BGA 31X31 PCB DRAWING Search Results

Contextual Info: 4 1 THE DRAWINGS AND INFORMATION CONTAINED HEREIN ARE THE EXCLUSIVE PROPERTY OF ACTEL. THE INFORMATION. DRAWINGS AND DESIGN CONCEPTS CONTAINED HEREIN ARE CONFIDENTIAL/PROPRIETARY. SHALL BE MAINTAINED IN STRICT CONFIDENCE, AND SHALL NOT BE RELEASED TO ANY THIRD PARTY WITHOUT THE EXPRESS

SF-BGA432B-B-11

Abstract: 31X31 BGA 31X31 PCB DRAWING BGA432
Contextual Info: D Package Code: BGA432B C See BGA pattern code to the right for actual pattern layout Y 0.025" dia. pad .0225 dia. tooling holes X2 non plated (optional) 38.1mm X 1.27mm [0.050"] Top View (reference only) 2 9.119mm 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]

LS-BGA520A-31

Contextual Info: Top View 0.95mm [0.037"] 0.95mm [0.037"] 40.00mm [1.575"] 1.27mm typ. 38.10mm [1.500"] Side View 40.00mm [1.575"] 1.68mm [0.066"] 1 3.76mm [0.148"] 0.20mm [0.008"]±0.0005" 38.10mm [1.500"] 2 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material.

BGA432

Abstract: LS-BGA432B-31
Contextual Info: Top View 0.95mm [0.037"] 0.95mm [0.037"] 40.00mm [1.575"] 1.27mm typ. 40.00mm [1.575"] Side View 1.68mm [0.066"] 1 3.76mm [0.148"] 0.20mm [0.008"]±0.0005" 38.10mm [1.500"] 2 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material.

bga96

Abstract: LS-BGA961A-31 BGA 31X31 PCB DRAWING
Contextual Info: Top View 0.95mm [0.037"] 0.95mm [0.037"] 40.00mm [1.575"] 1.27mm typ. 40.00mm [1.575"] Side View 1.68mm [0.066"] 1 3.76mm [0.148"] 0.20mm [0.008"]±0.0005" 38.10mm [1.500"] 2 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material.

SG-BGA-6205

Contextual Info: GHz BGA Socket - Direct mount, solderless Features Top View Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 45.225mm Ball guide prevents over compression of elastomer

SG-BGA-6046

Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033
Contextual Info: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.

SG-BGA-6244

Contextual Info: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 37.725mm Ball guide prevents over compression of elastomer

SG-BGA-6121

Abstract: BGA 31X31 PCB DRAWING
Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. Top View High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 45.225mm Ball guide prevents over compression of elastomer

SG-BGA-6097

Contextual Info: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 38.225mm Ball guide prevents over compression of elastomer

SG-BGA-6039

Contextual Info: GHz BGA Socket - Direct mount, solderless Features Top View Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 45.225mm Ball guide prevents over compression of elastomer

Contextual Info: MATRIX BGA SOCKET TYPE 1 1 MM NO. OF CONTACTS GRID DIM 16 4 0 2 4 0 - 1 256 16X16 23.50 [ . 9251 17,50 [.689] 15 , 00 [ .591] 38, 10 [ 1. 500] 20,90 [.823] 14 , 5 0 [ . 5 7 1] 2 5 ± 6 LBS 16 4 0 2 4 0 - 2 289 17X17 24.50 [ .964] 18 , 50 [.728] 16 , 00 [.630]

16X16

Abstract: bga 576 socket bga 24x24 576
Contextual Info: MATRIX BGA SOCKET TYPE 1 1 MM NO. OF CONTACTS G R ID 16 4 0 2 4 0 - 1 256 16X16 16 4 0 2 4 0 - 2 289 17X17 16 4 0 2 4 0 - 3 324 18X18 1640240-4 36 1 16 4 0 2 4 0 - 5 PART NO . D IM A D IM B D IM C 23.50 [.925] 24.50 C. 964] [. 6 8 9 ] 1 7,50 [.591 ] 1 5,00

12x12 bga thermal resistance

Abstract: XC2V6000-ff1152 xc2v3000fg XC2V3000-FG676 smd transistor J6 pin XC2V3000-BG728 XC2V80 IO-L93N UG002 Printed Circuit Boards PCB
Contextual Info: R Chapter 4 PCB Design Considerations 1 Summary This chapter covers the following topics: • • • • • • • • • • 2 Pinout Information Pinout Diagrams Package Specifications 3 Flip-Chip Packages Thermal Data Printed Circuit Board Considerations

tec driver peltier

Contextual Info: R Chapter 4 PCB Design Considerations Summary This chapter covers the following topics: • • • • • • • • • • Pinout Information Pinout Diagrams Package Specifications Flip-Chip Packages Thermal Data Printed Circuit Board Considerations Board Routability Guidelines

emmc pcb layout

Abstract: oled display 96x16 fpga JTAG Programmer Schematics FLASHPRO4 A3PE1500-PQ208 ACTEL flashpro A2F200M3F-FGG484 96x16 oled A2F500 VQ100
Contextual Info: Product Catalog March 2010 Now, more than ever, power matters. Whether you’re designing at the board or system level, Actel’s low-power FPGAs and mixed-signal FPGAs are your best choice. The unique, flash-based technology of Actel FPGAs, coupled with their history of reliability, sets them apart

AGL125-QNG132

Abstract: FLASHPRO4 A2F500M3G A2F500M3G-FGG484 oled display 96x16 A2F500 A3PE jtag connector VQ100 emmc socket BGA A3P1000 144
Contextual Info: Product Catalog May 2010 Now, more than ever, power matters. Whether you’re designing at the board or system level, Actel’s low power FPGAs and mixed signal FPGAs are your best choice. The unique, flash-based technology of Actel FPGAs, coupled with their history of reliability, sets them apart

on digital code lock using vhdl mini pr

Abstract: XC2V3000-BG728 ternary content addressable memory VHDL XC2V6000-ff1152 TRANSISTOR 841 toshiba smd marking code transistor land pattern BGA 0,50 XC2V3000-FG676 BT 342 project smd marking code mfw
Contextual Info: Virtex-II Platform FPGA User Guide R R The Xilinx logo shown above is a registered trademark of Xilinx, Inc. ASYL, FPGA Architect, FPGA Foundry, NeoCAD, NeoCAD EPIC, NeoCAD PRISM, NeoROUTE, Spartan, Timing Wizard, TRACE, Virtex, XACT, XILINX, XC2064, XC3090, XC4005, XC5210, and XC-DS501 are registered trademarks of Xilinx, Inc.

datasheet transistor said horizontal tt 2222

Abstract: interface of rs232 to UART in VHDL xc9500 80C31 instruction set apple ipad schematic drawing 8 bit alu in vhdl mini project report apple ipad 2 circuit schematic apple ipad Apple iPad 2 panasonic inverter dv 700 manual TT 2222 Horizontal Output Transistor pins out
Contextual Info: Virtex-II Platform FPGA User Guide UG002 v2.2 5 November 2007 R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the

DSLAM drawing

Abstract: DSLAM board layout hyperlynx SIGNAL INTEGRITY AND TIMING SIMULATION PC3T04 IDT74FCT3807 PMC-1990815 PC3B01 74LCX244MCT
Contextual Info: VORTEX CHIPSET RELEASED DSLAM APPS NOTE PMC-1990816 ISSUE 1 SIGNAL INTEGRITY AND TIMING SIMULATION DSLAM DSLAM APPS NOTE: SIGNAL INTEGRITY AND TIMING SIMULATION FOR THE VORTEX CHIPSET S/UNI-DUPLEX, S/UNI-VORTEX, S/UNI-APEX AND S/UNI-ATLAS Released Issue 1

RAM16X8

Abstract: verilog hdl code for triple modular redundancy 37101 verilog/verilog code for lvds driver xc2v3000fg sot 23-5 marking code H5 BT 342 project xc2v250cs144 XC2V3000FF1152 fpga JTAG Programmer Schematics
Contextual Info: Virtex-II Platform FPGA Handbook R R The Xilinx logo shown above is a registered trademark of Xilinx, Inc. The shadow X shown above is a trademark of Xilinx, Inc. "Xilinx" and the Xilinx logo are registered trademarks of Xilinx, Inc. Any rights not expressly granted herein are reserved.

apple ipad schematic drawing

Abstract: xpower inverter 3000 plus apple ipad 8 bit alu in vhdl mini project report apple ipad 2 circuit schematic 8051 code assembler for data encryption standard XC2VP2-FG256 vhdl code for FFT 32 point Rayovac 357 apple ipad battery charge controller
Contextual Info: Virtex-II Pro and Virtex-II Pro X FPGA User Guide UG012 v4.2 5 November 2007 R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the

wireless power transfer using em waves matlab simulink

Abstract: PCB mounted 230 V relay Virtex-II FF1152 Prototype Board sot 23-5 marking code H5 BT 342 project Chirp modulation ber performance vhdl code for TRAFFIC LIGHT CONTROLLER using stat Motorola diode SMD code B13 xilinx vhdl code for 555 timer MARKING SMD IC CODE 8-pin
Contextual Info: Virtex-II Pro Platform FPGA Handbook UG012 v1.0 January 31, 2002 R R The Xilinx logo shown above is a registered trademark of Xilinx, Inc. The shadow X shown above is a trademark of Xilinx, Inc. "Xilinx" and the Xilinx logo are registered trademarks of Xilinx, Inc. Any rights not expressly granted herein are reserved.

LE79Q2281

Abstract: 1N6761-1 2N2369AU 2N2907AUB BR17 datasheet transistor SI 6822 Dimming LED aplications Dimming LED Driver aplications GC4600 IC ZL70572
Contextual Info: Product Portfolio 2013-2014 ng-edge Embed Power Matters. About Microsemi Microsemi Corporation is a leading provider of semiconductor solutions differentiated by power, security, reliability and performance. The company concentrates on providing solutions for applications where power matters, security