BARE DIE Search Results

infineon c167 bare die

Abstract: C167CR-LC AN10 AN11 AN12 C166 C167CR SAK-C167CR-LC c167 bare die 4536 timer circuits
Contextual Info: Microcontrollers C166 Family 16-Bit Single-Chip Microcontroller C167CR-LC, Bare Die, Step FA Data Sheet 1999-11 Bare Die Delivery www.infineon.com C167CR-LC Step FA C167CR-LC Revision History: (Bare Die Delivery) 1999-11, Step FA Previous Versions: 10.97

infineon c167 bare die

Abstract: ba 4614 4614 Ba 4164 ram bosch ac drive AN10 AN11 C166 C167CR SAK-C167CR-4RC
Contextual Info: Microcontrollers C166 Family 16-Bit Single-Chip Microcontroller C167CR-xC, Bare Die, Step GA Data Sheet 1999-11 Bare Die Delivery www.infineon.com C167CR-xC Step GA C167CR-xC Revision History: (Bare Die Delivery) 1999-11, Step GA Previous Versions: 1999-11

Contextual Info: V I S H AY I N T E R T E C H N O L O G Y, I N C . OPTOELECTRONICS Bare Die Optoelectronics Bare Die Portfolio Infrared Emitters and Photo Detectors TABLE OF CONTENTS Introduction to Bare

me 4946

Abstract: SAK-C167CR-LC c167 bare die 7313 28 pin integrated circuit BOSCH bosch ac drive AN10 AN11 C167CR-LC
Contextual Info: Microcomputer Components 16-Bit CMOS Single-Chip Microcontroller Bare Die, Step BA C167CR/C167SR-LC Data Sheet 05.97 Bare Die Delivery C167CR-LC/C167SR-LC Revision History: (Bare Die Delivery) Original Version 05.97 Previous Releases: - Page Subjects Controller Area Network (CAN): License of Robert Bosch GmbH

AN-1060

Abstract: Silicon Controlled Rectifier Manual an1060 ultrasonic bond Three bond jedec tray bare die JESD 49
Contextual Info: AN-1060 International Rectifier • 233 Kansas Street, El Segundo, CA 90245 ! USA BARE DIE: HANDLING AND STORAGE By Richard Clark Introduction International Rectifier supply a range of power devices in a variety of packages and in Bare Die form. The Bare Die products are available in a

analog devices die list

Abstract: 54AC245 74ACT04 LM108 LM137K SCAN18373T SCAN18374T SCANPSC100F SCANPSC110F
Contextual Info: N VOLUME NO. 2 1999 BARE DIE USE IS GROWING RAPIDLY CONTENTS he rapid demand for smaller and PAGE 1 Bare Die Use is Growing BARE DIE MEET smaller consumer products is Rapidly pushing designers and manufacQUALITY, RELIABILITY, Page 2 Boundary Scan Assists turers to reassess their selection of comAND PERFORMANCE

FPD63310

Abstract: TFTLCD LMC7532 bare die
Contextual Info: N January 1998 Die Products Business Unit Applications Bare Die/Known Good Die TFT-LCD Panels Applications Bare Die/Known Good Die TFT-LCD Panels 1 7 2 CD 1 CD N 3 4 6 5 www.national.com 1 N January 1998 Die Products Business Unit Applications Bare Die/Known Good Die

MIL-C-17

Abstract: MIL-C17 ethylene polytetrafluoroethylene PUR Foam dacron polyolefin elastomer copolymer Polyvinyl Chloride
Contextual Info: TITLE Materials Abbreviations DOCUMENT No. REV PAGE MATERIALS ABBREVIATIONS - 1 CONDUCTORS & BRAID MATERIALS AL Aluminum BC Bare Copper BeCu Beryllium-Copper Alloy 172 BCCAI Bare Copper Clad Aluminum CCS Bare Copper Clad Steel GS Galvanized Steel HR High Resistance Wire

Selector Guide

Abstract: do-218ab DO218AB
Contextual Info: V i s h ay I n t e r t e c h n o l o g y, I n c . Bare Die Diodes - A Wide Range of Bare Die and Wafer Form Products Small-Signal and Power Diodes Bare Die Products in Several Versions to Accommodate a Wide Variety of Assembly Techniques and Applications TABLE OF CONTENTS

Contextual Info: VISHAY SEMICONDUCTORS www.vishay.com Optical Sensors Application Note Handling IR Emitters and Photo Detector Bare Die By Elena Poklonskaya This application note provides instructions for how to handle and mount IR emitter and photo detector bare die products

rg59

Abstract: 20AWG
Contextual Info: RG59 DIRECT BURIAL WITH 95% COPPER BRAID SKU: 107-2175/DB/BK Construction RG59 Direct Burial, 20AWG Solid Bare Copper Conductor with 95% Bare Copper Braid, CL2, CM, Polythylene Jacket, 1000ft. Conductor Diameter Dielectric Diameter Braid Coverage Gel Filled

RG-219

Contextual Info: IMPEDANCE: 50 OHMS INNER CONDUCTOR INNER CONDUCTOR DIAMETER: MATERIAL: .1 9 5 ” BARE COPPER DIELECTRIC DIAMETER: .6 8 0 ” DIELECTRIC MATERIAL: SOLID POLYETHYLENE NUMBER OF SHIELDS: 1 SHIELD MATERIAL: BARE COPPER OUTER DIAMETER: JACKET MATERIAL: .9 4 5 ”

a04e

Abstract: a027 capacitor A03e a00a 848B AN1066 AN442 MC145003 MC145004 MC14LC5003
Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA MC14LC5003 MC14LC5004 128 Segment LCD Drivers CMOS • • • • • • 52 1 ORDERING INFORMATION MC14LC5003FU MC14LC5004FU MCC14LC5003 MCC14LC5004 QFP QFP BARE DIE BARE DIE FP32 FP31 FP30 FP29 FP28 FP27 FP26 FP25 FP24

Contextual Info: AN10706 Handling bare die Rev. 02 — 10 June 2011 Application note Document information Info Content Keywords bare die, handling, ESD, clean room, mechanical damages, delivery forms, transport conditions, store conditions Abstract This application note is intended for introducing customers in assembly

bare die

Contextual Info: N January 1998 Die Products Business Unit Applications Bare Die/Known Good Die Portable Digital Assistant Applications Bare Die/Known Good Die Portable Digital Assistant 1 2 3 4 5 6 7 8 www.national.com 1 N January 1998 Die Products Business Unit Applications

Contextual Info: DC AXIAL FAN 60x60x1 Omm Housing/Blade: Thermoplastic PBT, UL 94V-0 Insulation Resistance: 10M i2 , 500VDC/min between bare wire and frame Dielectric Strength: 5mA max. 500VAC/min between bare wire and frame O peration Temperature:-20°C~70°C Humkdity 15%-90%RH

Contextual Info: DC AXIAL FAN 40x40x1 Omm Housing/Blade: Thermoplastic PBT, UL94V-0 Insulation Resistance: 10M£2, 500VDC/min between bare wire and frame Dielectric Strength: 5mA max. 500VAC/min between bare wire and frame O peration Temperature: - 10°C~70°C Humidity 35%-85%RH

Contextual Info: DC AXIAL FAN 40x40x1 Omm Housing/Blade: Thermoplastic PBT, UL 94V-0 Insulation Resistance: 10M £2, 500VDC/min between bare wire and frame Dielectric Strength: 5mA max. 500VAC/min between bare wire and frame O peration Temperature:-20°C~70°C Humidity 15%-90%RH

Contextual Info: PASTERNACK ENTERPRISES R G 2 1 7 /U émm mW*. IMPEDANCE: 5 0 OHMS INNER CONDUCTOR DIAMETER: .1 0 6 ” INNER CONDUCTOR MATERIAL: BARE COPPER DIELECTRIC DIAMETER: .3 7 0 ” DIELECTRIC MATERIAL: SOLID POLYETHYLENE NUMBER OF SHIELDS: 2 SHIELD MATERIAL: BARE COPPER

Contextual Info: Ums 6-bit phase shifters A comprehensive family of 6-bit phase shifters from L to X-band: • Outstanding accuracy & speed • Bare die and SMT hermetic & plastic package • Class S for Space applications L-BAND Bare Die / SMT Plastic Package Part Number

Contextual Info: Multi-Chip Module • MCM-L Type PBGA: MBH20000 Series Features • Use of bare die semiconductors (or more compact and lightweight modularization • Use of multilayer printed wiring board • Multiple numbers of bare dies mountable on one JED EC /EIA J standard package.

Contextual Info: DC AXIAL FAN 50x50x1 Omm Housing/Blade: Thermoplastic PBT, UL 94V-0 Insulation Resistance: 10M £2, 500VDC/min between bare wire and frame Dielectric Strength: 5mA max. 500VAC/min between bare wire and frame O peration Temperature:-20°C~70°C Humidity 15%-90%RH

RG218 Cable

Contextual Info: PASTERNACK ENTERPRISES R G 2 1 8 /U IMPEDANCE: 5 0 OHMS INNER CONDUCTOR DIAMETER: .1 9 5 ” INNER CONDUCTOR MATERIAL: BARE COPPER DIELECTRIC DIAMETER: .6 8 0 ” DIELECTRIC MATERIAL: SOLID POLYETHYLENE NUMBER OF SHIELDS: 1 SHIELD MATERIAL: BARE COPPER OUTER DIAMETER:

Contextual Info: DC AXIAL FAN 30x30x1 Omm Housing/Blade: Thermoplastic PBT, UL 94V-0 Insulation Resistance: lO M O , 500VDC/min between bare wire and frame Dielectric Strength: 5mA max. 500VAC/min between bare wire and frame O peration Temperature:-20°C~70°C Humidity 15%-90%RH