BGA OUTLINE DRAWING Search Results

12x12 bga thermal resistance

Abstract: SZZA005 micro pitch BGA A113 TMS320VC549 TMS320VC549GGU BGA Ball Crack
Contextual Info: Application Report 1998 MicroStar BGA Printed in U.S.A 11/98 SZZA005 MicroStar BGA Semiconductor Group Package Outline Application Report Kevin Lyne and Charles Williams Prepared by: Tanvir Raquib SZZA005 November 1998 Printed on Recycled Paper IMPORTANT NOTICE

Contextual Info: DS3802 Advanced NV SRAM Battery www.maxim-ic.com FEATURES § § § § § § PACKAGE OUTLINE Houses 380mAh primary lithium batteries Snaps directly onto a surface-mounted 40mm ball-grid array BGA nonvolatile (NV) SRAM module Attaches after host BGA module has been

reflow temperature rohs bga

Contextual Info: DS3802 Advanced NV SRAM Battery www.maxim-ic.com FEATURES § § § § § § PACKAGE OUTLINE Houses 380mAh primary lithium batteries Snaps directly onto a surface-mounted 40mm ball-grid array BGA nonvolatile (NV) SRAM module Attaches after host BGA module has been

micron BGA SDRAM

Abstract: 64MX4 MT48LC64M4A2FB-75 BGA OUTLINE DRAWING
Contextual Info: ISSD64M8PBB 512Mb 64Mbits x 8 SDRAM BGA Memory Stack GENERAL DESCRIPTION Irvine Sensors Corporation has developed the next generation of stacked memory that fits within the identical JEDEC monolithic outline as a single BGA chip. The 512Mbit Stacked-SDRAM is a high-speed

torque of screw for pcb

Abstract: torque of 4-40 screw for pcb SG-BGA-6180 BGA OUTLINE DRAWING
Contextual Info: tapped for 4-40 machine screw x4 55.225mm BGA pad outline A A 5mm typ. 20mm typ. 55.225mm Bottom View Top View 7 Tighten lid screws and socket base screws gradually in an "X" pattern until they are torqued to 1 in-lb each. User's BGA IC 1 Socket Compression Lid: Black anodized Aluminum.

63348-002

Abstract: Framatome Connectors 63348-002 Framatome Connectors Mount Framatome Connectors International so-DIMM connector SO-DIMM 200 dual
Contextual Info: Small Outline DIMM With BGA Attachment Small Outline DIMM, Dual 120-Position Features • Dual 120-position connector with a total of 240 positions • Ball Grid Array attachment on 1.30 mm 0.050" pads for surface mount applications • Low profile housing height of

ceramic rework

Abstract: CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles
Contextual Info: Ceramic Ball Grid Array Packaging, Assembly & Reliability Freescale Semiconductor 1 Outline for Discussion • • • • • • Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability

BGA PACKAGE OUTLINE

Abstract: 14X14 1537M
Contextual Info: connected to H2 15.37mm [0.605"] 1.18mm [0.047"] BGA package outline 3.48mm [0.137"] A1 16.48mm [0.649"] Top View 1 1.00mm 1.59mm [0.063"] Bottom View 2.09mm [0.082"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2

torque of screw for pcb

Abstract: torque of 4-40 screw for pcb BGA OUTLINE DRAWING SG-BGA-6081 35x35 bga
Contextual Info: Top View Bottom View tapped for 4-40 machine screw x4 55.225mm BGA pad outline A A 5mm typ. 20mm typ. 55.225mm Side View (Section AA) Tighten lid screws and socket base screws gradually in an "X" pattern until they are torqued to 3.5 to 4 in-lbs each. 1

BGA OUTLINE DRAWING

Abstract: SG-BGA-6078
Contextual Info: Top View Bottom View tapped for 4-40 machine screw x4 55.225mm BGA pad outline A A 5mm typ. 15mm typ. 55.225mm Side View (Section AA) Tighten lid screws and socket base screws gradually in an "X" pattern until they are torqued to 3.5 to 4 in-lbs each. 1

MS-034-AAn-1

Abstract: ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002
Contextual Info: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel

oki naming format

Abstract: DIP42-P-600-2 HQFP208-P-4040-0 R400 S115 0.65mm pitch BGA PLCC DIMENTIONS oki marking 20 soj
Contextual Info: 1. PACKAGE CLASSIFICATIONS 1-5. 1 1 Package Symbols and Codes Package code The package codes given on the outline view are those specified in ED-7401-2 General Rules for Preparation of Outline Drawings if Integrated Circuits Package Name and Code) established by

240 pin rqfp drawing

Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)

PQFP 176

Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
Contextual Info: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●

2032VE

Abstract: 2128VE BGA OUTLINE DRAWING PB1107 Lattice Package Dia
Contextual Info: Product Bulletin December 1998 #PB1107 Lattice Introduces Advanced Chip Array and Fine Pitch BGA Packages Introduction Lattice Semiconductor has announced the availability of advanced Chip Array and Fine Pitch BGA ball grid array packages for its ISP logic devices. The first

90Pb 10Sn solder paste

Abstract: 97Pb BGA OUTLINE DRAWING ceramic rework BGA PROFILING BGA Solder Ball collapse fine BGA thermal profile pcb warpage in ipc standard bga rework CBGA motorola
Contextual Info: Ceramic Ball Grid Array Packaging, Assembly & Reliability Andrew Mawer, Terry Burnette, Thomas Koschmeider and Diane Hodges Final Manufacturing Technology Center Motorola Semiconductor Products Sector 3501 Ed Bluestein Blvd., MD: F25 Austin, Texas 78721 USA

639X

Abstract: LGA 1150
Contextual Info: CSP TAPE & REEL Chip Scale Packages for Memory Products Tape and Reel Shipping Media INTRODUCTION Surface mounting packages can be supplied with Tape and Reel packing. The reels are standard 330mm diameter 150mm for SBGA and contain between 250 and 2500 devices.

Intel reflow soldering profile BGA

Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
Contextual Info: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems

EP4CE15

Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
Contextual Info: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead

EP4CE6 package

Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
Contextual Info: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead

LGA 1150

Contextual Info: CSP TAPE & REEL Chip Scale Packages for Memory Products Tape and Reel Shipping Media INTRODUCTION Surface mounting packages can be supplied with Tape and Reel packing. The reels are standard 330mm diameter and contain between 250 and 2500 devices. The packages supplied on Tape and Reel are listed in Table 1 that shows the Tape Width and Part Pitch

transistors BC 458

Abstract: 240 pin rqfp drawing ep600i BC 458 256-pin BGA drawing EPM7032-44 transistor BC 458 tqfp 44 thermal resistance datasheet epm7064s cross reference BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information August 1999, ver. 8 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

Contextual Info: CSP TAPE & REEL Chip Scale Packages for Memory Products Tape and Reel Shipping Media INTRODUCTION Surface mounting packages can be supplied with Tape and Reel packing. The reels are standard 330mm diameter and contain between 250 and 2500 devices. The packages supplied on Tape and Reel are listed in Table 1 that shows the Tape Width and Part Pitch

EP20K100E

Abstract: EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA
Contextual Info: Altera Device Package Information August 2000, ver. 8.03 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.