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Microchip Technology Inc A42MX36-BGG272I IC FPGA 202 I/O 272BGA
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	A42MX36-BGG272I	Tray				1 - 10 - 100 - 1000 - 10000 -	Buy Now
NAC	A42MX36-BGG272I	Tray			40	1 - 10 - 100 - 1000 - 10000 -	Get Quote
Avnet Silica	A42MX36-BGG272I				40	1 - 10 - 100 - 1000 - 10000 -	Buy Now
EBV Elektronik	A42MX36-BGG272I			143 Weeks	40	1 - 10 - 100 - 1000 - 10000 -	Buy Now
Microchip Technology Inc A42MX36-BGG272-B4 A42MX36-BGG272-B4, PBGA, Projected EOL: 2025-06-28 - Contact for Pricing
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Microchip Technology Inc	A42MX36-BGG272-B4					1 - 10 - 100 - 1000 - 10000 -	Get Quote
Microchip Technology Inc A42MX36-BGG272I-B4 A42MX36-BGG272I-B4, PBGA, Projected EOL: 2023-03-02 - Contact for Pricing
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Microchip Technology Inc	A42MX36-BGG272I-B4					1 - 10 - 100 - 1000 - 10000 -	Get Quote
Microchip Technology Inc A42MX36-2BGG272 A42MX36-2BGG272
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
NAC	A42MX36-2BGG272	Tray			40	1 - 10 - 100 - 1000 - 10000 -	Get Quote
Microchip Technology Inc A42MX36-3BGG272I A42MX36-3BGG272I
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
NAC	A42MX36-3BGG272I	Tray			40	1 - 10 - 100 - 1000 - 10000 -	Get Quote

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BGG272 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
qfn 3x3 tray dimension Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga	PDF
xilinx topside marking Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G	PDF
xilinx part marking Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance	PDF
XILINX/part marking Hot Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160 Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160	PDF
BFG95 Contextual Info: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL	Original	UG112 UG072, UG075, XAPP427, BFG95	PDF
sumitomo g760 Abstract: sumitomo EME G760 SUMITOMO EME G770 IDT75N43102S50BCG KMC-3580 EME-G770 IDT75N414S125BC IDT70T653MS12BCG JESD22-B116 IDT75N43102S62BCG Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, Dan Jose, CA 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A-0607-05 DATE: 25-Aug-06 Product Affected: CABGA-256 17x17mm, CVBGA-52/56 4.5X7.0mm, FPBGA-96 5.5x13.5mm, FPBGA-208 15x15mm, PBGA-119	Original	25-Aug-06 CABGA-256 17x17mm, CVBGA-52/56 FPBGA-96 FPBGA-208 15x15mm, PBGA-119 22x14mm, PBGA-272/416 sumitomo g760 sumitomo EME G760 SUMITOMO EME G770 IDT75N43102S50BCG KMC-3580 EME-G770 IDT75N414S125BC IDT70T653MS12BCG JESD22-B116 IDT75N43102S62BCG	PDF