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    BGA 313 BALL PACKAGE Search Results

    BGA 313 BALL PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TMS320C28346ZEPQ
    		Texas Instruments Delfino Microcontroller 256-BGA Visit Texas Instruments
    TMS320C28342ZEPQ
    		Texas Instruments Delfino Microcontroller 256-BGA Visit Texas Instruments
    TMS320C28345ZEPQ
    		Texas Instruments Delfino Microcontroller 256-BGA Visit Texas Instruments
    TMS320C28343ZEPQ
    		Texas Instruments Delfino Microcontroller 256-BGA Visit Texas Instruments
    TMS320C28344ZEPQ
    		Texas Instruments Delfino Microcontroller 256-BGA Visit Texas Instruments

    BGA 313 BALL PACKAGE Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    f6 diode

    Abstract: P352 transistor 6c transistor h9 BGA 176 ball package 256-pin BGA BGA 176 ball package datasheet bga 208 PACKAGE
    Contextual Info: : Available, : Under development Ceramic PGA I-Lead Type Classification Lead Pitch (mm) Pin Counts 288 528 Cavity Up 1.27 Cavity Down Plastic BGA Classification Ball Pitch (mm) Pin Counts 119 153 225 256 272 313 352 420 1.27 Cavity Up 1.5 Cavity Down 1.27


    Original     		X288R-50A-1 S64F1-CA1 S108S1-YHC P116S1-YJC S144S1-YKC S176S1-2C S224S1-3C-1 S304S1-6C S256N7-B6 S352N7-F6-1 f6 diode P352 transistor 6c transistor h9 BGA 176 ball package 256-pin BGA BGA 176 ball package datasheet bga 208 PACKAGE PDF

    BGA-56 DATASHEET

    Abstract: mini ball corner PQFP die size cpga dimensions BGA-64 pad atmel 0945 PQFP 132 PACKAGE DIMENSION
    Contextual Info: pkg-3.7-04/99 Packaging Introduction . 4-3 Package Options: Table . 4-3


    Original     		PDF

    SF-BGA313A-B-11

    Abstract: BGA 313 ball package
    Contextual Info: D C Package Code: BGA313A 30.48mm [1.200"] See BGA pattern code to the right for actual pattern layout Y 1.27mm [0.050"] 1.27mm [0.050"] X 30.48mm [1.200"] Top View reference only 2 1.27 mm [0.050"] 0.36mm [0.014"] dia. 1.27mm [0.050"] 5.33mm 3.74mm [0.147"]


    Original     		BGA313A FR4/G10 SF-BGA313A-B-11 BGA 313 ball package PDF

    nec 44 pin LQFP

    Abstract: BGA and QFP Package 256-pin BGA drawing 14 pin ic 28-pin QFP nec 44-pin qfp 44-Pin QFN 65A1 nec 44-pin LQFP ic packages
    Contextual Info: CHAPTER 3 SURFACE MOUNT PACKAGES 3.1 LINEUP OF SURFACE MOUNT IC PACKAGES 3.2 LIST OF SURFACE MOUNT IC PACKAGES 1 Plastic SOP (Small Outline Package) (2) Ceramic WSOP (Small Outline Package with Window) (3) Plastic shrink SOP (Shrink Small Outline Package)


    Original     		S64F1-CA1 S108S1-YHC P116S1-YJC S144S1-YKC S176S1-2C S224S1-3C-1 S304S1-6C S256N7-B6 S352N7-F6-1 S420N7-F6 nec 44 pin LQFP BGA and QFP Package 256-pin BGA drawing 14 pin ic 28-pin QFP nec 44-pin qfp 44-Pin QFN 65A1 nec 44-pin LQFP ic packages PDF

    Ericsson microwave antenna

    Abstract: Ericsson ROK 101 010 TX laser marking code BG ericsson antenna transmission Ericsson antennas ltcc D 313 Ericsson microwave antennas
    Contextual Info: Prelim inary ERICSSON ^ A p ril 1 9 9 9 PBA 313 01/2 Bluetooth Radio Description Key Features PBA 313 01/2 is a short-range microwave frequency radio transceiver for Blue­ tooth links. The radio operates in the globally available 2.4 - 2.5 GHz ISM free band.


    OCR Scan     		1522-PBA SE-164 Ericsson microwave antenna Ericsson ROK 101 010 TX laser marking code BG ericsson antenna transmission Ericsson antennas ltcc D 313 Ericsson microwave antennas PDF

    35 x 35 PBGA, 580 100 balls

    Abstract: of BGA Staggered Pins package BGA Ball Crack without underfill BGA PACKAGE thermal resistance 60um of BGA Staggered pins
    Contextual Info: NEW PRODUCTS 7 LATEST TECHNOLOGICAL TRENDS IN VLSI PACKAGES AND DEVELOPMENT OF NEW PACKAGES Hisao Kasuga/Miwa Momma Introduction Consumers expect constant progress in electronic systems and record-breaking size reduction each time a new product is released. To kindle consumers’ interest,


    Original     		PDF

    T1598

    Abstract: Synton
    Contextual Info: Preliminary November 1999 PBA 313 01/2 Bluetooth Radio Description Key Features PBA 313 01/2 is a short-range microwave frequency radio transceiver for Bluetooth communication links that are designed to operate in the globally available ISM frequency band, 2.4–2.5 GHz.


    Original     		1522-PBA SE-164 T1598 Synton PDF

    PCM 2905

    Abstract: bluetooth positioning system block diagram LTCC Substrate ROK101002
    Contextual Info: Preliminary July 1999 PBA 313 01/2 Bluetooth Radio Description Key Features PBA 313 01/2 is a short-range microwave frequency radio transceiver for Bluetooth communication links that are designed to operate in the globally available ISM frequency band, 2.4–2.5 GHz.


    Original     		1522-PBA SE-164 PCM 2905 bluetooth positioning system block diagram LTCC Substrate ROK101002 PDF

    35 x 35 PBGA, 580 100 balls

    Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
    Contextual Info: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8


    Original     		C13550EJ1V0PF00 35 x 35 PBGA, 580 100 balls Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP PDF

    PA-PGA181-02W

    Abstract: PA-SO42-S-01 actel 14100 BGA169C PA-PGA68-01 ax 6001 mp3 PA-QIP90-01 PA-PLCC84-02 intel 82310 PA-PGA301-01
    Contextual Info: Ironwood Electronics PA.1 Prototyping Adapters Ironwood has developed over one thousand prototyping adapter designs, supporting CSP, BGA, QFP, SOIC, PGA, PLCC, QIP, and DIP packages for most popular prototyping panels and PGA DUT interfaces. We also offer adapters for


    Original     		12X12mm. FR4/G10 PA-PGA181-02W PA-SO42-S-01 actel 14100 BGA169C PA-PGA68-01 ax 6001 mp3 PA-QIP90-01 PA-PLCC84-02 intel 82310 PA-PGA301-01 PDF

    TX SLOT SY N T_O N SI TX_O N PH D_O FF TX_DA TA RX _ON R X_D ATA tTO tTD tS t

    Abstract: Bluetooth Module Ericsson ROK 101002 ROK 101002 PBA31301/2
    Contextual Info: Preliminary PBA 313 01/2 PBA 313 01/2 Bluetooth Radio Key Features • RF output power Class 2 • Compliant to Bluetooth Specification 1.0B • Forms a complete radio with only – an antenna – a crystal or existing 13 MHz reference frequency – data and digital control circuitry


    Original     		SE-164 1522-PBA TX SLOT SY N T_O N SI TX_O N PH D_O FF TX_DA TA RX _ON R X_D ATA tTO tTD tS t Bluetooth Module Ericsson ROK 101002 ROK 101002 PBA31301/2 PDF

    CA91C078A-33IQ

    Abstract: CA91C142D-33IE CA91C142D-33CE CA91C142B-33CE CA91C142B-33IE CA91C078A-33CQ QLD 9712 CA91C142B-33IB TUNDRA CA91C142D-33CE CA91L8260B-100CL
    Contextual Info: Tundra System Interconnect www.tundra.com Tundra designs and delivers high-impact semiconductor products that enable innovative architectures in communications infrastructure and storage systems. The ever-growing demand for bandwidth from Internet and network users means communications


    Original     		SCV64, CA91C078A-33IQ CA91C142D-33IE CA91C142D-33CE CA91C142B-33CE CA91C142B-33IE CA91C078A-33CQ QLD 9712 CA91C142B-33IB TUNDRA CA91C142D-33CE CA91L8260B-100CL PDF

    tsop 48 PIN type2

    Abstract: 50 mil pitch ceramic package BGA and QFP Package mounting 64 pin IC FOUR SIDE 48 pin ic qfj 84-Pin QFN
    Contextual Info: Packages for IC Through-hole mount type DIP Surface mount type1 SIP Dual In-line Package (Single In-line Package) Terminals are on one side of the package and are arranged in a row. Terminals are on two opposite sides of the package and are arranged two rows.


    Original     		PDF

    nitto GE-100L

    Abstract: GE-100L Nitto GE 100 nitto GE CCL-HL-832 CCL-HL832 HL832 pcb material datasheet 100L CO-029 MS-034
    Contextual Info: LAMINATE data sheet MCM-PBGA Features: MCM-PBGA Packages: The MCM-PBGA Multi-Chip Module Plastic Ball Grid Array by Amkor incorporates the latest technology in high-density plastic IC packaging. The high-speed performance and thermal advantages of the PBGA


    Original     		PDF

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G PDF

    LSI53C1020A

    Abstract: LSI53C1020 DB14-000176-06 Fusion-MPT Message Passing Interface Specification LSI53C1000
    Contextual Info: TECHNICAL MANUAL LSI53C1020/1020A PCI-X to Ultra320 SCSI Controller February 2004 Version 2.4 DB14-000176-06 This document contains proprietary information of LSI Logic Corporation. The information contained herein is not to be used by or disclosed to third parties


    Original     		LSI53C1020/1020A Ultra320 DB14-000176-06 DB14-000176-06, LSI53C1020 LSI53C1020A DB14-000176-06 Fusion-MPT Message Passing Interface Specification LSI53C1000 PDF

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance PDF

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga PDF

    XILINX/part marking Hot

    Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
    Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160 PDF

    transistor nec 8772

    Abstract: nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry
    Contextual Info: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s


    Original     		AN1231/D AN1231 transistor nec 8772 nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry PDF

    QFN "100 pin" PACKAGE

    Abstract: PIN32 BGA 176 ball package IC-288 280-Pin BGA
    Contextual Info: IC パッケージ 端子挿入タイプ DIP 表面実装タイプ 1 SIP Dual In-line Package (Single In-line Package) 端子がパッケージの２側面から取り 出された端子列２のパッケージ。 端子ピッチは2.54 mm (100 mil) 端子がパッケージの１側面から取り


    Original     		PDF

    "sd1v4

    Abstract: Fusion-MPT Message Passing Interface Specification LSI53C1020A LSI53C1000
    Contextual Info: TECHNICAL MANUAL LSI53C1020/1020A PCI-X to Ultra320 SCSI Controller February 2004 Version 2.3 DB14-000176-05 This document contains proprietary information of LSI Logic Corporation. The information contained herein is not to be used by or disclosed to third parties


    Original     		LSI53C1020/1020A Ultra320 DB14-000176-05 DB14-000176-05, LSI53C1020 LSI53C1020A "sd1v4 Fusion-MPT Message Passing Interface Specification LSI53C1000 PDF

    LSI53C1020A

    Abstract: ARM966E-S CRC-32 LSI53C1000R LSI53C1020 PAR64 KY 719 "sd1v4 SD1V Fusion-MPT Message Passing Interface Specification
    Contextual Info: TECHNICAL MANUAL LSI53C1020 PCI-X to Ultra320 SCSI Controller June 2002 Version 2.0 DB14-000176-02 This document contains proprietary information of LSI Logic Corporation. The information contained herein is not to be used by or disclosed to third parties


    Original     		LSI53C1020 Ultra320 DB14-000176-02 DB14-000176-02, LSI53C1020A ARM966E-S CRC-32 LSI53C1000R PAR64 KY 719 "sd1v4 SD1V Fusion-MPT Message Passing Interface Specification PDF

    BFG95

    Contextual Info: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


    Original     		UG112 UG072, UG075, XAPP427, BFG95 PDF