BGA 100 PACKAGE FOOTPRINT Search Results

WMP100

Abstract: sim 300 processor gsm modem datasheet sim 300 processor datasheet for gsm modem wavecom WMP100 sim 300 processor gsm modem wavecom wmp50 sim 300 processor gsm modem for project wavecom WMP150 WMP150 sim 300 processor for gsm modem
Contextual Info: Smart wireless. Smart business. Wireless Microprocessor WMP 50/100/500 Smart Devices Creative Software Services Wireless Microprocessor® The Wireless Microprocessor® is a certified processing and radio solution in a BGA package designed for GSM/GPRS cellular communication in the M2M

Contextual Info: Table of Contents Table of Contents BGA Socketing Systems Designed for use with Ball Grid Array BGA , Land Grid Array (LGA), and Chip Scale Package (CSP) devices in development, test and production applications. Over 900 footprints available online in our searchable BGA Socket Finder database at www.bgasockets.com.

B4C1

Contextual Info: Rev 3; 5/06 DS2030Y/AB Single-Piece 256kb Nonvolatile SRAM Features 27mm2 ♦ Single-Piece, Reflowable, PBGA Package Footprint ♦ Internal ML Battery and Charger ♦ Unconditionally Write-Protects SRAM when VCC is Out-of-Tolerance ♦ Automatically Switches to Battery Supply when

Contextual Info: Rev 3; 5/06 DS2045Y/AB Single-Piece 1Mb Nonvolatile SRAM Features 27mm2 ♦ Single-Piece, Reflowable, PBGA Package Footprint ♦ Internal ML Battery and Charger ♦ Unconditionally Write-Protects SRAM when VCC is Out-of-Tolerance ♦ Automatically Switches to Battery Supply when

Contextual Info: V•I Chip – BCM Bus Converter Module TM B048K096T24 + + –K – • >96% efficiency • 240 Watt 360 Watt for 1 ms • 125°C operation • High density – up to 960 W/in3 • <1 µs transient response • Small footprint – 240 W/in • >3.5 million hours MTBF

Contextual Info: V•I Chip – BCM Bus Converter Module TM B048K120T20 + + –K – • >96% efficiency • 200 Watt 300 Watt for 1 ms • 125°C operation • High density – up to 800 W/in3 • 1 µs transient response • Small footprint – 200 W/in • >3.5 million hours MTBF

Solder Paste, Indium 5.8

Abstract: SOT996-2 VSSOP8 MICROPAK XX SOT103 WLCSP stencil design J-STD-020D SOT996 sot1049 XQFN10U
Contextual Info: AN10343 MicroPak soldering information Rev. 2 — 30 December 2010 Application note Document information Info Content Keywords MicroPak, footprint, Ball Grid Array BGA , Wafer-Level Chip Scale Package (WLCSP) Abstract This application note describes evaluation of recommended solder land

Contextual Info: AT91SAM ARM-based Embedded MPU SAM9G25 SUMMARY DATASHEET Description Based on the ARM926EJ-S core, the SAM9G25 is an embedded microprocessor unit, running at 400 MHz and featuring connectivity peripherals, a high data bandwidth architecture and a small footprint package option, making it an optimized solution for

XC2V1000 Pin-out

Abstract: FG256 FF1152 xc2v1000 XC2V8000 XC2V80 XC2V10000 BF957
Contextual Info: Packaging Pinouts Footprints inSilicon: Compatible Pinouts in Virtex-II Devices Enhance Design Flexibility Advanced Virtex-II architecture allows you to change FPGA densities without changing PCB designs. by Jean-Louis Brelet Product Applications Manager, Xilinx

DS2045AB

Abstract: DS2045AB-100 DS2045AB-70 DS2045Y DS2045Y-100 DS2045Y-70 W16 PLC
Contextual Info: Rev 1; 11/04 DS2045Y/AB Single-Piece 1M Nonvolatile SRAM Features The DS2045 is a 1Mb reflowable nonvolatile NV SRAM, which consists of a static RAM (SRAM), an NV controller, and an internal rechargeable manganese lithium (ML) battery. These components are encased in a surface-mount module with a 256-ball BGA footprint.

DS2045AB

Abstract: DS2045AB-100 DS2045AB-70 DS2045Y DS2045Y-100 DS2045Y-70 rechargeable battery
Contextual Info: Rev 2; 1/05 DS2045Y/AB Single-Piece 1Mb Nonvolatile SRAM Features The DS2045 is a 1Mb reflowable nonvolatile NV SRAM, which consists of a static RAM (SRAM), an NV controller, and an internal rechargeable manganese lithium (ML) battery. These components are encased in a surface-mount module with a 256-ball BGA footprint.

Contextual Info: Rev 2; 1/05 DS2045Y/AB Single-Piece 1Mb Nonvolatile SRAM Features The DS2045 is a 1Mb reflowable nonvolatile NV SRAM, which consists of a static RAM (SRAM), an NV controller, and an internal rechargeable manganese lithium (ML) battery. These components are encased in a surface-mount module with a 256-ball BGA footprint.

CP56

Abstract: CS48 DS012 PC44 VQ100 VQ44 XCR3064XL K854
Contextual Info: R DS017 v1.3 December 8, 2000 XCR3064XL 64 Macrocell CPLD 14 Product Specification Features Description • 6.0 ns pin-to-pin logic delays • System frequencies up to 145 MHz • 64 macrocells with 1,600 usable gates • Available in small footprint packages

XCR3064XL

Abstract: CP56 CS48 DS012 TQ100 VQ100 VQ44 H644 cpld table k429d
Contextual Info: R DS017 v1.1 August 30, 2000 XCR3064XL 64 Macrocell CPLD 14 Preliminary Product Specification Features Description • 6.0 ns pin-to-pin logic delays • System frequencies up to 145 MHz • 64 macrocells with 1,500 usable gates • Available in small footprint packages

JESD22-A110-B HIGHLY ACCELERATED TEMPERATURE AND

Contextual Info: V•I Chip – BCM Bus Converter Module TM B048K480T30 + + –K – • >97% efficiency • 300 Watt 450 Watt for 1 ms • 125°C operation • High density – up to 1165 W/in3 • <1 µs transient response • Small footprint – 280 W/in • >3.5 million hours MTBF

14bcm

Contextual Info: V•I Chip – BCM Bus Converter Module TM B048K096T24 + + –K – • >96% efficiency • 240 Watt 360 Watt for 1 ms • 125°C operation • High density – up to 960 W/in3 • <1 µs transient response • Small footprint – 240 W/in • >3.5 million hours MTBF

DS2045AB

Abstract: DS2045AB-100 DS2045AB-70 DS2045Y DS2045Y-100 DS2045Y-70
Contextual Info: Rev 4; 10/06 DS2045Y/AB Single-Piece 1Mb Nonvolatile SRAM Features The DS2045 is a 1Mb reflowable nonvolatile NV SRAM, which consists of a static RAM (SRAM), an NV controller, and an internal rechargeable manganese lithium (ML) battery. These components are encased in a surface-mount module with a 256-ball BGA footprint.

smd RO25

Contextual Info: V•I Chip – BCM Bus Converter Module TM B048K120T20 + + –K – • >96% efficiency • 200 Watt 300 Watt for 1 ms • 125°C operation • High density – up to 800 W/in3 • 1 µs transient response • Small footprint – 200 W/in • >3.5 million hours MTBF

B048K120T20

Abstract: JESD22-A-103A JESD22-A-104B SR-332
Contextual Info: V•I Chip – BCM Bus Converter Module TM B048K120T20 + + –K – • >96% efficiency • 200 Watt 300 Watt for 1 ms • 125°C operation • High density – up to 800 W/in3 • 1 µs transient response • Small footprint – 200 W/in • >3.5 million hours MTBF

Contextual Info: BCM V•I Chip – BCM Bus Converter Module TM B048K480T30 + + –K – • >97% efficiency • 300 Watt 450 Watt for 1 ms • 125°C operation • High density – up to 1165 W/in3 • <1 µs transient response • Small footprint – 280 W/in • >3.5 million hours MTBF

transistor marking JB

Contextual Info: BCM V•I Chip – BCM Bus Converter Module TM B048K096T24 + + –K – • >96% efficiency • 240 Watt 360 Watt for 1 ms • 125°C operation • High density – up to 960 W/in3 • <1 µs transient response • Small footprint – 240 W/in • >3.5 million hours MTBF

JESD22-A110-B HIGHLY ACCELERATED TEMPERATURE AND

Abstract: JESD22-A-108-B B048K120T20
Contextual Info: BCM V•I Chip – BCM Bus Converter Module TM B048K120T20 + + –K – • >96% efficiency • 200 Watt 300 Watt for 1 ms • 125°C operation • High density – up to 800 W/in3 • 1 µs transient response • Small footprint – 200 W/in • >3.5 million hours MTBF

JESD22-B-104-A

Abstract: J-STD-029 SMD TRANSISTOR MARKING 2.x
Contextual Info: V•I Chip – BCM Bus Converter Module TM B048K096T24 + + –K – • >96% efficiency • 240 Watt 360 Watt for 1 ms • 125°C operation • High density – up to 960 W/in3 • <1 µs transient response • Small footprint – 240 W/in • >3.5 million hours MTBF

footprint jedec MS-026 TQFP

Abstract: PL84 tube AS 108-120 x-ray tube datasheet 144 QFP body size drawing of a geometrical isometric sheet superior Natural gas engines x-ray tube datasheet 026 SMT, FPGA FINE PITCH BGA 456 BALL mo-047 texas
Contextual Info: Packages INTRODUCTION Vantis provides its programmable logic devices PLDs in a wide range of packages. These packages provide benefits such as high power dissipation capability, small footprint, and high I/O. This section provides details about the packages that Vantis supplies.