Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    BGA 11X11 JUNCTION TO BOARD THERMAL RESISTANCE Search Results

    BGA 11X11 JUNCTION TO BOARD THERMAL RESISTANCE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TCTH011AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH022AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH021AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012BE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Open-drain type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation

    BGA 11X11 JUNCTION TO BOARD THERMAL RESISTANCE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    BGA 11x11 junction to board thermal resistance

    Abstract: 45x45 mm bga BGA 64 PACKAGE thermal resistance qfn jc jb 45x45 bga BGA 23X23 PQFP 32X32 QFN 48 JC JB 35x35 bga QFN 20X20
    Text: Thermal Management February 2004 Introduction to Thermal Management Thermal considerations are rarely an issue with low-density PLDs such as the Lattice Semiconductor GAL products, however, high-density PLDs often require consideration of thermal issues as part of any sound design methodology. To avoid reliability problems, Lattice Semiconductor specifies a maximum allowable junction temperature


    Original     		PDF 320-ball 432-ball 27x27 31x31 35x35 40x40 45x45 BGA 11x11 junction to board thermal resistance 45x45 mm bga BGA 64 PACKAGE thermal resistance qfn jc jb 45x45 bga BGA 23X23 PQFP 32X32 QFN 48 JC JB 35x35 bga QFN 20X20

    LFXP2-8E

    Abstract: LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132
    Text: Thermal Management July 2009 Introduction Thermal management is recommended as part of any sound CPLD and FPGA design methodology. To properly assess the thermal characteristics of the system, Lattice Semiconductor specifies a maximum allowable junction temperature in all device data sheets. The system designer should always complete a thermal analysis of their specific design to ensure that the device and package does not exceed the junction temperature requirements.


    Original     		PDF 64-ball 144-ball LFXP2-8E LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132

    PCB footprint cqfp 132

    Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 PCB footprint cqfp 132 schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318

    MO-83-AF

    Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 MO-83-AF PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128

    footprint jedec MS-026 TQFP 128

    Abstract: schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208
    Text: Packages and Thermal Characteristics  June 1, 1996 Version 1.1 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208

    footprint jedec MS-026 TQFP 128

    Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
    Text: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF FG860 FG900 FG1156 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228

    schematic impulse sealer

    Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481
    Text: Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF FG860 FG900 FG1156 schematic impulse sealer leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481

    footprint jedec MS-026 TQFP

    Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    schematic impulse sealer

    Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    JEDEC Package Code MS-026-AED

    Abstract: EFTEC-64 schematic impulse sealer footprint jedec MS-026 TQFP PQ-208 footprint jedec MS-026 TQFP 128 QFP PACKAGE thermal resistance die down EIA standards 481 ipc-sm-786A VQ44
    Text: • Packages and Thermal Characteristics  November 20, 1997 Version 2.0 10* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    GR-253-CORE

    Abstract: PRBS31 Si5100 Si5110 Si5320 Si5364
    Text: S i 5 11 0 D A TA S H E E T SiPHY OC-48/STM-16 SONET/SDH T R A N S C E I V E R Features Complete low-power, high-speed, SONET/SDH transceiver integrated limiting amp, CDR, CMU, and MUX/DEMUX. with Si5110 ! ! ! ! ! ! Data rates supported: OC-48/STM-16 through 2.7 Gbps


    Original     		PDF OC-48/STM-16 Si5110 GR-253-CORE PRBS31 Si5100 Si5110 Si5320 Si5364

    si5110-g

    Abstract: No abstract text available
    Text: S i 5 11 0 SiPHY  OC-48/STM-16 SONET/SDH T RANSCEIVER Features Complete low-power, high-speed, SONET/SDH transceiver integrated limiting amp, CDR, CMU, and MUX/DEMUX. with Si5110  Data rates supported:  SONET-compliant loop-timed OC-48/STM-16 through 2.7 Gbps


    Original     		PDF OC-48/STM-16 Si5110 si5110-g

    SI511

    Abstract: No abstract text available
    Text: S i 5 11 0 SiPHY OC-48/STM-16 SONET/SDH T RANSCEIVER Features Complete low-power, high-speed, SONET/SDH transceiver integrated limiting amp, CDR, CMU, and MUX/DEMUX. with Si5110 Data rates supported: „ SONET-compliant loop-timed OC-48/STM-16 through 2.7 Gbps


    Original     		PDF OC-48/STM-16 Si5110 SI511

    SI511

    Abstract: No abstract text available
    Text: S i 5 11 0 D A TA S H E E T SiPHY OC-48/STM-16 SONET/SDH T R A N S C E I V E R Features Complete low-power, high-speed, SONET/SDH transceiver integrated limiting amp, CDR, CMU, and MUX/DEMUX. „ „ „ „ „ Data rates supported: OC-48/STM-16 through 2.7 Gbps


    Original     		PDF OC-48/STM-16 Si5110 SI511

    ISL3856

    Abstract: mid f11 BGA 11x11 junction to board thermal resistance ARM940T IEEE bus data ISL3856CK V169
    Text: [ /Title ISL38 56 /Subjec t (Wirel ess LAN Access Point Contro ller) /Autho r () /Keyw ords (Intersi l Corpor ation, semico nducto r, Wirele ss LAN Access Point Contro ller, Wirele ss Comm unicati ons, RF, Radio Freque ISL3856 TM Data Sheet PRELIMINARY Wireless LAN Access Point Controller


    Original     		PDF ISL38 ISL3856 ISL3856 ARM940 HFA386x mid f11 BGA 11x11 junction to board thermal resistance ARM940T IEEE bus data ISL3856CK V169

    Untitled

    Abstract: No abstract text available
    Text: ISL3856 Data Sheet Wireless LAN Access Point Controller The Intersil ISL3856 Wireless LAN Access Point Controller is part of Intersil’s Wireless LAN chip sets targeting Access Point applications. The ISL3856 Access Point Controller is an ARM940 core controller with an onboard MAC to Ethernet 10/100 Base T


    Original     		PDF ISL3856 ISL3856 ARM940 HFA386x FN4932 ARM940T

    Untitled

    Abstract: No abstract text available
    Text: ISL3856 TM Data Sheet P RE L I M I NA R Y Wireless LAN Access Point Controller The Intersil ISL3856 Wireless LAN Access Point Controller is part of Intersil’s Wireless LAN chip sets targeting Access Point applications. The ISL3856 Access Point Controller is an ARM940 core


    Original     		PDF ISL3856 ISL3856 ARM940 HFA386x

    intersil prism

    Abstract: tms 980 processor HFA386X
    Text: ISL3856 TM Data Sheet P RE L I M I N A RY Wireless LAN Access Point Controller The Intersil ISL3856 Wireless LAN Access Point Controller is part of Intersil’s Wireless LAN chip sets targeting Access Point applications. tle 38 jec el ess t tro ho w rsi or


    Original     		PDF ISL3856 ISL3856 ARM940 HFA386x intersil prism tms 980 processor

    pcf 7946

    Abstract: BGA 11x11 junction to board thermal resistance ARM940T ISL3856 ISL3856CK V169
    Text: ISL3856 Data Sheet P RE LIM IN AR Y Wireless LAN Access Point Controller The Intersil ISL3856 Wireless LAN Access Point Controller is part of Intersil’s Wireless LAN chip sets targeting Access Point applications. The ISL3856 Access Point Controller is an ARM940 core


    Original     		PDF ISL3856 ISL3856 ARM940 HFA386x FN4932 ARM940T pcf 7946 BGA 11x11 junction to board thermal resistance ISL3856CK V169

    74 hc 59581

    Abstract: b768 transistor transistor smd 661 752 8 pin ic base socket round pin type lead 652B0082215-002 MM5231 702 transistor smd code LA9100 LGA 1155 Socket PIN diagram smd transistor w16
    Text: 717 Technical portal and online community for Design Engineers - www.element-14.com Semiconductor Hardware & Thermal Management Page Page 727 725 725 732 739 732 749 736 725 724 723 723 724 721 720 722 726 752 728 751 Crystal Oscillator Sockets . . . . . . . . . . . . . . . . . .


    Original     		PDF element-14 74 hc 59581 b768 transistor transistor smd 661 752 8 pin ic base socket round pin type lead 652B0082215-002 MM5231 702 transistor smd code LA9100 LGA 1155 Socket PIN diagram smd transistor w16

    b1342

    Abstract: transistor B1342 B1044 inductor 470uH b1342 transistor TRANSISTOR b1331 GW80314 PC200 0AA38 radiation tolerant ethernet phy
    Text: Intel GW80314 I/O Companion Chip Datasheet Product Features • ■ ■ ■ ■ Companion chip for the Intel® 80200 processor based on Intel® XScale microarchitecture ARM* architecture compliant—no integrated core . Internal non-blocking, high-speed switch


    Original     		PDF GW80314 b1342 transistor B1342 B1044 inductor 470uH b1342 transistor TRANSISTOR b1331 PC200 0AA38 radiation tolerant ethernet phy

    Untitled

    Abstract: No abstract text available
    Text: MOTOROLA SEMICONDUCTOR TECHNICAL DATA Product Preview Quad Input Redundant IDCS Clock Generator The MPC9894 is a differential input and output, PLL-based Intelligent Dynamic Clock Switch IDCS and clock generator specifically designed for redundant clock distribution systems. The device receives up to four


    Original     		PDF MPC9894/D MPC9894

    interfacing cpld xc9572 with keyboard

    Abstract: VERIFY 93K template 34992 XC95288XL evaluation board schematic XCR3032C XcxxX xilinx logicore core dds XC2S15-VQ100 creative labs model 3400 FXS-100
    Text: The Programmable Logic Data Book 2000 R R , XC2064, NeoCAD PRISM, XILINX Block Letters , XC-DS501, NeoROUTE, XC3090, FPGA Architect, XC4005, FPGA Foundry, XC5210, Timing Wizard, NeoCAD, TRACE, NeoCAD EPIC, XACT are registered trademarks of Xilinx, Inc. , all XC-prefix product designations, AllianceCore, Alliance Series, BITA, CLC, Configurable Logic Cell, CoolRunner, Dual Block, EZTag, Fast CLK, FastCONNECT,


    Original     		PDF XC2064, XC-DS501, XC3090, XC4005, XC5210, interfacing cpld xc9572 with keyboard VERIFY 93K template 34992 XC95288XL evaluation board schematic XCR3032C XcxxX xilinx logicore core dds XC2S15-VQ100 creative labs model 3400 FXS-100

    b1342

    Abstract: intel 27375 CRC32-C
    Text: Intel GW80314 I/O Companion Chip Datasheet Product Features • ■ ■ ■ ■ Companion chip for the Intel® 80200 processor based on Intel XScale® microarchitecture ARM* architecture compliant—no integrated core Internal non-blocking, high-speed switch


    Original     		PDF GW80314 W80314 b1342 intel 27375 CRC32-C