BGA 31 X 31 MM Search Results

MO-192

Abstract: JEDEC bga case outline
Contextual Info: FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. TITLE: MECHANICAL OUTLINE 5 0 0 I / O TAPE BGA, 31 X 31 PKG, 1 MM r i IUH PRINT VERSION NOT TO SCALE DOCUMENT NO: 98A R S 10509D REV: A CASE NUMBER: 1 4 7 5 -0 1 18 AUG 2 0 0 5 STANDARD: JEDEC M O -1 9 2 , VARIATION A A N -1

MO-192

Abstract: JEDEC bga case outline aan1
Contextual Info: FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. TITLE: MECHANICAL OUTLINE 3 2 4 I / O TA P E BGA, 31 X 31 PKG, 1 MM PITCH PRINT VERSION NOT TO SCALE DOCUMENT NO: 9 8A S A 9 9 3 4 6 D REV: A CASE NUMBER: 1 3 8 2 -0 1 0 4 AUG 2 0 0 5 STANDARD: JEDEC M O -1 9 2 , VARIATION A A N -1

BGA PACKAGE TOP MARK

Abstract: 431 marking code marking 5238
Contextual Info: 4 31 X A1 INDEX — y SEE NOTE 1 0 \ 0.15 A A SEATING PLANE 1 2, 3 4- 5 6. 7 8. 10 12 14 16 18 20 22 rh BOTTOM FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. VIEW 0 0 .1 5 | a | b | c | 0 0 .0 8 ® A MECHANICAL OUTLINE TITLE: 431 I / O FC BGA. 2 0 X 2 0 PKG, 0 . 8 MM PITCH,

Contextual Info: 7 4 0 X |^ |o .1 5 |A //10 .2 5 1A I \ 1.05_ 1 3 2 5 4 7 6 II 13 15 17 19 21 23 25 27 29 31 33 35 37 B 10 12 14 16 IB 2D 22 24 26 2B 30 32 34 36 BOTTOM F R E E S C A L E SEMICONDUCTOR, A L L R I G H T S RESERVED. TITLE: 740X 0 9 VIEW INC. 7 4 0 I/O TAPE BGA,

BCN318

Abstract: 250v 1.0K capacitor 627T BB1020DT BB1020DT7 BB1110B BB1110TB BB2110DI BCN31Ladder 628 ladder
Contextual Info: bi441 short form 2007 dev.qxd 12 6/26/07 8:59 AM Page 12 Fixed Resistors BGA Networks BGA Network Model BB1110B/BB1110TB/BB2110DI BB1020DT Resistance Nominal, Ohms 20 to 100 475/121/425 Ball Size mm 0.64/0.76 0.64/0.76 Pitch (mm) 1.27, 1 1.27, 1 Absolute Tolerance (%)

94 4311

Contextual Info: mm 1.00mm/1.27mm Pitch BGA Socket and Adapter FEATURES: • Any grid size availabe on 1.00mm pitch or larger ex.:1,27mm pitch. Consult BGA Footprint section of Product Data Sheets in Aries Electronics website, www.arieselec.com. • Reliable 3-finger female contact, which provides wiping action

BLVDS-25

Abstract: LVDSEXT-25 4564 RAM XC2VP70 FF1704 pinout XC2V1000 Pin-out XC2V1500 XC2V2000 XC2V3000 XC2V6000 XC2V8000
Contextual Info: Xilinx Virtex-II Series FPGAs and RocketPHY Physical Layer Transceivers Transceiver Blocks 992 88 120 200 264 432 528 624 720 912 1104 1108 Chip Scale Packages CS – wire-bond chip-scale BGA (0.8 mm ball spacing) 144 8 88 92 FF896 92 8 FF1152 BGA Packages (BG) – wire-bond standard BGA (1.27 mm ball spacing)

Contextual Info: VSC5529 Datasheet FEATURES ● ● ● ● ● ● ● ● Ultra-small form factor: 16 x 6 x 2.5 mm BGA Optimized for metro and long haul LiNbO3 NRZ applications Exceptional eye mark margin Excellent input sensitivity: 250 mV Wide output range: up to 7 V Low jitter

VSC5529MM-04

Abstract: VSC5529MM-03
Contextual Info: VSC5529 Datasheet FEATURES ● ● ● ● ● ● ● ● Ultra-small form factor: 16 x 6 x 2.5 mm BGA Optimized for metro and long haul LiNbO3 NRZ applications Exceptional eye mark margin Excellent input sensitivity: 250 mV Wide output range: up to 7 V Low jitter

PJO 399

Abstract: PJO 389 PJO 499 B13128 pjo 489 7512A PJO 376 PJO 386
Contextual Info: MMMA. MAX 7000A Includes MAX7000AE Programmable Logic Device Family May 1999, ver. 2 Data Sheet Features. • ■ ■ Prelim inary Information ■ ■ ■ ■ High-performance CMOS EEPROM-based programmable logic devices PLDs built on second-generation Multiple Array MatriX

16X16

Abstract: bga 576 socket bga 24x24 576
Contextual Info: MATRIX BGA SOCKET TYPE 1 1 MM NO. OF CONTACTS G R ID 16 4 0 2 4 0 - 1 256 16X16 16 4 0 2 4 0 - 2 289 17X17 16 4 0 2 4 0 - 3 324 18X18 1640240-4 36 1 16 4 0 2 4 0 - 5 PART NO . D IM A D IM B D IM C 23.50 [.925] 24.50 C. 964] [. 6 8 9 ] 1 7,50 [.591 ] 1 5,00

microfocus x-ray

Abstract: omron* AOI VT-X700 X-RAY INSPECTION q319 A902 X700 8kva 130322 A-902
Contextual Info: N EW Specifications • Hardware configuration/function specifications High-speed Automated X-Ray Inspection System Description Item VT-X700 VT-X700-M Model Sealed microfocus X-ray source Flat panel type Detector 1,550 x 1,650 × 1,620 mm Device dimensions

univision technology

Abstract: Ka-Band MMIC Mixer MICROWAVE ASSOCIATES RF SPDT switch Microwave power GaAs FET data HMC220MS8 ka-band mixer HMC143 HMC259 HMC264CB1 HMC267QS16G
Contextual Info: OFF-THE-SHELF HITTITE MICROWAVE CORPORATION JUNE 1999 Ball Grid Array SMT mmWave Products INSIDE. *12 NEW PRODUCTS RELEASED! Designers of millimeter and microwave radios now have access to advanced MMICs in a rugged SMT packaged format. Hittite Microwave has

XAPP623

Abstract: XC3S500E-FT256 simulation model electrolytic capacitor XC3S500E FG256 FT256 UG112 XAPP489 hyperlynx PCB echo sound
Contextual Info: Application Note: Spartan-3E Family R Four- and Six-Layer, High-Speed PCB Design for the Spartan-3E FT256 BGA Package XAPP489 v1.0 October 31, 2006 Summary This application note addresses low-cost, four- to six-layer, high-volume printed circuit board (PCB) layout for a Spartan -3E FPGA in the FT256 1 mm BGA package. The impact of highspeed signals and signal integrity (SI) considerations for low layer count PCB layouts is also

B180

Contextual Info: GS84018/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Single Cycle Deselect SCD operation • 3.3 V +10%/–5% core power supply

B180

Contextual Info: GS84018/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Single Cycle Deselect SCD operation • 3.3 V +10%/–5% core power supply

MS-034-AAn-1

Abstract: ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002
Contextual Info: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel

GS84032AT-190i

Contextual Info: GS84018/32/36AT/B-190/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Single Cycle Deselect SCD operation • 3.3 V +10%/–5% core power supply

GS81302D11GE-400I

Abstract: GS81302D11GE-400 Features
Contextual Info: GS81302D06/11/20/38E-500/450/400/350 144Mb SigmaQuad-II+ Burst of 4 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features 500 MHz–350 MHz 1.8 V VDD 1.8 V or 1.5 V I/O are just one element in a family of low power, low voltage HSTL I/O SRAMs designed to operate at the speeds needed to

Contextual Info: Preliminary GS82582D06/11/20/38E-550/500/450/400 288Mb SigmaQuad-II+ Burst of 4 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features 550 MHz–400 MHz 1.8 V VDD 1.8 V or 1.5 V I/O are just one element in a family of low power, low voltage HSTL I/O SRAMs designed to operate at the speeds needed to

AN1021

Contextual Info: GS81302DT06/11/20/38E-500/450/400/350 144Mb SigmaQuad-II+ Burst of 4 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features 500 MHz–350 MHz 1.8 V VDD 1.8 V or 1.5 V I/O are just one element in a family of low power, low voltage HSTL I/O SRAMs designed to operate at the speeds needed to

Contextual Info: GS81302DT06/11/20/38E-500/450/400/350 144Mb SigmaQuad-II+ Burst of 4 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features 500 MHz–350 MHz 1.8 V VDD 1.8 V or 1.5 V I/O are just one element in a family of low power, low voltage HSTL I/O SRAMs designed to operate at the speeds needed to

Contextual Info: GS81302D06/11/20/38E-500/450/400/350 144Mb SigmaQuad-II+ Burst of 4 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features 500 MHz–350 MHz 1.8 V VDD 1.8 V or 1.5 V I/O are just one element in a family of low power, low voltage HSTL I/O SRAMs designed to operate at the speeds needed to

Contextual Info: GS81302D06/11/20/38E-500/450/400/350 144Mb SigmaQuad-II+ Burst of 4 SRAM 165-Bump BGA Commercial Temp Industrial Temp Features 500 MHz–350 MHz 1.8 V VDD 1.8 V or 1.5 V I/O are just one element in a family of low power, low voltage HSTL I/O SRAMs designed to operate at the speeds needed to