BGA PACKAGE TOP MARK Search Results

ADV0012

Abstract: ALTERA PART MARKING altera top marking altera date code format BGA PACKAGE TOP MARK altera marking "lot Code" altera ALTERA BGA packages PART MARKING altera lot code format topmark
Contextual Info: CUSTOMER ADVISORY BGA PACKAGE TOP MARK ENHANCEMENT Altera will begin marking a one-line internal traceability code on all BGA packages beginning January 2001. The Altera lot number, country of origin, and new internal marking code will be laser marked, or ink marked, on the top of all BGA packages for

ADV0115

Abstract: improves EP20K200E EP20K300E
Contextual Info: CUSTOMER ADVISORY ADV0115 EP20K200E and EP20K300E 652-Ball BGA Package Improvement Change Description: The EP20K200E and EP20K300E 652-Ball BGA packages will be re-enforced with a stiffener added to the top of the package. Reason For Change: This change improves EP20K200E and EP20K300E 652-Ball BGA package coplanarity

ADV0201

Abstract: ALTERA PART MARKING altera top marking "lot Code" altera altera lot code format altera date code format altera "date code format" trace code altera marking Altera pdip top mark
Contextual Info: CUSTOMER ADVISORY ADV0201 NON-BGA PACKAGE TOP MARK ENHANCEMENT Change Description: Altera will begin marking the assembly lot number and a one-line internal traceability code on all non-BGA packages beginning March 2002. Reason For Change: The assembly lot number and new internal traceability marking code will be laser or ink

Contextual Info: TXB0104 4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTO DIRECTION SENSING AND ±15-kV ESD PROTECTION www.ti.com SCES650C – APRIL 2006 – REVISED NOVEMBER 2007 FEATURES 1 GXU/ZXU BGA PACKAGE (TOP VIEW) A TERMINAL ASSIGNMENTS (GXU/ZXU Package) B C

Contextual Info: TXB0104 4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTO DIRECTION SENSING AND ±15-kV ESD PROTECTION www.ti.com SCES650C – APRIL 2006 – REVISED NOVEMBER 2007 FEATURES 1 GXU/ZXU BGA PACKAGE (TOP VIEW) A TERMINAL ASSIGNMENTS (GXU/ZXU Package) B C

STV0299B

Abstract: STB6000 STV0297 STV0360 STV0299 COFDM Tuner demodulator application note receiver QAM STI5105 LQFP216 STM5105
Contextual Info: STM5105 Low-cost interactive set-top box decoder DATA BRIEF STM5105 is supplied in either 24 mm x 24 mm LQFP216 or 23 mm x 23 mm BGA package. DESCRIPTION STMicroelectronics sets a new standard for perfomance, price and integration in the single chip MPEG-2 set-top box decoder market with the

STV0299b

Abstract: STI5105 STB6000 STV0297 stv0299 STV0360 tuner dvb - c malaysia stb jtag cofdm dvb chip encoder LQFP216
Contextual Info: STM5105 Low-cost interactive set-top box decoder DATA BRIEF STM5105 is supplied in either 24 mm x 24 mm LQFP216 or 23 mm x 23 mm BGA package. DESCRIPTION STMicroelectronics sets a new standard for perfomance, price and integration in the single chip MPEG-2 set-top box decoder market with the

Contextual Info: TXB0104 4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTO DIRECTION SENSING AND ±15-kV ESD PROTECTION www.ti.com SCES650C – APRIL 2006 – REVISED NOVEMBER 2007 FEATURES 1 GXU/ZXU BGA PACKAGE (TOP VIEW) A TERMINAL ASSIGNMENTS (GXU/ZXU Package) B C

TXS0104EZXUR

Abstract: TXS01xx
Contextual Info: TXS0104E 4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN APPLICATIONS www.ti.com SCES651C – JUNE 2006 – REVISED JULY 2007 FEATURES GXU/ZXU BGA PACKAGE (TOP VIEW) A TERMINAL ASSIGNMENTS (GXU/ZXU Package) B C 4 3 2 1 A B C 4 A4 GND B4 3 A3

TXS0104EPWR

Abstract: YF04E TXS0104ED TXS0104EYZTR TXS0104EZXUR YF04
Contextual Info: TXS0104E 4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN APPLICATIONS www.ti.com SCES651C – JUNE 2006 – REVISED JULY 2007 FEATURES GXU/ZXU BGA PACKAGE (TOP VIEW) A TERMINAL ASSIGNMENTS (GXU/ZXU Package) B C 4 3 2 1 A B C 4 A4 GND B4 3 A3

Contextual Info: TXS0104E 4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN APPLICATIONS www.ti.com SCES651C – JUNE 2006 – REVISED JULY 2007 FEATURES GXU/ZXU BGA PACKAGE (TOP VIEW) A TERMINAL ASSIGNMENTS (GXU/ZXU Package) B C 4 3 2 1 A B C 4 A4 GND B4 3 A3

Contextual Info: TXS0104E 4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN APPLICATIONS www.ti.com SCES651C – JUNE 2006 – REVISED JULY 2007 FEATURES GXU/ZXU BGA PACKAGE (TOP VIEW) A TERMINAL ASSIGNMENTS (GXU/ZXU Package) B C 4 3 2 1 A B C 4 A4 GND B4 3 A3

Contextual Info: TXS0104E www.ti.com SCES651E – JUNE 2006 – REVISED AUGUST 2013 4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN AND PUSH-PULL APPLICATIONS Check for Samples: TXS0104E FEATURES 1 • • GXU/ZXU BGA PACKAGE (TOP VIEW) A B C 4 3 2 1 TERMINAL ASSIGNMENTS

YF04E

Contextual Info: TXS0104E www.ti.com SCES651E – JUNE 2006 – REVISED AUGUST 2013 4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN AND PUSH-PULL APPLICATIONS Check for Samples: TXS0104E FEATURES 1 • • GXU/ZXU BGA PACKAGE (TOP VIEW) A B C 4 3 2 1 TERMINAL ASSIGNMENTS

Contextual Info: Plastic Packages for Integrated Circuits Plastic Ball Grid Array Packages BGA o V100.11x11 A1 CORNER 100 BALL PLASTIC BALL GRID ARRAY PACKAGE A INCHES D A1 CORNER I.D. E B TOP VIEW 0.15 M C 0.006 0.08 0.003 M C A B A1 CORNER D1 10 9 8 7 6 5 4 3 2 1 S A1

4925 B

Abstract: tray datasheet bga JEP95 4925 B transistor OB35
Contextual Info: BGA Package 35-Lead 11.25mm x 6.25mm × 3.42mm (Reference LTC DWG# 05-08-1878 Rev Ø) A aaa Z E Y Z DETAIL A A2 X PIN 1 3 A1 A ccc Z PIN “A1” CORNER G SEE NOTES b B 4 C D b1 MOLD CAP D F E SUBSTRATE 0.27 – 0.37 // bbb Z aaa Z G H DETAIL B 5 PACKAGE TOP VIEW

tray datasheet bga

Abstract: 4925 B JEP95
Contextual Info: BGA Package 35-Lead 11.25mm x 6.25mm × 4.92mm (Reference LTC DWG# 05-08-1879 Rev Ø) A aaa Z E Y Z DETAIL A A2 X PIN 1 3 A1 A ccc Z PIN “A1” CORNER G SEE NOTES b B 4 C D b1 MOLD CAP D F E SUBSTRATE 0.27 – 0.37 // bbb Z aaa Z G H DETAIL B 5 PACKAGE TOP VIEW

JEP95

Abstract: tray datasheet bga MS-028
Contextual Info: BGA Package 45-Lead 11.25mm x 9.00mm × 4.92mm (Reference LTC DWG# 05-08-1869 Rev Ø) A aaa Z E Y Z DETAIL A A2 X G SEE NOTES PIN 1 3 A1 A ccc Z PIN “A1” CORNER B 4 b D b1 MOLD CAP D C F E SUBSTRATE 0.27 – 0.37 // bbb Z aaa Z G H DETAIL B 7 PACKAGE TOP VIEW

4925 B

Abstract: MS-028 BGA package tray 40 x 40 JEP95 tray datasheet bga JEP95 MS-028
Contextual Info: BGA Package 40-Lead 11.25mm x 6.25mm × 4.92mm (Reference LTC DWG# 05-08-1867 Rev Ø) A aaa Z E Y Z DETAIL A A2 X G SEE NOTES PIN 1 3 A1 A ccc Z PIN “A1” CORNER B 4 b D b1 MOLD CAP D C F E SUBSTRATE 0.27 – 0.37 // bbb Z aaa Z G H DETAIL B 5 PACKAGE TOP VIEW

BGA 15X15

Contextual Info: Plastic Packages for Integrated Circuits Plastic Ball Grid Array Packages BGA o A A1 CORNER V196.15x15 D 196 BALL PLASTIC BALL GRID ARRAY PACKAGE INCHES A1 CORNER I.D. E B TOP VIEW 0.15 M C A B 0.006 0.08 M C 0.003 b A1 CORNER D1 14 13 12 11 10 9 8 7 6 5 4 3 2 1

Contextual Info: Plastic Packages for Integrated Circuits Plastic Ball Grid Array Packages BGA o V256.17x17 A A1 CORNER D 256 BALL PLASTIC BALL GRID ARRAY PACKAGE A1 CORNER I.D. INCHES SYMBOL E B TOP VIEW 0.15 MC A B 0.006 0.08 C 0.003 M b A1 CORNER D1 A1 CORNER I.D. 16 15 14 13 121110 9 8 7 6 5 4 3 2 1

Contextual Info: Plastic Packages for Integrated Circuits Plastic Ball Grid Array Packages BGA o A A1 CORNER V196.12x12 D 196 BALL PLASTIC BALL GRID ARRAY PACKAGE INCHES A1 CORNER I.D. E B TOP VIEW 0.15 M C A B 0.006 0.08 M C 0.003 b A1 CORNER D1 14 13 12 11 10 9 8 7 6 5 4 3 2 1

V160

Contextual Info: Plastic Packages for Integrated Circuits Plastic Ball Grid Array Packages BGA o A A1 CORNER V160.12x12A D 160 BALL PLASTIC BALL GRID ARRAY PACKAGE INCHES A1 CORNER I.D. E B TOP VIEW 0.15 M C A B 0.006 0.08 M C 0.003 b A1 CORNER D1 14 13 12 11 10 9 8 7 6 5 4 3 2 1

bga socket

Abstract: A814
Contextual Info: GHZ BGA Socket and SMT adaptor Page 1 of 2 Assembly Instructions 1. Apply water soluble or no clean flux on the target PCB lands. 2. Apply a small amount of TAC flux on opposite corners of the PCB lands. 3. Note the target board land pattern orientation and the adaptor's orientation mark. Place SMT adaptor solder ball side down onto