BGA256 Search Results

Contextual Info: Package outline BGA256: plastic ball grid array package; 256 balls; body 17 x 17 x 1.2 mm SOT811-1 B D D1 A ball A1 index area A E1 E A2 A1 detail X C e1 e 1/2 e y ∅w M C T R P N M L K J H G F E D C B A shape optional 4x y1 C ∅v M C A B b e e2 1/2 e

BGA256 17 X 17

Abstract: BGA256 MS-034 BGA-256 sot811 BGA256 17
Contextual Info: PDF: 2003 Apr 17 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 17 x 17 x 1.2 mm SOT811-1 B D D1 A ball A1 index area A E1 E A2 A1 detail X C e1 e 1/2 e ∅v M b ∅w M T R P N M L K J H G F E D C B A shape

PB-BGA256J-Z-01

Abstract: SF-BGA256J-B-01 SF-BGA232A-B-01
Contextual Info: U.S. PATENT 6,351,392 78.64mm [3.096"] 2.54mmtyp. [0.100"] 19.23mm [0.757"] 50.8mm [2.000"] Top View 1 * This height variable depends on the screw position. * 2 9.97mm [0.393"] 12.6mm [0.496"] 6mm [0.236"] Side View For Probing BGA256J use SF-BGA256J-B-01

BGA256

Abstract: sot466 BGA256 17 X 17
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.75 mm SOT466-1 D D1 ball A1 index A2 A A1 E1 E detail X k k A ZD b e ∅w M y v A ZE Y W V U T R P e N M L K J H G F E D C B A 2 1

P-BGA256-17x17-1

Abstract: P-BGA-256-1 PRBG0256FB-A
Contextual Info: JEITA Package Code P-BGA256-17x17-1.00 RENESAS Code PRBG0256FB-A D B D1 Previous Code 256F7X-D MASS[Typ.] 0.8g A A ZD b S AB e ZE T R P N M L K J H G F E D C B A E1 E e A1 Reference Symbol y S 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Index mark S D E A A1 e

P-BGA256-27x27-1

Abstract: PRBG0256DA-A
Contextual Info: JEITA Package Code P-BGA256-27x27-1.27 RENESAS Code PRBG0256DA-A Previous Code 256F7X-A D A b A ZD A1 S AB e Y W V U T R P N M L E1 K J H G F E D C B A y S 1pin corner S ZE E e B D1 MASS[Typ.] 2.1g 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Reference

BGA256

Abstract: BGA256 17 X 17
Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.75 mm SOT466-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A Y W V U e T R P N M L e1 K

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA256 package SOT811-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

PRBG0256DD-A

Abstract: 2.5G P-BGA-256-2
Contextual Info: JEITA Package Code P-BGA256-27x27-1.27 RENESAS Code PRBG0256DD-A D MASS[Typ.] 2.5g A A D1 B Previous Code 256F7X-F ZD b S AB e ZE Y W V U T R P N M L K J H G F E D C B A E1 E e A1 y S S 1pin corner 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Reference

BP-256

Abstract: P-BGA256-27x27-1 PRBG0256DE-A
Contextual Info: JEITA Package Code P-BGA256-27x27-1.27 RENESAS Code PRBG0256DE-A Previous Code BP-256 MASS[Typ.] 3.0g D A E B x4 v y1 S y A1 A S S SD e e Y W V U T Reference Symbol R P SE N M L Dimension in Millimeters Min Nom D 27.0 E 27.0 v K Max 0.20 w J H A G A1 F 2.5

BGA256

Contextual Info: P-BGA256-1717-1.00AZ Uniti nn Jul.2003

Contextual Info: Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C Y W e V U T R P N M L e2 K J 1/2 e H F D B G E C A shape optional 4x

D 2395

Abstract: BGA256 17 X 17 BGA256 MS-034
Contextual Info: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C Y W e V U T R P N M L

sm 0038

Abstract: SF-BGA256B-B-11
Contextual Info: D Package Code: BGA256B C 19.05mm [0.750"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] X 19.05mm [0.750"] Top View reference only 2 1.27 mm [0.050"] 0.64mm [0.025"] 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]

16X16

Abstract: SF-BGA256F-B-11
Contextual Info: D Package Code: BGA256F C 19.05mm [0.750"] See BGA pattern code to the right for actual pattern layout Y 0.69mm [0.027"] 0.64mm [0.025"] X 19.05mm [0.750"] Top View reference only 1.27mm typ. [0.050"] 0.64mm [0.025"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]

16x16 bga

Abstract: 16X16 SF-BGA256G-B-11
Contextual Info: C Package Code: BGA256G D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 15.00mm [0.591"] X Top View (reference only) 1.00mm pitch typ. 0.50mm [0.020"] 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.508 mm [0.020"]

BGA256

Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A Y W V U e T R P N M L e1 K

SF-BGA256C-B-11

Abstract: BGA 23 x 23 array
Contextual Info: D C Package Code: BGA256C See BGA pattern code to the right for actual pattern layout Y 27.94mm [1.100"] 0.64mm [0.025"] 0.89mm [0.035"] X Top View reference only 27.94mm [1.100"] 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"]

Contextual Info: P-BGA256-2727-1.27 5 Package material Ball material Package weight g Rev. No./Last Revised Epoxy resin Sn/Pb 2.22 TYP. 2/Oct. 28, 1996

P-BGA256-17x17-1

Abstract: 17X17 PRBG0256FA-A
Contextual Info: JEITA Package Code P-BGA256-17x17-1.00 RENESAS Code PRBG0256FA-A D B D1 Previous Code 256F7X-C MASS[Typ.] 0.7g A b A S AB ZD e y S Index mark S ZE T R P N M L K J H G F E D C B A E1 E e A1 Reference Symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 D E A A1 e

SF-BGA256A-B-11

Contextual Info: D Package Code: BGA256A C 24.13mm [0.950"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.89mm [0.035"] 1.27 mm [0.050"] X Top View reference only 24.13mm [0.950"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"]

16x16 bga

Abstract: 16X16 SF-BGA256E-B-11
Contextual Info: C Package Code: BGA256E D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 15.00mm [0.591"] X Top View (reference only) 1.00mm pitch typ. 0.50mm [0.020"] 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.508 mm [0.020"]

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA256 package SOT471-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

sot471

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 D D1 ball A1 index A2 E1 E A A1 detail X k k A ZD b e y v A ∅w M ZE Y W V U T R P e N M L K J H G F E D C B A 2 1