BGA PACKAGE 172 Search Results

gk 7031

Contextual Info: W2637A, W2638A and W2639A LPDDR BGA Probes for Logic Analyzers and Oscilloscopes Data sheet Introduction The W2637A, W2638A and W2639A LPDDR BGA probes provide signal accessibility and probing of embedded memory designs directly at the ball grid array BGA package.

W2639A

Abstract: lpddr W2638A-101 W3635A N5425 9104a Oscilloscope Probe to PC E2678A specification of Logic Analyzer W2638A
Contextual Info: W2637A, W2638A and W2639A LPDDR BGA Probes for Logic Analyzers and Oscilloscopes Data sheet Introduction The W2637A, W2638A and W2639A LPDDR BGA probes provide signal accessibility and probing of embedded memory designs directly at the ball grid array BGA package.

Contextual Info: MILL-MAX BGA ADAPTER / SOCKET SYSTEMS Mill-Max adapter and socket systems are gaining in popularity as applications for socketing BGA devices continue to grow. Typically used in ASIC and CPU development, these modules convert a BGA package to a pluggable device, thus allowing

Contextual Info: Product Specifications PART NO: REV: 1.1 VL493T2863E-E7S/E6S General Information 1GB 128MX72 DDR2 SDRAM VLP ECC 200 PIN SO-RDIMM Description Features The VL493T2863E is a 128Mx72 Double Data Rate DDR2 SDRAM high density SO-RDIMM. This memory module consists of nine CMOS 128Mx8 bit DDR2 Synchronous DRAMs in BGA packages, a 25-bit Registered buffer in BGA package, a zero delay PLL clock in BGA package, and a 2K EEPROM in an 8-pin MLF

DDR2-667

Abstract: DDR2-800 PC2-5300 PC2-6400
Contextual Info: Product Specifications PART NO: REV: 1.1 VL493T2863E-E7S/E6S General Information 1GB 128MX72 DDR2 SDRAM VLP ECC 200 PIN SO-RDIMM Description Features The VL493T2863E is a 128Mx72 Double Data Rate DDR2 SDRAM high density SO-RDIMM. This memory module consists of nine CMOS 128Mx8 bit DDR2 Synchronous DRAMs in BGA packages, a 25-bit Registered buffer in BGA package, a zero delay PLL clock in BGA package, and a 2K EEPROM in an 8-pin MLF

BGA676

Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18

sony cmos sensor imx 172

Abstract: sony CMOS sensor imx 135 sony IMX 132 sony IMX 122 sony IMX 135 MLB150 sony cmos sensor imx 174 sony IMX 132 CMOS MIPI dsi transmitter sony cmos sensor imx 179
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SDLAEC Rev. 1, 11/2012 MCIMX6SxAxxxxxB MCIMX6UxAxxxxxB i.MX 6Solo/6DualLite Automotive and Infotainment Applications Processors Package Information Plastic Package BGA Case 2240 21 x 21 mm, 0.8 mm pitch

Contextual Info: Product Specifications PART NO.: VL393T2863E-E7M/E6M/D5M REV: 1.1 General Information 1GB 128Mx72 DDR2 SDRAM VLP ECC REGISTERED DIMM 240-PIN Description The VL393T2863E is a 128Mx72 DDR2 SDRAM high density DIMM. This memory module consists of nine CMOS 128Mx8 bit with 8 banks DDR2 synchronous DRAMs in BGA packages, a 25-bit registered buffer in BGA package, a

H5PS2G83AFR-S6C

Abstract: CAPACITOR CK 158 VN0810 DDR2-800 PC2-6400 DDR2 samsung pc2-6400 samsung dram H5PS2G83AFR
Contextual Info: Product Specifications PART NO.: VL491T2863B-E7S REV: 1.3 General Information 1GB 128Mx72 DDR2 SDRAM ULP ECC UNBUFFERED SO-CDIMM 200-PIN Description The VL491T2863B is a 128Mx72 DDR2 SDRAM high density SO-CDIMM. This memory module consists of nine CMOS 128Mx8 bit with 8 banks DDR2 synchronous DRAMs in BGA packages, a zero delay PLL clock in BGA package, and a

240-PIN

Abstract: DDR2-533 DDR2-667 DDR2-800 PC2-5300 PC2-6400
Contextual Info: Product Specifications PART NO.: VL393T2863E-E7M/E6M/D5M REV: 1.1 General Information 1GB 128Mx72 DDR2 SDRAM VLP ECC REGISTERED DIMM 240-PIN Description The VL393T2863E is a 128Mx72 DDR2 SDRAM high density DIMM. This memory module consists of nine CMOS 128Mx8 bit with 8 banks DDR2 synchronous DRAMs in BGA packages, a 25-bit registered buffer in BGA package, a

H5PS2G83AFR-S6C

Contextual Info: Product Specifications PART NO.: VL491T2863B-E7S REV: 1.3 General Information 1GB 128Mx72 DDR2 SDRAM ULP ECC UNBUFFERED SO-CDIMM 200-PIN Description The VL491T2863B is a 128Mx72 DDR2 SDRAM high density SO-CDIMM. This memory module consists of nine CMOS 128Mx8 bit with 8 banks DDR2 synchronous DRAMs in BGA packages, a zero delay PLL clock in BGA package, and a

TEA 1732

Abstract: A09 N03
Contextual Info: 1.6 PowerPC 603e Microprocessor Pinout Listings The following sections provide the pinout listings for the 603e CQFP and BGA packages. 1.6.1 Pinout Listing for the CQFP Package Table 10 provides the pinout listing for the 603e CQFP package. Table 10. Pinout Listing for the 240-pin CQFP Package

Contextual Info: TMS320C6472 SPRS612G – JUNE 2009 – REVISED JULY 2011 1.1 www.ti.com CTZ/ZTZ BGA Package Bottom View The TMS320C6472 devices are designed for a package temperature range of 0°C to 85°C (commercial temperature range) or -40°C to 100°C (extended temperature range).

actel cqfp 84

Abstract: actel a1020b RT1425A actel a1010b actel 172 cqfp
Contextual Info: Package Options: User I/Os per Package January 1999 1999 Actel Corporation 1 Commercial/Industrial Devices RQFP VQFP TQFP BGA CPGA CQFP 129 172 172 125 176 34 57 69 69 72 83 72 72 57 125 125 152 125 176 176 202 176 176 202 57 78 112 129 78 144 78 112 144

Contextual Info: 240PIN DDR2 400 Registered DIMM 4096MB With 256Mx4 CL3 TS512MQR72V4T Placement Description The TS512MQR72V4T is a 512M x 72bits DDR2-400 Registered DIMM. The TS512MQR72V4T consists of 18 pcs st.512Mx4bits DDR2 SDRAMs in 56 ball BGA package, 2 pcs register in 96 ball uBGA package, 1 pcs

Contextual Info: 1.5 PowerPC 604 Microprocessor Pinout Listings The follow ing sections contain the pinout listings for the 604 C4-CQFP and BGA packages. 1.5.1 Pinout Listing for the C4-CQFP Package Table 9 provides the pinout listing for the 6 0 4 C 4 -C Q F P package. Table 9. Pinout Listing for the C4-CQFP Package

SF-PLCC84-J-01

Abstract: PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket
Contextual Info: Ironwood Electronics Surface Mount Package Emulation SF.1 Ironwood has developed the industry's widest range of interconnection adapters for testing and socketing of surface mount technology. We offer SMT bases and thru-hole adapters for BGA, PLCC, QFP, and SOIC packages.

Toshiba NAND BGA 224

Abstract: Toshiba emmc Toshiba BGA 224 toshiba emmc 4.41 4GB eMMC toshiba THGBM THGBM3G emmc jedec THGBM3G5 THGB
Contextual Info: Preliminary THGBM3G5D1FBAIE TOSHIBA e-MMC Module 4GB THGBM3G5D1FBAIE INTRODUCTION THGBM3G5D1FBAIE is 4-GByte density of e-MMC Module product housed in 169 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device s and controller chip assembled as Multi Chip Module.

Toshiba emmc

Abstract: THGBM eMMC data retention Toshiba NAND BGA 224 P-TFBGA153-1113-0 THGBM3G4D1FBAIG BGA 221 eMMC toshiba Toshiba emmc performance THGBM3G
Contextual Info: Preliminary THGBM3G4D1FBAIG TOSHIBA e-MMC Module 2GB THGBM3G4D1FBAIG INTRODUCTION THGBM3G4D1FBAIG is 2-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device s and controller chip assembled as Multi Chip Module.

CMOS-9HD

Abstract: NEC stacked CSP 2000 L302 FPBGA NEC 2000 stacked
Contextual Info: NEC Electronics Inc. CMOS-9HD 3.3-Volt, 0.35-Micron drawn CMOS Gate Array Preliminary Description January 1998 Figure 1. Tape BGA and Chip Size Package NEC's CMOS-9HD, density-enhanced, 0.35 µm gate array family delivers a complete, low-cost answer to modern-day

SF-BGA172A-B-11

Contextual Info: D Package Code: BGA172A C See BGA pattern code to the right for actual pattern layout Y 21.59mm [0.850"] X 15.24mm [0.600"] Top View reference only 1.27mm typ. [0.050"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] Ø 0.64mm pad [Ø 0.025"] B 1

DT1X

Abstract: ADSP-21065LKCA-240 ADSP21000 ADSP-21000 ADSP-21060 ADSP-21062 ADSP-21065L 74 HTC 00 ADSP-21065LCS-240
Contextual Info: a DSP Microcomputer ADSP-21065L SDRAM Controller for Glueless Interface to Low Cost External Memory @ 66 MHz 64M Words External Address Range 12 Programmable I/O Pins and Two Timers with Event Capture Options Code-Compatible with ADSP-2106x Family 208-Lead MQFP or 196-Ball Mini-BGA Package

ADSP21000

Abstract: ADSP-21000 ADSP-21060 ADSP-21062 ADSP-21065L DSP-66 TRD-G
Contextual Info: a DSP Microcomputer ADSP-21065L SDRAM Controller for Glueless Interface to Low Cost External Memory @ 66 MHz 64M Words External Address Range 12 Programmable I/O Pins and Two Timers with Event Capture Options Code-Compatible with ADSP-2106x Family 208-Lead MQFP or 196-Ball Mini-BGA Package

ADSP-21000

Abstract: ADSP-21060 ADSP-21062 ADSP-21065L 74 HTC 164
Contextual Info: a DSP Microcomputer ADSP-21065L SDRAM Controller for Glueless Interface to Low Cost External Memory @ 66 MHz 64M Words External Address Range 12 Programmable I/O Pins and Two Timers with Event Capture Options Code-Compatible with ADSP-2106x Family 208-Lead MQFP or 196-Ball Mini-BGA Package