BGA PACKAGE WEIGHT Search Results

256-pin Plastic BGA

Abstract: BGA-256P-M21
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC BGA-256P-M21 256-pin plastic BGA Ball pitch 1.27 mm Package width x package length 27.00 × 27.00 mm Sealing method Plastic mold Mounting height 2.53 mm MAX Weight Approx. 2.7 g BGA-256P-M21

PCN0214

Abstract: Altera bga BGA PACKAGE OUTLINE 672-BALL EP1M120 EP20K1000E EPXA10 amkor flip alsic
Contextual Info: PROCESS CHANGE NOTICE PCN0214 Copper Lid for Selected Altera BGA and FineLine BGA® Packages Change Description: Altera will be transitioning to an industry-standard copper lid, for its flip-chip BGA and flip-chip FineLine BGA package offerings. Reason for Change:

SN74V293

Contextual Info: Application Report SDMA002A - April 2002 Design Considerations of SN74V293 FIFO in a MicroSTAR BGA Package Gary Khazan and Andy Pauley Standard Linear & Logic ABSTRACT Texas Instruments’ near-chip-scale MicroSTAR BGA package is gaining in popularity for

IPC-D-317A

Abstract: SN74V293 capacitance in BGA package SDMA002 IPC-D-317
Contextual Info: Application Report SDMA002 - June 2001 Design Considerations of SN74V293 FIFO in a MicroSTAR BGA Package Gary Khazan and Andy Pauley Standard Linear & Logic ABSTRACT Texas Instruments’ near-chip-scale MicroSTAR BGA package is gaining in popularity for

"0.4mm" bga "ball collapse" height

Abstract: BGA Solder Ball 0.35mm collapse BGA Package 0.35mm pitch BGA Solder Ball collapse BGA Solder Ball 0.35mm 0.4mm pitch BGA routing tms320 solder reflow TMS320 bga AN1231 TMS320
Contextual Info: TMS320 DSP Number 89 DESIGNER’S NOTEBOOK TMS320C6x Manufacturing with the BGA Package Contributed by David Bell April 14, 1998 Design Problem How do I solder the TMS320C6x to a board? Solution The TMS320C6x DSP has been manufactured in the BGA package due to its smaller

12x12 bga thermal resistance

Abstract: SZZA005 micro pitch BGA A113 TMS320VC549 TMS320VC549GGU BGA Ball Crack
Contextual Info: Application Report 1998 MicroStar BGA Printed in U.S.A 11/98 SZZA005 MicroStar BGA Semiconductor Group Package Outline Application Report Kevin Lyne and Charles Williams Prepared by: Tanvir Raquib SZZA005 November 1998 Printed on Recycled Paper IMPORTANT NOTICE

GE863-GPS

Contextual Info: wireless solutions wireless solutions GE 863-GPS Embedded SiRF Powered The new GE863-GPS is the smallest combined GPRS/GPS module on the market! BGA Package The unique Ball-Grid-Array BGA package enables a very low profile and small product size to design extremely compact applications using location technology.

69-pin

Abstract: BGA-69P-M02 019G
Contextual Info: FINE PITCH BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 69 PIN PLASTIC BGA-69P-M02 69-pin plastic FBGA Ball pitch 0.80 mm Pin pitch Package width x package length 8.0 × 11.0 mm Sealing method Plastic mold Mounting height 1.40 mm MAX Weight

BGA-77P-M01

Contextual Info: FINE PITCH BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 77 PIN PLASTIC BGA-77P-M01 77-pin plastic FBGA Ball pitch 0.80 mm Pin pitch Package width x package length 9.0 × 14.0 mm Sealing method Plastic mold Mounting height 1.40 mm MAX Weight

Contextual Info: FINE PITCH BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 61 PIN PLASTIC BGA-61P-M02 61-pin plastic FBGA Ball pitch 0.80 mm Pin pitch Package width x package length 9.0 × 9.0 mm Sealing method Plastic mold Mounting height 1.40 mm MAX Weight About 0.16 g

BGA-120P-M01

Abstract: 120-PIN BGA120
Contextual Info: FINE PITCH BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC BGA-120P-M01 120-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 13 Package width x package length 12.00 × 12.00 mm Sealing method Plastic mold Mounting height 1.45 mm MAX

BGA-484P-M09

Contextual Info: PLASTIC BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 484 PIN PLASTIC BGA-484P-M09 484-pin plastic TEBGA Ball pitch 1.00 mm Package width x package length 27.00 mm × 27.00 mm Lead shape Ball Sealing method Plastic mold Mounting height 2.36 mm Max

BGA-320P-M06

Contextual Info: PLASTIC BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 320 PIN PLASTIC BGA-320P-M06 320-pin plastic PBGA Lead pitch 1.27 mm Package width x package length 27.00 mm × 27.00 mm Lead shape Ball Sealing method Plastic mold Mounting height 2.46 mm Max

544-PIN

Abstract: BGA-544P-M04 544P KF1027A-2.54-4P
Contextual Info: PLASTIC BALL GRID ARRAY PACKAGE FUJITSU MICROELECTRONICS DATA SHEET 544 PIN PLASTIC BGA-544P-M04 544-pin plastic PBGA Lead pitch 1.00 mm Package width x package length 27.00 mm × 27.00 mm Lead shape Ball Sealing method Plastic mold Mounting height 2.36 mm MAX

Contextual Info: TXB0104 4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTO DIRECTION SENSING AND ±15-kV ESD PROTECTION www.ti.com SCES650C – APRIL 2006 – REVISED NOVEMBER 2007 FEATURES 1 GXU/ZXU BGA PACKAGE (TOP VIEW) A TERMINAL ASSIGNMENTS (GXU/ZXU Package) B C

Contextual Info: TXB0104 4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTO DIRECTION SENSING AND ±15-kV ESD PROTECTION www.ti.com SCES650C – APRIL 2006 – REVISED NOVEMBER 2007 FEATURES 1 GXU/ZXU BGA PACKAGE (TOP VIEW) A TERMINAL ASSIGNMENTS (GXU/ZXU Package) B C

Contextual Info: TXB0104 4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTO DIRECTION SENSING AND ±15-kV ESD PROTECTION www.ti.com SCES650C – APRIL 2006 – REVISED NOVEMBER 2007 FEATURES 1 GXU/ZXU BGA PACKAGE (TOP VIEW) A TERMINAL ASSIGNMENTS (GXU/ZXU Package) B C

jesd 51-7

Abstract: 63 ball Vfbga thermal resistance 56DL metcal apr 5000 MO-205 56ZQL BGA Ball Crack 054UG08C127 APR-5000
Contextual Info: Application Report SZZA040 - December 2003 54BGA Package Frank Mortan SLL Package Development ABSTRACT The TI 54-ball low-profile, fine-pitch, ball grid array TFBGA meets dimensions specified in JEDEC MO-205, Variation DD. This 0.8-mm-pitch BGA allows economical OEM designs

Contextual Info: TMS320C6472 SPRS612G – JUNE 2009 – REVISED JULY 2011 1.1 www.ti.com CTZ/ZTZ BGA Package Bottom View The TMS320C6472 devices are designed for a package temperature range of 0°C to 85°C (commercial temperature range) or -40°C to 100°C (extended temperature range).

BGA-3000

Abstract: Intel reflow soldering profile BGA BGA-3102 BGA-3101 convection oven temperature sensor intel 3102 DIAPHRAGM PUMP rtd 2025 vacuum pump 28F008B3
Contextual Info: CSP-UG Chip-Scale Upgrade Kit for BGA-3000 Series Rework System 1 The rapidly emerging Chip-Scale Package has been associated with many challenges in both the rework and prototyping environment. This particular package demands a specifically tailored rework solution while maintaining user-friendliness.

AceXtreme C SDK Software Reference Manual

Contextual Info: Total-AceXtreme Ultra-Small, Ultra-Low Power MIL-STD-1553 Single Package Solution Model: BU-67301B Data Sheet World's smallest, ultra low power, fully integrated MIL-STD-1553 BGA package, complete with 1553 protocol, 2 Mb 64K x 36 RAM, transceivers, and isolation transformers inside a single package — saves board space and

MCP 256M nand toshiba

Abstract: TY80009000AMGF toshiba mcp FBGA149 toshiba mcp nand 512M nand mcp nand sdram mcp TOSHIBA M9
Contextual Info: TY80009000AMGF TOSHIBA MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS Low Power SDRAM and Nand E2PROM Mixed Multi-Chip Package Lead-Free DESCRIPTION The TY80009000AMGF is a mixed multi-chip package containing a 268,435,456-bit Low Power Synchronous DRAM and a 553,648,128-bit Nand E2PROM. The TY80009000AMGF is available in a 149-pin BGA package

TXS0104EZXUR

Abstract: TXS01xx
Contextual Info: TXS0104E 4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN APPLICATIONS www.ti.com SCES651C – JUNE 2006 – REVISED JULY 2007 FEATURES GXU/ZXU BGA PACKAGE (TOP VIEW) A TERMINAL ASSIGNMENTS (GXU/ZXU Package) B C 4 3 2 1 A B C 4 A4 GND B4 3 A3

TPA2000D1PW

Abstract: TPA2000D1PWR 2512067007Y3 GRM235-Y5V106Z16 SCD0703T TPA2000D1 TPA2000D1GQCR
Contextual Info: TPA2000D1 2-W FILTERLESS MONO CLASS-D AUDIO POWER AMPLIFIER SLOS328E – JUNE 2000 – REVISED MAY 2003 D Modulation Scheme Optimized to Operate PW PACKAGE TOP VIEW Without a Filter D 4 mm x 4 mm MicroStar Junior BGA and D D D D D TSSOP Package Options