BA37 DIODE Search Results

Contextual Info: BA37-933 Diodes Single-Phase Full-Wave Bridge Rectifier Military/High-RelN I O Max.(A) Output Current25 @Temp (øC) (Test Condition) V(RRM)(V) Rep.Pk.Rev. Voltage100 I(FSM) Max.(A) Pk.Fwd.Sur.Cur.300 V(FM) Max.(V) Forward Voltage1.1 @I(FM) (A) (Test Condition)13

TL3301EP100QG

Abstract: SI570BAB0000544DG LVCMOS18 XC7VX690T-2FFG1761C M/SI570BAB0000544DG 0b1010001
Contextual Info: VC709 Evaluation Board for the Virtex-7 FPGA User Guide UG887 v1.3 April 30, 2014 The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL

PTD08D021W

Abstract: MT8JTF12864HZ-1G6G1 LVCMOS18 M88E1111 ADV7511KSTZ virtex 5 lcd display controller Marvell alaska 88E1111 ba37 diode
Contextual Info: VC707 Evaluation Board for the Virtex-7 FPGA User Guide UG885 v1.4 May 12, 2014 The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL

XQR5VFX130

Abstract: CF1752 XQR5V DIODE BA40 BA5 marking AJ-42 diode Aa42 FF1738 AJ3125 FP1760
Contextual Info: Virtex-5QV FPGA Packaging and Pinout Advance Specification Second Quarter 2009 [optional] UG520 v1.1 September 22, 2010 UG520 (v1.1) September 22, 2010 [optional] Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development

ba4410

Abstract: Samsung MCP Flash Memory SAMSUNG k5 dual diode BA45 BA6511 samsung MCP K5 BA40 BA-36 BA5111 bga221
Contextual Info: K5A3x41YT B A MCP MEMORY Document Title Multi-Chip Package MEMORY 32M Bit (2Mx16) Dual Bank NOR Flash Memory / 4M(256Kx16) Full CMOS SRAM Revision History Revision No. History Draft Date Remark Preliminary 0.0 Initial Draft August 28, 2001 1.0 Final Specification

samsung K5 MCP

Abstract: Flash Memory SAMSUNG k5 SAMSUNG MCP A3380 A3280 ba6411
Contextual Info: K5A3x80YT B A MCP MEMORY Document Title Multi-Chip Package MEMORY 32M Bit (4Mx8/2Mx16) Dual Bank NOR Flash Memory / 8M(1Mx8/512Kx16) Full CMOS SRAM Revision History Revision No. History Draft Date Remark Preliminary 0.0 Initial Draft August 28, 2001 1.0 Final Specification

samsung k5 mcp

Abstract: SAMSUNG MCP A3240 Flash Memory SAMSUNG k5
Contextual Info: K5A3x40YT B A MCP MEMORY Document Title Multi-Chip Package MEMORY 32M Bit (4Mx8/2Mx16) Dual Bank NOR Flash Memory / 4M(512Kx8/256Kx16) Full CMOS SRAM Revision History Revision No. History Draft Date Remark Preliminary 0.0 Initial Draft August 28, 2001 1.0

AM2 Processor Functional Data Sheet

Abstract: data sheet epf10k30 digital clock using logic gates EPF10K100GC503 epf10k50v preset resistor 10k EPF10K10 EPF10K10A EPF10K20 EPF10K30
Contextual Info: FLEX 10K Embedded Programmable Logic Family May 1998, ver. 3.10 Features. Data Sheet • ■ ■ The industryÕs first embedded programmable logic device PLD family, providing system integration in a single device Ð Embedded array for implementing megafunctions, such as

ba37 diode

Abstract: EPF10K10 EPF10K10A EPF10K20 EPF10K30 EPF10K30A EPF10K40 EPF10K50 EPF10K50V 403-pin
Contextual Info: FLEX 10K Embedded Programmable Logic Family May 1998, ver. 3.11 Features. Data Sheet • ■ ■ The industry’s first embedded programmable logic device PLD family, providing system integration in a single device – Embedded array for implementing megafunctions, such as

AM3 Processor Functional Data Sheet

Abstract: bg47 EPF10K20 AM2 Processor Functional Data Sheet EPF10K10 EPF10K10A EPF10K30 EPF10K30A EPF10K40 EPF10K50
Contextual Info: FLEX 10K Embedded Programmable Logic Family October 1998, ver. 3.13 Features. Data Sheet • ■ ■ The industryÕs first embedded programmable logic device PLD family, providing system integration in a single device Ð Embedded array for implementing megafunctions, such as

1T26 DIODE

Abstract: altera flex10k Diode SY 356
Contextual Info: FLEX 10K Embedded Programmable Logic Family May 1883. ver. 3.11 Features. ÖateSheet S8 £8 The industry's first embedded programmable logic device PLD family, providing system integration in a single device Embedded array for implementing megafunctions, such as

Contextual Info: FLEX 10K Embedded Programmable Logic Family Data Sheet May 1998. ver. 3.10 Features. * r*^te industry's first embedded programmable logic device PLD H B family, providing system integration in a single device Embedded array for implementing megafunctions, such as

Contextual Info: ML630 Virtex-6 HXT FPGA Optical Transmission Network Evaluation Board User Guide UG828 v1.0 September 28, 2011 The information disclosed to you hereunder (the "Materials") is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL

Contextual Info: FLEX 10K Includes FLEX 10KA Embedded Programmable Logic Family May 2000, ver. 4.02 Features. Data Sheet • ■ ■ The industry’s first embedded programmable logic device PLD family, providing System-on-a-Programmable-ChipTM integration – Embedded array for implementing megafunctions, such as

a8w transistor

Abstract: 21T-2 1K32
Contextual Info: FLEX 10K Includes F LE X 10KA Embedded Programmable Logic Family May 1999» ver.4 Features. Data Sheet ^ §£ The industry's first em bedded program m able logic device PLD family, providing System -on-a-Program m able-Chip integration Em bedded array for im plem enting m egafunctions, such as

ba37 diode

Abstract: diode aj41 EPF10K20 EPF10K10 EPF10K10A EPF10K30 EPF10K30A EPF10K40 EPF10K50 EPF10K50V
Contextual Info: FLEX 10K Embedded Programmable Logic Family O ctober 1998. ver. 3.13 Features. Data Sheet * H B r*^te industry's first embedded programmable logic device PLD family, providing system integration in a single device Embedded array for implementing megafunctions, such as

Contextual Info: FLEX 10K Embedded Programmable Logic Family May 1998. ver. 3.11 FeatU res Data Sheet • ■ The industry's first embedded programmable logic device PLD family, providing system integration in a single device Embedded array for implementing megafunctions, such as

EPF10K100GC503

Abstract: EPF10K20 EPF10K10 EPF10K10A EPF10K30 EPF10K30A EPF10K40 EPF10K50 EPF10K50V 4 bit microcontroller using vhdl
Contextual Info: FLEX 10K Includes FLEX 10KA Embedded Programmable Logic Family June 1999, ver. 4.01 Features. Data Sheet • ■ ■ The industry’s first embedded programmable logic device PLD family, providing System-on-a-Programmable-ChipTM integration – Embedded array for implementing megafunctions, such as

EPF10K10

Abstract: EPF10K10A EPF10K20 EPF10K30 EPF10K30A EPF10K40 EPF10K50 EPF10K50V
Contextual Info: FLEX 10K Includes FLEX 10KA Embedded Programmable Logic Family May 2000, ver. 4.02 Features. Data Sheet • ■ ■ The industry’s first embedded programmable logic device PLD family, providing System-on-a-Programmable-ChipTM integration – Embedded array for implementing megafunctions, such as

XZ132

Abstract: F10K25 Clock Management with ClockLock & ClockBoost Features White Paper
Contextual Info: FLEX 10K ,u r v Includes R JE X 10 K A Embedded Programmable Logic Family May 1999, ver. 4 Features. Data Sheet • ■ ■ The industry's first embedded programmable logic device PLD family, providing System-on-a-Programmable-Chip integration Embedded array for implementing megafunctions, such as

RT8152B

Abstract: rt8152 G995P1U 95A hall effect sensor UP6111AQDD RT9025 ic AH44 95A sensor hall VSS210 Atheros ar9
Contextual Info: 1 2 3 PCB STACK UP 4 5 6 7 8 BU3 Block Diagram LAYER 1 : TOP LAYER 2 : GND1 LAYER 3 : IN1 A LAYER 4 : GND PENRYN-SFF LAYER 5 : VCC 478P uFCPGA LAYER 6 : IN2 A P3,4 FSB LAYER 7 : GND2 FSB 667/800/1066MHZ DDR SYSTEM MEMORY LAYER 8 : BOT DDRIII-SODIMM1 DDRIII-SODIMM2

WPCE773LA0DG

Abstract: G5285T11U-GP ICS9LPRS365B g31 crb WPCE773LA intel g41 crb Realtek ALC269Q High Definition Audio g41 crb WPCE773LA0DG, ALC269 diode af52
Contextual Info: 5 4 3 JM41 Block Diagram Intel D CLK GEN. 1 Project code: 91.4CQ01.001 PCB P/N : 48.4CQ01.011 REVISION : 08266-1 SYSTEM DC/DC 36 TPS51125 INPUTS OUTPUTS 5V_S5 6A 3D3V_S5(5A) DCBATOUT 5V_AUX_S5 PCB STACKUP 3D3V_AUX_S5 Thermal Sensor CPU TOP L1 S L2 32 EMC2103

WPCE773LA0DG

Abstract: TPS51125 Atheros AR8131 WISTRON power sequence RT8202 Realtek ALC269Q High Definition Audio NDS0610-NL-GP X-14D31818M-35GP Wistron Corporation winbond wpce773la0dg
Contextual Info: 5 4 3 JM41 Block Diagram Intel D CLK GEN. 1 SYSTEM DC/DC Project code: 91.4CQ01.001 PCB P/N : 48.4CQ01.0SA REVISION : 08266-SA 36 TPS51125 INPUTS OUTPUTS 5V_S5 6A 3D3V_S5(5A) DCBATOUT 5V_AUX_S5 PCB STACKUP 3D3V_AUX_S5 Thermal Sensor CPU TOP L1 S L2 32 EMC2103

WPCE773LA0DG

Abstract: gfx E3 diode ST330U2D5VDM-13GP GP 823* DIODE 2gp Transistor GFX DIODE 4gp transistor intel g41 crb jm41 TPS51125
Contextual Info: 5 4 3 CLK GEN. 36 TPS51125 INPUTS OUTPUTS 5V_S5 6A 3D3V_S5(5A) DCBATOUT 5V_AUX_S5 PCB STACKUP 3D3V_AUX_S5 Thermal Sensor TOP L1 S L2 VCC/GND 32 EMC2103 3 L3 S L4 D 37 RT8202 SMSC Penryn SFF ICS9LPRS365B 1 SYSTEM DC/DC Project code: 91.4CQ01.001 PCB P/N : 48.4CQ01.0SA