BGA SOLDER BALL 0.6MM Search Results

BGA SOLDER BALL 0.6MM Result Highlights (5)

Part	Manufacturer	Description	Download
CN-AC3MMDZBAU	Amphenol Cables on Demand	3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts)	Datasheet
CN-DSUB50PIN0-000	Amphenol Cables on Demand	Amphenol CN-DSUB50PIN0-000 D-Subminiature (DB50 Male D-Sub) Connector, 50-Position Pin Contacts, Solder-Cup Terminals	Datasheet
CN-DSUBHD62PN-000	Amphenol Cables on Demand	Amphenol CN-DSUBHD62PN-000 High-Density D-Subminiature (HD62 Male D-Sub) Connector, 62-Position Pin Contacts, Solder-Cup Terminals	Datasheet
CN-DSUB25SKT0-000	Amphenol Cables on Demand	Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals	Datasheet
CN-DSUBHD26SK-000	Amphenol Cables on Demand	Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals	Datasheet

BGA SOLDER BALL 0.6MM Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
entek Cu-56 Abstract: Cu-56 pcb warpage* in smt reflow pcb warpage after reflow Solder Paste, Indium, Type 3 thick bga die size bga thermal cycling reliability Text: Surface Laminar Circuit SLC Ball Grid Array (BGA) Eutectic Surface Mount Assembly Application Note 5026 Introduction Printed Circuit Design Package Description Avago Technologies used Entek Cu-56 surface for all evaluations. This document outlines the design and assembly guidelines for surface laminar circuitry (SLC) ball grid array	Original	PDF	Cu-56 5989-0491EN AV02-0770EN entek Cu-56 pcb warpage* in smt reflow pcb warpage after reflow Solder Paste, Indium, Type 3 thick bga die size bga thermal cycling reliability
BGA PROFILING Abstract: pcb warpage* in smt reflow thick bga die size BGA PACKAGE thermal profile bga thermal cycling reliability fine BGA thermal profile Avago cross JEDEC SMT reflow profile am-5534 BGA cte Text: Surface Laminar Circuit SLC Ball Grid Array (BGA) Lead-free Surface Mount Assembly Application Note 5363 Introduction Printed Circuit Design Package Description Avago Technologies used Entek Cu-HT surface for all evaluations. This document outlines the design and assembly guidelines for surface laminar circuitry (SLC) ball grid array	Original	PDF	J-STD-020. AV02-0767EN BGA PROFILING pcb warpage* in smt reflow thick bga die size BGA PACKAGE thermal profile bga thermal cycling reliability fine BGA thermal profile Avago cross JEDEC SMT reflow profile am-5534 BGA cte
BGA reflow guide Abstract: sn63pb37 solder SPHERES 1mm pitch BGA socket TL-VACUUMPEN-01 sn63pb37 solder wire ultra fine pitch BGA sn63pb37 0.4mm 20mm light dependent resistors 23M1 fine BGA thermal profile Text: Tel: 800 404-0204 • (651) 452-8100 Fax: (651) 452-8400 PO Box 21151 • St. Paul, MN 55121 • USA www.ironwoodelectronics.com GHz BGA Socket User Manual Selecting BGA socket: You need to have the IC package drawing ready to select the right BGA socket. Go to	Original	PDF
sn63pb37 solder wire Abstract: BGA reflow guide BGA PROFILING size 0204 100C TL-TORQUEDRIVER-09 sn63pb37 solder wire shelf life TL-TORQUEDRIVER-01 Text: GHz BGA Socket User Manual Tel: 800 404-0204 www.ironwoodelectronics.com GHZ BGA SOCKET USER MANUAL Table of Contents Selecting a BGA socket Socket Mechanics PCB Requirements Backing Plate BGA Socket Assembly MLF (QFN) Socket Assembly: Torque Driver Vacuum Pen	Original	PDF
SF-BGA128C-B-62 Abstract: No abstract text available Text: 10mm [0.394"] Top View 0.6mm [0.024"] Ordering Information: 0.6mm [0.024"] Solder Ball Alloy Part Number Suffix Sn63Pb37 -62 Sn96.5Ag3.0Cu0.5 10mm [0.394"] -62F* *RoHS Compliant 0.8mm typ. Detail A 8.8mm square [0.346"] Side View 0.89mm [0.035"] 2.48mm [0.098"]	Original	PDF	Sn63Pb37 254mm/0 203mm 254mm0 FR4/G10 equiva27 SF-BGA128C-B-62
SF-BGA144J-B-62 Abstract: No abstract text available Text: Top View 10mm [0.394"] 0.6mm [0.024"] Ordering Information: 0.6mm [0.024"] Solder Ball Alloy Part Number Suffix Sn63Pb37 -62 Sn96.5Ag3.0Cu0.5 10mm [0.394"] -62F* *RoHS Compliant 0.8mm typ. Detail A 8.8mm square [0.346"] Side View 0.89mm [0.035"] 2.48mm [0.098"]	Original	PDF	Sn63Pb37 254mm/0 203mm 254mm0 FR4/G10 SF-BGA144J-B-62
bga 484 0.8mm pitch Abstract: SF-BGA484E-B-62 Text: 18mm [0.709"] Top View Ordering Information: Solder Ball Alloy 0.6mm [0.024"] Part Number Suffix Sn63Pb37 0.6mm [0.024"] -62 Sn96.5Ag3.0Cu0.5 RoHS Compliant -62F 18mm [0.709"] 0.8mm typ. Detail A 0.89mm [0.035"] 2.83mm [0.112"] 16.8mm square [0.661"] Side View	Original	PDF	Sn63Pb37 254mm/0 203mm 254mm0 FR4/G10 SF-BGA484E-B-62 bga 484 0.8mm pitch
SF-BGA136C-B-62 Abstract: No abstract text available Text: 14mm [0.551"] Top View 0.6mm [0.024"] 0.8mm typ. 0.6mm [0.024"] 10mm [0.394"] 8.8mm [0.346"] Ordering Information: Solder Ball Alloy 12.8mm [0.504"] Part Number Suffix Sn63Pb37 -62 Sn96.5Ag3.0Cu0.5 -62F* Side View 2 Detail A *RoHS Compliant 2.83mm [0.112"]	Original	PDF	Sn63Pb37 254mm/0 203mm 254mm0 SF-BGA136C-B-62
SF-BGA240N-B-62F Abstract: No abstract text available Text: 18mm [0.709"] Top View RoHS COMPLIANT 0.6mm [0.024"] 0.6mm [0.024"] 18mm [0.709"] 0.8mm typ. 16.8mm [0.661"] 0.89mm [0.035"] Detail A Side View 16.8mm [0.661"] 0.89mm [0.035"] 0.89mm [0.035"] Detail A 2.83mm [0.112"] 2 2.48mm [0.098"] 1 3 0.36mm± 0.05mm [0.014"± 0.002"]	Original	PDF	254mm/0 203mm 254mm0 FR4/G10 SF-BGA240N-B-62F
transistor smd G46 Abstract: fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm Text: FBGA User’s Guide Version 4.2 -XO\ 7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG	Original	PDF	N32-2400 22142J transistor smd G46 fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm
7086 Abstract: BGA Solder Ball 0.6mm 0.35mm BGA SG-BGA-7086 BGA Solder Ball 0.35mm Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Top View Compression plate distributes forces evenly Easily removable swivel socket lid	Original	PDF	475mm. 525mm 725mm 025mm SG-BGA-7086 125mm. 7086 BGA Solder Ball 0.6mm 0.35mm BGA BGA Solder Ball 0.35mm
BGA Solder Ball 0.6mm Abstract: SF-BGA240N-B-61F Text: 0.6mm [0.024"] 18mm [0.709"] 0.6mm [0.024"] 18mm [0.709"] 0.8mm typ. 16.8mm square [0.661"] Top View 0.2mm dia. [0.008"] 2 1 3.87mm ± 0.254mm [0.152"±0.010"] 0.8mm typ. 3 Side View 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. non	Original	PDF	254mm FR4/G10 22x22 SF-BGA240N-B-61F BGA Solder Ball 0.6mm
SF-BGA304A-B-05 Abstract: No abstract text available Text: Top View 38.73mm [1.525"] 2.5mm [0.098"] 27.94mm [1.100"] 3.27mm [0.129"] 2.5mm [0.098"] 2.54mm [0.100"] 2.89mm [0.114"] 33.72mm [1.328"] 38.73mm [1.525"] 27.94mm [1.100"] 1.27mm typ. [0.050"] 5.08mm [0.200"] 0-80 Threaded Insert Ø 0.6mm typ. [Ø 0.024"]	Original	PDF	FR4/G10 Sn63Pb37 SF-BGA304A-B-05
EA-190-H125-T710 Abstract: EA-425-H125-T710 EA-190-H095-T710 EA-190-H195-T710 EA-190-H145-T710 EA-190-H175-T710 EA-400-H245-T710 EA-400-H145-T710 EA-400-H175-T710 EA-400-H095-T710 Text: Aavid Clip Attach E for Series Aavid Clip Attach E-Series BGAs AAVID CLIP ATTACH E-SERIES Introducing Aavid’s line of clip attach heat sinks for BGA applications. The series utilizes an easy to mount plastic frame along with flexible wire springs. The wire springs are resistant to breakage and allow	Original	PDF	UL94V-0 EA-190-H125-T710 EA-425-H125-T710 EA-190-H095-T710 EA-190-H195-T710 EA-190-H145-T710 EA-190-H175-T710 EA-400-H245-T710 EA-400-H145-T710 EA-400-H175-T710 EA-400-H095-T710

fcBGA PACKAGE thermal resistance Abstract: FCBGA 676 BGA package tray QFP PACKAGE thermal resistance FC-BGA 1mm pitch BGA socket PEAK tray drawing nec shipping method reball tray sunrise Text: FCBGA Flip Chip Ball Grid Array "Leading Future PKG Technology" NEC FCBGA Contents 1. What is an FCBGA? . 3 2. Advantages . 4 3. Line up . 5	Original	PDF	C13902EJ1V0PF00 fcBGA PACKAGE thermal resistance FCBGA 676 BGA package tray QFP PACKAGE thermal resistance FC-BGA 1mm pitch BGA socket PEAK tray drawing nec shipping method reball tray sunrise
taiyo PSR4000 Abstract: Shipping Trays kostat 10 x 10 nitto hc100 Kostat tray PSR4000 aus5 EPAK EPAK TRAY JEDEC Kostat PSR4000 aus5 Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2	Original	PDF
fBGA package tray 12 x 19 Abstract: EPAK TRAY FBGA THICK TRAY fbga Substrate design guidelines JEDEC Kostat FBGA EPAK Kostat PSR4000 SLB128B AN-1125 Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2	Original	PDF
NET2272REV1A-LF Abstract: ph12 diode usb to rj45 extenders ADSP-BF537BBCZ 27.4x27.4 tmc* usb R11u 749010010 PH12 footprint PF48F2000P0ZBQ0S Text: Hardware User Manual TCM-BF537 V1.1 Including BGA and Border Pad Versions PRELIMINARY www.tinyboards.com Maximum Power at Minimum Size Bluetechnix www.tinyboards.com Maximum Power at Minimum Size Contact Bluetechnix Mechatronische Systeme GmbH Waidhausenstr. 3/19	Original	PDF	TCM-BF537 NET2272REV1A-LF ph12 diode usb to rj45 extenders ADSP-BF537BBCZ 27.4x27.4 tmc* usb R11u 749010010 PH12 footprint PF48F2000P0ZBQ0S
Untitled Abstract: No abstract text available Text: 4Mb: 256K x 18, 128K x 32/36 PIPELINED ZBT SRAM 4Mb ZBT SRAM MT55L256L18P1, MT55L256V18P1, MT55L128L32P1, MT55L128V32P1, MT55L128L36P1, MT55L128V36P1 3.3V VDD, 3.3V or 2.5V I/O FEATURES • • • • • • • • • • • • • • • • •	Original	PDF	119-pin 165-pin MT55L256L18P1
MS-026 Abstract: MT55L256L32F MT55L256L36F MT55L256V32F MT55L256V36F MT55L512L18F MT55L512V18F micron 100 ball BGA Text: 8Mb: 512K x 18, 256K x 32/36 FLOW-THROUGH ZBT SRAM MT55L512L18F, MT55L512V18F, MT55L256L32F, MT55L256V32F, MT55L256L36F, MT55L256V36F 8Mb ZBT SRAM 3.3V VDD, 3.3V or 2.5V I/O FEATURES • • • • • • • • • • • • • • • • • •	Original	PDF	MT55L512L18F, MT55L512V18F, MT55L256L32F, MT55L256V32F, MT55L256L36F, MT55L256V36F 100-Pin addres01 119-Pin 165-pin MS-026 MT55L256L32F MT55L256L36F MT55L256V32F MT55L256V36F MT55L512L18F MT55L512V18F micron 100 ball BGA
MS-026 Abstract: MT55L128L32P1 MT55L128L36P1 MT55L128V32P1 MT55L128V36P1 MT55L256L18P1 MT55L256V18P1 Text: 4Mb: 256K x 18, 128K x 32/36 PIPELINED ZBT SRAM 4Mb ZBT SRAM MT55L256L18P1, MT55L256V18P1, MT55L128L32P1, MT55L128V32P1, MT55L128L36P1, MT55L128V36P1 3.3V VDD, 3.3V or 2.5V I/O FEATURES • • • • • • • • • • • • • • • • •	Original	PDF	MT55L256L18P1, MT55L256V18P1, MT55L128L32P1, MT55L128V32P1, MT55L128L36P1, MT55L128V36P1 100-Pin 119-pin 165-pin MT55L256L18P1 MS-026 MT55L128L32P1 MT55L128L36P1 MT55L128V32P1 MT55L128V36P1 MT55L256V18P1
Untitled Abstract: No abstract text available Text: PRELIMINARY 4Mb: 256K x 18, 128K x 32/36 3.3V I/O PIPELINED, DCD SYNCBURST SRAM 4Mb SYNCBURST SRAM MT58L256L18D1, MT58L128L32D1, MT58L128L36D1 3.3V VDD, 3.3V I/O, Pipelined, DoubleCycle Deselect FEATURES 100-Pin TQFP1 • Fast clock and OE# access times	Original	PDF	MT58L256L18D1, MT58L128L32D1, MT58L128L36D1 100-Pin 119-Pin 165-pin MT58L256L18D1
MS-026 Abstract: MT55L256L32P MT55L256L36P MT55L256V32P MT55L256V36P MT55L512L18P MT55L512V18P Text: 8Mb: 512K x 18, 256K x 32/36 PIPELINED ZBT SRAM 8Mb ZBT SRAM MT55L512L18P, MT55L512V18P, MT55L256L32P, MT55L256V32P, MT55L256L36P, MT55L256V36P 3.3V VDD, 3.3V or 2.5V I/O FEATURES • • • • • • • • • • • • • • • • • • •	Original	PDF	MT55L512L18P, MT55L512V18P, MT55L256L32P, MT55L256V32P, MT55L256L36P, MT55L256V36P 100-Pin 119-Pin 165-pin MT55L512L18P MS-026 MT55L256L32P MT55L256L36P MT55L256V32P MT55L256V36P MT55L512V18P
Untitled Abstract: No abstract text available Text: 4Mb: 256K x 18, 128K x 32/36 FLOW-THROUGH ZBT SRAM 4Mb ZBT SRAM MT55L256L18F1, MT55L128L32F1, MT55L128L36F1; MT55L256V18F1, MT55L128V32F1, MT55L128V36F1 3.3V VDD, 3.3V or 2.5V I/O FEATURES • • • • • • • • • • • • • • • • •	Original	PDF	MT55L256L18F1, MT55L128L32F1, MT55L128L36F1; MT55L256V18F1, MT55L128V32F1, MT55L128V36F1 100-Pin August/7/00 165-pin MT55L256L18F1

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BGA SOLDER BALL 0.6MM Search Results

BGA SOLDER BALL 0.6MM Result Highlights (5)

BGA SOLDER BALL 0.6MM Datasheets Context Search

entek Cu-56

BGA PROFILING

BGA reflow guide

sn63pb37 solder wire

SF-BGA128C-B-62

SF-BGA144J-B-62

bga 484 0.8mm pitch

SF-BGA136C-B-62

SF-BGA240N-B-62F

transistor smd G46

7086

BGA Solder Ball 0.6mm

SF-BGA304A-B-05

EA-190-H125-T710

fcBGA PACKAGE thermal resistance

taiyo PSR4000

fBGA package tray 12 x 19

NET2272REV1A-LF

Untitled

MS-026

MS-026

Untitled

MS-026

Untitled