BERGQUIST COMPANY Search Results

Contextual Info: Bergquist Standard Configurations Thermal Clad POWER LED IMS® SUBSTRATES Bergquist shortens the design cycle and speeds up your time to market. Thermal Clad substrates offer more flexibility in selecting LED components Bergquist offers a family of standard thermally conductive insulated

FR-4 substrate 1.6mm

Abstract: 803268 R-032 Luxeon I Star LED 803293 Luxeon III Star LED SEOUL 1219 LED 803127
Contextual Info: Bergquist Standard Configurations Thermal Clad POWER LED IMS® SUBSTRATES Bergquist shortens the design cycle and speeds up your time to market. Thermal Clad substrates offer more flexibility in selecting LED components Bergquist offers a family of standard thermally conductive insulated

BERGQUIST

Abstract: touch screen connector rs232 connector cable PS "Touch Screen" Touch Screens touch screen BOARD
Contextual Info: Bergquist Company thermal interface materials, user interface touch screens and membra. Page 1 of 2 Flexibility in Design Technical Specifications Bergquist provides leading-edge solutions to optimize 5-Wire touch screen applications. Electronic Information

X50Y5

Abstract: communication JUMPER Touch screen controller usb rs-232 idc 10 pin to RS232 CABLE
Contextual Info: Bergquist Touch Screen User’s Guide USB, RS-232, & PS/2 TOUCH SCREEN CONTROLLER Set-Up and Use of Bergquist 5-Wire Controller FEATURES • Jumper-selectable RS-232, PS/2 and USB communications options • 5-Wire resistive analog touch screen interface • Jumper selectable regulated, unregulated or

motorola MN transistor

Abstract: FR4 dielectric constant vs temperature AR338
Contextual Info: AR338 METAL-BACKED BOARDS IMPROVE THERMAL PERFORMANCE OF POWER By PCIM Staff With Contributions by Herb Fick/Bergquist Company Al Pshaenich and Dave Hollander/Motorola Semiconductor Scott LindblomTexas Instruments Reprinted from Powerconversion & Intelligent Motion,

comparative tracking index ceramic

Contextual Info: Bergquist Thermal Clad Technical Data HT-07006 HIGH TEMPERATURE DIELECTRIC Benefits • Very low thermal resistance of 0.11°Cin2/W (0.71°Ccm2/W) • High thermal conductivity of 2.2 W/m-K • High temperature applications • Lead-free solder compatible

UL796

Contextual Info: Bergquist Thermal Clad Technical Data HPL-03015 HIGH POWER LIGHTING DIELECTRIC Superior Dielectric Lowers Operating Temperatures Benefits • Very low thermal resistance of 0.02°Cin2/W (0.13°Ccm2/W) • High thermal conductivity of 3.0 W/m-K • High temperature applications

Contextual Info: Bergquist Thermal Clad Technical Data MP-06503 MULTI-PURPOSE DIELECTRIC Benefits • Thermal resistance 0.09°Cin2/W (0.58°Ccm2/W) • Thermal conductivity of 1.3 W/m-K • Multi-Purpose applications • Lead-free solder compatible • Eutectic AuSn compatible

Contextual Info: Bergquist Thermal Clad Technical Data HT-04503 HIGH TEMPERATURE DIELECTRIC Benefits • Very low thermal resistance of 0.05°Cin2/W (0.32°Ccm2/W) • High thermal conductivity of 2.2 W/m-K • High temperature applications • Lead-free solder compatible

2n3055 motorola

Abstract: tip122 tip127 audio amp schematic transistor equivalent book 2sc2238 IR640 transistor motorola 40411 TRANSISTOR REPLACEMENT GUIDE ir431 motorola AN485 C2688 2SA1046
Contextual Info: Index and Cross Reference 1 Selector Guide 2 Data Sheets 3 Surface Mount Package Information and Tape and Reel Specifications 4 Outline Dimensions and Leadform Options 5 Applications Information 6 Thermal Clad is a trademark of the Bergquist Company. Chipscretes, Designers’, Duowatt, EpiBase, PowerBase, PowerTap, SUPERBRIDGES, Surmetric, Switchmode, Thermopad,

BERGQUIST

Abstract: PS "Touch Screen" Touch Screen Overlay touch panel 5 wire usb control board
Contextual Info: Bergquist Touch Screen Installation Instructions & User Guide UNIVERSAL WINDOWS TOUCH SCREEN DRIVER Before You Begin — Driver Installation & Setup As touch screen controllers and drivers become more sophisticated, it is now more important than ever that your system is setup properly.

BERGQUIST LTI-04503

Abstract: BERGQUIST mp-06503 "10 watt led" LTI-04503 ASTM 5470 GAP FILLER TCP-1000 HT-04503 Aluminum Base LED PCB 10 watt L.E.D MP-06503
Contextual Info: Thermal Solutions For Long-Term Reliability Of Power LEDs Thermal Management For LEDApplications S O L U T I O N S G U I D E Bergquist Thermal Solutions Insure Color Consistency And Maximum Lifecycles For Your LEDs. Light Emitting Diodes LEDs have been around for years, primarily

Assmann Electronics v6515

Abstract: Thermagon kluber grease t-pli 210 v6515 kluber T-PLI 200 thermagon FSF52 Thermagon thermal grease T-PLI 210 thermagon
Contextual Info: Application Note from Europe for the World European PowerSemiconductor and Electronics Company Comparison of thermal compounds and heat conducting foils The following information is the result of a comparative investigation of different heat conductive materials in the eupec laboratory. The examined types only represent a small

TRANSISTOR REPLACEMENT GUIDE d882

Abstract: transistor D1876 TRANSISTOR D412 7403-09FR d1876 transistor SIL-PAD 2000 density transistors D1876 SIL-PAD 3223 Sil Pad A2000 0.015 TR-NWT-000930
Contextual Info: Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES,

IPC-4562

Abstract: BERGQUIST mp-06503 ZPMV UL746E RD2018 HT-04503 HT-09009 Bergquist - Thermal Clad HPL Dielectric CML11-006 ASTM 5470 GAP FILLER
Contextual Info: TCDG_Cover_09.09.qxp 9/8/2009 1:43 PM Page 3 Thermal Solutions For Surface Mount Power Applications ThermalClad S E L E C T I O N G U I D E TCDG_Cover_09.09.qxp 9/8/2009 September 2009 1:43 PM Page 4 Thermal Clad®: U.S. Patent 4,810,563 and others. All statements, technical information and recommendations herein are based on tests we believe to be reliable, and

Contextual Info: Hi-Flow 115-AC Fiberglass-Reinforced, Phase Change Thermal Interface Material Features and Benefits • Thermal impedance: 0.37°C-in2/W @25 psi • Can be applied directly to a cold heat sink • One side adhesive-coated to aid in positioning • Fiberglass reinforced

ASTM D374

Abstract: D374 ASTM D5470
Contextual Info: Hi-Flow 225F-AC Reinforced, Phase Change Thermal Interface Material Features and Benefits • Thermal impedance: 0.10°C-in2/W @25 psi • Can be manually or automatically applied to the surfaces of room-temperature heat sinks • Foil reinforced, adhesive-coated

"10 watt led"

Abstract: 10 watt led 10 watt L.E.D FR4 dielectric constant vs temperature parameters of FR4 substrate with dielectric BERGQUIST XB900 imst m/L.E.D Moving Display Board
Contextual Info: Modeling Results - Infinite Heat Sink Thermal Clad MP FR-4 Temperature °C Thermal Clad LTI Temperature (°C) Temperature (°C) > 63.654 > 63.7 > 63.7 53.991 54.025 54.025 44.327 44.35 44.35 34.664 34.675 34.675 < 25 < 25 < 25 FIGURE 6 PACKAGING CONCLUSION

D150 transistor

Abstract: E59150 D149 D150 D2240 D257 D374 QPAD
Contextual Info: Q-Pad 3 Easy to Handle, Greaseless Thermal Interface Features and Benefits • Thermal impedance 2 0.35°C-in /W @50 psi Typical Properties of Q-Pad 3 Property Imperial Value Metric Value Test Method Black Black Visual Color Reinforcement Carrier Fiberglass

ASTM D2240, D412

Abstract: ASTM D412 D1458 D149 D150 D2240 D257 D374 D412 PPK10
Contextual Info: Poly-Pad K-10 Polyester-Based,Thermally Conductive Insulation Material Features and Benefits • Thermal impedance: 0.60°C-in2/W @50 psi • Polyester based • For applications requiring non-silicone conformal coatings • Designed for silicone-sensitive applications

1500ST

Abstract: D1458 bergquist D149 D150 D2240 D257 D374 D412 ASTM D5470
Contextual Info: Sil-Pad 1500ST Electrically Insulating,Thermally Conductive, Soft Tack Elastomeric Material Features and Benefits • Thermal impedance: 0.23°C-in2/W @50 psi • Naturally tacky on both sides • Pad is repositionable • Excellent thermal performance

ASTM D2240, D412

Abstract: ASTM D412 ASTM D5470 d1458 D2240 D257 D374 D412 D149 D150
Contextual Info: Poly-Pad K-10 Polyester Based Thermally Conductive Insulation Material Features and Benefits • Thermal impedance 2 0.60°C-in /W @50 psi Typical Properties of Poly-Pad K-10 Property Imperial Value Metric Value Test Method Color Yellow Yellow Visual

Contextual Info: Hi-Flow 225FT Reworkable,Pressure Sensitive Phase Change Material Features and Benefits T YPICAL PROPERT IES OF H I-FLOW 225FT PROPERTY • Thermal impedance: 0.10°C-in 2/W @25 psi • Reworkable pressure sensitive • Tabbed parts for easy application

Contextual Info: Hi-Flow 330P Electrically Insulating,High Performance,Thermally Conductive Phase Change Material Features and Benefits T YPICAL PROPERT IES OF H I-FLOW 330P • Thermal impedance: 0.18°C-in 2/W @25 psi • Natural tack for ease of assembly • Exceptional thermal performance in an