BGA PACKAGE Search Results

BGA PACKAGE Result Highlights (5)

Part	Manufacturer	Description
TPH9R00CQH	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N)
TPH1R306PL	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N)
TPH9R00CQ5	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N)
TPHR8504PL	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N)
TPH2R408QM	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance

BGA PACKAGE Datasheets (2)

Part	ECAD Model	Manufacturer	Description	Datasheet Type	PDF	PDF Size	Page count
BGA Package		Xilinx	Chip Scale BGA (CS144/CSG144) Package	Original	PDF	53.94KB	1
BGA PACKAGE TOP MARK		Altera	CUSTOMER ADVISORY BGA PACKAGE TOP MARK ENHANCEMENT	Original	PDF	8.71KB	1

BGA PACKAGE Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
reflow soldering profile BGA Abstract: reflow temperature bga BGA PROFILING bga rework Contextual Info: BGA Solder Reflow and Rework Recommendations BGA Reflow Soldering Recommendations BGA Rework Recommendations Reflow: Removal and replacement of BGA packages on printed circuit boards is fairly straightforward. However, reattachment or touch-up of BGA packages that have already	Original		PDF
led matrix circuits Abstract: 256-pin Plastic BGA BGA-256P-M02 Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M02 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M02 256-pin plastic BGA (BGA-256P-M02)	Original	BGA-256P-M02 256-pin BGA-256P-M02) BGA256004SC-2-1 led matrix circuits 256-pin Plastic BGA BGA-256P-M02	PDF
led matrix circuits Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 480 PIN PLASTIC To Top / Package Lineup / Package Index BGA-480P-M01 480-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-480P-M01 480-pin plastic BGA (BGA-480P-M01)	Original	BGA-480P-M01 480-pin BGA-480P-M01) BGA480001SC-2-1 led matrix circuits	PDF
led matrix circuits Abstract: fujitsu FUJITSU SEMICONDUCTOR Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 480 PIN PLASTIC To Top / Package Lineup / Package Index BGA-480P-M02 480-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-480P-M02 480-pin plastic BGA (BGA-480P-M02)	Original	BGA-480P-M02 480-pin BGA-480P-M02) BGA480002SC-2-1 led matrix circuits fujitsu FUJITSU SEMICONDUCTOR	PDF
led matrix circuits Abstract: BGA-420P Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 420 PIN PLASTIC To Top / Package Lineup / Package Index BGA-420P-M01 420-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-420P-M01 420-pin plastic BGA (BGA-420P-M01)	Original	BGA-420P-M01 420-pin BGA-420P-M01) BGA420001SC-2-1 led matrix circuits BGA-420P	PDF
led matrix circuits Abstract: BGA-420P Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 420 PIN PLASTIC To Top / Package Lineup / Package Index BGA-420P-M02 420-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-420P-M02 420-pin plastic BGA (BGA-420P-M02)	Original	BGA-420P-M02 420-pin BGA-420P-M02) BGA420002SC-2-1 led matrix circuits BGA-420P	PDF
256-pin BGA Abstract: 24 pin MATRIX led matrix circuits 256-pin Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M01 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M01 256-pin plastic BGA (BGA-256P-M01)	Original	BGA-256P-M01 256-pin BGA-256P-M01) BGA256002SC-2-1 wi256-pin 256-pin BGA 24 pin MATRIX led matrix circuits	PDF
256-pin BGA Abstract: led matrix circuits 256-pin Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M04 256-pin plastic T-BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M04 256-pin plastic T-BGA (BGA-256P-M04)	Original	BGA-256P-M04 256-pin BGA-256P-M04) B256009SC-1-3 256-pin BGA led matrix circuits	PDF
MACH4A Abstract: JTAG jtag mhz jtag 14 PQFP-144 ispLSI 2128-A M4A5-64 M5A3-384 Contextual Info: 208-Ball BGA 256-Ball BGA 100-Ball BGA 49-Ball BGA 144-Ball BGA ® Fine Pitch BGA ispLSI, MACH, ispGDX & ispGAL Packages ® 7.00 x 7.00 mm 0.8 mm pitch 10.00 x 10.00 mm 0.8 mm pitch 13.00 x 13.00 mm 1.0 mm pitch 17.00 x 17.00 mm 1.0 mm pitch All dimensions refer to package body size	Original	208-Ball 256-Ball 100-Ball 49-Ball 144-Ball 100-Pin 128-Pin 48-Pin 44-Pin 144-Pin MACH4A JTAG jtag mhz jtag 14 PQFP-144 ispLSI 2128-A M4A5-64 M5A3-384	PDF
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC BGA-352P-M05 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-352P-M05 352-pin plastic BGA (BGA-352P-M05) 35.00±0.10(1.378±.004)SQ 31.75±0.20(1.250±.008)	Original	BGA-352P-M05 352-pin BGA-352P-M05) BGA352006SC-1-1	PDF
BGA-420P-M03 Abstract: BGA-420P Contextual Info: PBALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 420 PIN PLASTIC BGA-420P-M03 420-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-420P-M03 420-pin plastic BGA (BGA-420P-M03) 35.00±0.10(1.378±.004)SQ 31.75±0.20(1.250±.008)	Original	BGA-420P-M03 420-pin BGA-420P-M03) BGA420003SC-2-1 BGA-420P-M03 BGA-420P	PDF
BGA-416P Abstract: BGA-416P-M02 T0-50 416-PIN Contextual Info: BALL GRID ARRAY PACKAGE 416 PIN PLASTIC BGA-416P-M02 Lead pitch 50mil Pin matrix 30 Sealing method Resin seal 416-pin plastic BGA BGA-416P-M02 416-pin plastic BGA (BGA-416P-M02) 40.00±0.20(1.575±.008)SQ 36.83±0.20(1.450±.008) INDEX C1.0 (.039) 1.27±0.20	Original	BGA-416P-M02 50mil 416-pin BGA-416P-M02) BGA416002SC-1-1 BGA-416P BGA-416P-M02 T0-50	PDF
BGA-256P-M02 Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC BGA-256P-M02 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M02 256-pin plastic BGA (BGA-256P-M02) 27.00±0.20(1.06±.008)SQ 24.00±0.10(.94±.004)	Original	BGA-256P-M02 256-pin BGA-256P-M02) BGA256004SC-2-1 BGA-256P-M02	PDF
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC BGA-352P-M04 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-352P-M04 352-pin plastic BGA (BGA-352P-M04) 35.00±0.10(1.378±.004)SQ 31.75±0.20(1.250±.008)	Original	BGA-352P-M04 352-pin BGA-352P-M04) BGA352005SC-3-1	PDF

416-PIN Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 416 PIN PLASTIC BGA-416P-M02 416-pin plastic BGA Lead pitch 50 mil Pin matrix 30 Sealing method Resin seal BGA-416P-M02 416-pin plastic BGA (BGA-416P-M02) 40.00±0.10(1.575±.004)SQ 36.83±0.20(1.450±.008)	Original	BGA-416P-M02 416-pin BGA-416P-M02) BGA416002SC-2-2	PDF
led matrix circuits Abstract: BGA-272P-M01 Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 272 PIN PLASTIC To Top / Package Lineup / Package Index BGA-272P-M01 272-pin plastic T-BGA Lead pitch 50 mil Pin matrix 21 Sealing method Plastic mold BGA-272P-M01 272-pin plastic T-BGA (BGA-272P-M01)	Original	BGA-272P-M01 272-pin BGA-272P-M01) B272001SC-1-3 led matrix circuits BGA-272P-M01	PDF
BGA-352 Abstract: 352-PIN Contextual Info: BALL GRID ARRAY PACKAGE 352 PIN PLASTIC BGA-352P-M02 Lead pitch 50mil Pin matrix 26 Sealing method Resin seal 352-pin plastic BGA BGA-352P-M02 352-pin plastic BGA (BGA-352P-M02) 35.00±0.20(1.380±.008)SQ 32.50±0.10(1.280±.004)SQ 2.30±0.20 (.091±.008)	Original	BGA-352P-M02 50mil 352-pin BGA-352P-M02) BGA352003SC-1-1 BGA-352	PDF
T0-50 Contextual Info: BALL GRID ARRAY PACKAGE 352 PIN PLASTIC BGA-352P-M01 Lead pitch 50mil Pin matrix 26 Sealing method Resin seal 352-pin plastic BGA BGA-352P-M01 352-pin plastic BGA (BGA-352P-M01) 35.00±0.20(1.378±.008)SQ 31.75±0.20(1.250±.008) INDEX C1.0 (.039) 1.27±0.20	Original	BGA-352P-M01 50mil 352-pin BGA-352P-M01) BGA352002SC-1-1 T0-50	PDF
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC BGA-352P-M01 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-352P-M01 352-pin plastic BGA (BGA-352P-M01) 35.00±0.10(1.378±.004)SQ 31.75±0.20(1.250±.008)	Original	BGA-352P-M01 352-pin BGA-352P-M01) BGA352002SC-2-2	PDF
256-pin Plastic BGA Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC BGA-256P-M01 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M01 256-pin plastic BGA (BGA-256P-M01) 27.00±0.20(1.06±.008)SQ 24.00±0.10(.94±.004)SQ	Original	BGA-256P-M01 256-pin BGA-256P-M01) BGA256002SC-2-1 o256-pin 256-pin Plastic BGA	PDF
BGA-576 Abstract: BGA576 576-pin Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 576 PIN PLASTIC BGA-576P-M01 576-pin plastic BGA Lead pitch 50 mil Pin matrix 30 Sealing method Resin seal BGA-576P-M01 576-pin plastic BGA (BGA-576P-M01) 40.00±0.10(1.575±.004)SQ 36.83±0.20(1.450±.008)	Original	BGA-576P-M01 576-pin BGA-576P-M01) BGA576001SC-2-1 BGA-576 BGA576	PDF
BGA-352P-M03 Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC BGA-352P-M03 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-352P-M03 352-pin plastic BGA (BGA-352P-M03) 35.00±0.20(1.380±.008)SQ 32.50±0.10(1.280±.004)SQ	Original	BGA-352P-M03 352-pin BGA-352P-M03) BGA352004SC-1-1 BGA-352P-M03	PDF
BGA-420P Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 420 PIN PLASTIC BGA-420P-M02 420-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Plastic mold BGA-420P-M02 420-pin plastic BGA (BGA-420P-M02) 35.00±0.20(1.38±.008)SQ 32.50±0.10(1.28±.004)SQ	Original	BGA-420P-M02 420-pin BGA-420P-M02) BGA420002SC-2-1 BGA-420P	PDF
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC BGA-352P-M02 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal BGA-352P-M02 352-pin plastic BGA (BGA-352P-M02) 35.00±0.20(1.380±.008)SQ 32.50±0.10(1.280±.004)SQ	Original	BGA-352P-M02 352-pin BGA-352P-M02) BGA352003SC-1-1	PDF

BGA PACKAGE Search Results

BGA PACKAGE Result Highlights (5)

BGA PACKAGE Datasheets (2)

BGA PACKAGE Datasheets Context Search

reflow soldering profile BGA

led matrix circuits

led matrix circuits

led matrix circuits

led matrix circuits

led matrix circuits

256-pin BGA

256-pin BGA

MACH4A

BGA-420P-M03

BGA-416P

BGA-256P-M02

416-PIN

led matrix circuits

BGA-352

T0-50

256-pin Plastic BGA

BGA-576

BGA-352P-M03

BGA-420P