MD-001A
Abstract: No abstract text available
Text: MN103E010HRA, MN103E040HYB Type MN103E010HRA MN103E040HYB Command Cache 16 K-byte 4-way, set-associative Data Cashe 16 K-byte (4-way, set-associative) SRAM Used by Both Instructions and Data Package 16 K-byte BGA292-P-2727 FLGA424-C-1717 7.5 ns (at 1.8 V tolerance = ± 5%, 133 MHz)
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MN103E010HRA,
MN103E040HYB
MN103E010HRA
BGA292-P-2727
FLGA424-C-1717
16/24/32-bit
16-bit
MD-001A
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0.3mm pitch BGA
Abstract: micro pitch BGA SF-BGA292D-B-11 1mm pitch BGA BGA 20x20
Text: C BGA292D D Ø 0.396mm x2 See BGA pattern code to the right for actual pattern layout Y (optional alignment hole) 1mm pitch typ. 19mm X Top View (reference only) Ø 0.508mm pad 3.48mm [0.137"] 2 0.5mm 0.3mm [0.012"] dia. 5.32mm [0.210"] 0.635mm 19mm B 1
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BGA292D
396mm
508mm
635mm
FR4/G10
20X20
488mm
SF-BGA292D-B-11
0.3mm pitch BGA
micro pitch BGA
1mm pitch BGA
BGA 20x20
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P-BGA-292
Abstract: PBGA292
Text: P-BGA292-2727-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.
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P-BGA292-2727-1
P-BGA-292
PBGA292
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C BGA292
Abstract: BGA292 MS-034 BGA-292 sot881
Text: Package outline Philips Semiconductors BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.55 mm D SOT881-1 B A D1 ball A1 index area A A2 A1 E1 E detail X C e1 e ∅v ∅w b 1/2 e y1 C C A B C M M y Y W e V U T R P N M L e2 K J H 1/2 e G
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BGA292:
OT881-1
OT881-1
MS-034
C BGA292
BGA292
MS-034
BGA-292
sot881
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BGA-292
Abstract: BGA292 C BGA292 MS-034
Text: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C Y W V U T R P N M L K
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BGA292:
OT489-1
MS-034
BGA-292
BGA292
C BGA292
MS-034
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SF-BGA292A-B-11
Abstract: No abstract text available
Text: D Package Code: BGA292A C 24.13mm [0.950"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.89mm [0.035"] 1.27 mm [0.050"] X Top View reference only 24.13mm [0.950"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"]
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BGA292A
FR4/G10
SF-BGA292A-B-11
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SD2608
Abstract: IEEE754 MN103E010HRA MN103E040HYB
Text: MN103E010HRA, MN103E040HYB Type MN103E010HRA MN103E040HYB Command Cache 16 K-byte 4-way, set-associative Data Cashe 16 K-byte (4-way, set-associative) SRAM Used by Both Instructions and Data Package 16 K-byte BGA292-P-2727 *Lead-free FLGA424-C-1717 *Lead-free
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MN103E010HRA,
MN103E040HYB
MN103E010HRA
BGA292-P-2727
FLGA424-C-1717
16/24/32-bit
SD2608
IEEE754
MN103E010HRA
MN103E040HYB
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sd2608
Abstract: 9801 nec IEEE754 MN103E010HRA MN103E040HYB pc9801 nec c bus
Text: MN103E010HRA, MN103E040HYB Type MN103E010HRA MN103E040HYB Instruction Cache 16 K-byte 4-way, set-associative Data Cashe 16 K-byte (4-way, set-associative) SRAM Used by Both Instructions and Data Package 16 K-byte BGA292-P-2727 *Lead-free FLGA424-C-1717 *Lead-free
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MN103E010HRA,
MN103E040HYB
MN103E010HRA
BGA292-P-2727
FLGA424-C-1717
16/24/32-bit
PC-9801
sd2608
9801 nec
IEEE754
MN103E010HRA
MN103E040HYB
pc9801 nec c bus
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MO-151
Abstract: BGA292 transistor t 04 27 C BGA292
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A Y W V U e T R P N M L e1 K
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BGA292:
OT489-1
MO-151
MO-151
BGA292
transistor t 04 27
C BGA292
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BGA292
Abstract: SF-BGA292B-B-11
Text: D Package Code: BGA292B C 22.86mm [0.900"] 0.71mm [0.028"] See BGA pattern code to the right for actual pattern layout Y 0.58mm [0.023"] X 22.86mm [0.900"] Top View reference only 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.71mm [0.028"] 5.33mm 3.74mm [0.147"]
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BGA292B
FR4/G10
SF-BGA292B-B-11
BGA292
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BGA292
Abstract: sot489 C BGA292
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 D D1 ball A1 corner A2 A A1 E1 E detail X k k A ZD b e ∅w M y v A ZE Y W V U T R P e N M L K J H G F E D C B A 2 1
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BGA292:
OT489-1
BGA292
sot489
C BGA292
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BGA292
Abstract: BGA-292
Text: Philips Semiconductors Package outlines BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm 1998 May 06 1 SOT489-1
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BGA292:
OT489-1
BGA292
BGA-292
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Untitled
Abstract: No abstract text available
Text: Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 b 1/2 e e ∅v M C A B y y1 C ∅w M C Y W V U T R P N M L K J H G F E D C B A e e2 1/2 e shape optional 4x
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BGA292:
OT489-1
MS-034
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Untitled
Abstract: No abstract text available
Text: Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.55 mm D SOT881-1 B A D1 ball A1 index area A A2 A1 E1 E detail X C e1 e Y V W T P M K H F D B ∅v ∅w b 1/2 e e U R N L e2 J 1/2 e G E C A shape optional 4x 1 2 3 4 5
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BGA292:
OT881-1
MS-034
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BGA292
Abstract: RGMII to SGMII RJ45 1000M PHY
Text: DP83864 DP83864 Quad GigPHYTER 10/100/1000 Ethernet Physical Layer Literature Number: SNLS172B September 2003 DP83864 Quad GigPHYTER 10/100/1000 Ethernet Physical Layer General Description Features bs ol e te The DP83864 is an extremely efficient full featured Quad • IEEE compliant 10BASE-T,100BASE-TX, 1000BASE-T
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DP83864
DP83864
SNLS172B
10BASE-T
100BASE-TX,
1000BASE-T
10BASE-T,
BGA292
RGMII to SGMII
RJ45 1000M PHY
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Nexus S JTAG pins
Abstract: mPC5746m Nexus S camera
Text: Freescale Semiconductor Application Note Document Number: AN4566 Rev 1, 05/2013 MPC5746M Hardware Design Guide by: Martin Vaupel and David McMenamin Contents 1 Introduction 1 The MPC5746M is a multi-core 32-bit microcontroller
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AN4566
MPC5746M
32-bit
e200z4
200MHz.
Nexus S JTAG pins
Nexus S camera
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Untitled
Abstract: No abstract text available
Text: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10
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MBL179
BGA156
OT472-1
BGA256
OT466-1
OT471-1
BGA292
OT489-1
BGA316
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A4H1
Abstract: HD6417750RBG240 264-PIN BSC COMPUTER SCIENCE digital logic design Notes Transistor mcr 22-8 413 REJ10B0210-0400 A5H1 zo 607 HD6417750RBP240V Tag 225 600 replacement
Text: REJ09B0366-0700 The revision list can be viewed directly by clicking the title page. The revision list summarizes the locations of revisions and additions. Details should always be checked by referring to the relevant text. SH7750, SH7750S, SH7750R Group 32
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REJ09B0366-0700
SH7750,
SH7750S,
SH7750R
32-Bit
Family/SH7750
A4H1
HD6417750RBG240
264-PIN
BSC COMPUTER SCIENCE digital logic design Notes
Transistor mcr 22-8 413
REJ10B0210-0400
A5H1
zo 607
HD6417750RBP240V
Tag 225 600 replacement
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SMD MARKING CODE 071 A01
Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Text: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods
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LCC-26P-M09
LCC-28P-M04
LCC-28P-M05
LCC-28P-M06
LCC-28P-M07
LCC-28C-A04
LCC-32P-M03
LCC-40P-M01
LCC-42P-M01
SMD MARKING CODE 071 A01
smd code 38P
LGA 1155 PIN diagram
MARKING CODE SMD IC A08
L QUAD Aluminum nitride
smd marking m05
LGA 1155 Socket PIN diagram
pitch 0.4 QFP 256p
marking code smd fujitsu
Texas Instruments epoxy Sumitomo
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SCHEMATIC ATI graphics card
Abstract: No abstract text available
Text: The revision list summarizes the locations of revisions and additions. Details should always be checked by referring to the relevant text. 32 SH7751 Group, SH7751R Group User’s Manual: Hardware Renesas 32-Bit RISC Microcomputer SuperH RISC engine Family / SH7750 Series
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SH7751
SH7751R
32-Bit
SH7750
R01UH0457EJ0301
los5-9670
R01UH0457EJ0301
REJ09B0370-0400)
SCHEMATIC ATI graphics card
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HD6417750SF167V
Abstract: BSC COMPUTER SCIENCE visual basic Notes HXXXXX hudi D63D48 SZ100 DBL 1035 Nippon capacitors SCHEMATIC ATI graphics card HD6417750BP200M
Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid
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SH7750,
SH7750S,
SH7750R
REJ09B0366-0700
HD6417750SF167V
BSC COMPUTER SCIENCE visual basic Notes
HXXXXX
hudi
D63D48
SZ100
DBL 1035
Nippon capacitors
SCHEMATIC ATI graphics card
HD6417750BP200M
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R2A25416SP
Abstract: SH7777 Renesas SH72546 Renesas SH72543 SH72544 car ECU training sh72543 R5E72546RKBG SH 72546 Wiring Diagram of NIPPON car center lock system
Text: 2009.10 Renesas Automotive www.renesas.com Introduction 1 Introduction 1 Imagination to Realize. Renesas Automotive Automotive Semiconductor Devices for the Future of Car Electronics The wider use of electronics in motor vehicles brings new requirements for automotive semiconductor devices.
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REJ01F0001-0300
R2A25416SP
SH7777
Renesas SH72546
Renesas SH72543
SH72544
car ECU training
sh72543
R5E72546RKBG
SH 72546
Wiring Diagram of NIPPON car center lock system
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BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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BGA16A1ATTERNS
BGA676
BGA665
BGA-1156
156 QFN 12X12
LGA240
BGA-783
BGA441
BGA1024
BGA1521
7286X
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Untitled
Abstract: No abstract text available
Text: AM33 MN103E Series AM33 (MN103E) Series The AM33 (MN103E) series is a group of 32-bit microprocessors suitable for multimedia uses such as movie, voice, graphics and communication. Its C-language-oriented architecture and C compiler which optimizes and outputs instruction code realize high performance with minimum
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MN103E)
32-bit
MN103)
VDD33
VDD18
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