciate your use of V•I Chip products. Our commitment to customer satisfaction is demonstrated by our notification to you of a product enhancement. Description: Today, all surface-mount J-lead V•I Chip products are qualified and specified for reflow

B384F120T30

Contextual Info: Application Note AN:016 バスコンバータBCM の並列運転 By Paul Yeaman Manager, V• I Chip Applications はじめに 目次 Page はじめに 1 理論 1 設計 1 入出力インピーダン 2 スの均整 ROUTマッチング 2 均一冷却