BGA564 Search Results

Contextual Info: Package outline BGA564: plastic ball grid array package; 564 balls; body 40 x 40 x 1.75 mm SOT947-1 B D D1 A ball A1 index area E1 E A A1 A2 detail X e1 e ∅v ∅w b 1/2 e M M C C A B C y y1 C AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E

PRBG0564DA-A

Contextual Info: JEITA Package Code P-BGA564-37.5x37.5-1.27 RENESAS Code PRBG0564DA-A D MASS[Typ.] 6.2g A A D1 ZD A1 b S AB e y S Index mark S ZE AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A E1 E e B Previous Code 564F7X-B Reference Symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28

BGA676

Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18

Contextual Info: Uniti m P—BGA564—3131—1.00A9 ►— E 1, 0 AK AJ A) AA 0 ^ 00 0 0 0 0 0 0 0 0 0 0 OOOOOOOOOOOOOOf OOOOOOOOOOOOOOO OOOOOOOOOOOOOOO OOOOOOOOOOOOOOO OOOOOOOOOOOOOOO OOOOOOOOOOOOOOO OOOOOOOOOOOOOOO OOOOOOOOOOOOOOO OOOOOOOOOOOOOOéOOOOO OOOO^OOOOO OOOOO

Contextual Info: P—BGA564—3131—1.00A9 Uniti nn Jun.2005