BK1608HS Search Results

Contextual Info: Spec Sheet NOISE SUPPRESSION COMPONENTS Multilayer Chip Bead Inductors BK series BK1608HS800-T Features Item Summary 80Ω, 600mA, 0603 Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping 4000pcs Products characteristics table External Dimensions

Contextual Info: Spec Sheet NOISE SUPPRESSION COMPONENTS Multilayer Chip Bead Inductors BK series BK1608HS241-T Features Item Summary 240Ω, 400mA, 0603 Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping 4000pcs Products characteristics table External Dimensions

Contextual Info: Spec Sheet NOISE SUPPRESSION COMPONENTS Multilayer Chip Bead Inductors BK series BK1608HS330-T Features Item Summary 33Ω, 1200mA, 0603 Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping 4000pcs Products characteristics table External Dimensions

Contextual Info: Spec Sheet NOISE SUPPRESSION COMPONENTS Multilayer Chip Bead Inductors BK series BK1608HS121-T Features Item Summary 120Ω, 500mA, 0603 Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping 4000pcs Products characteristics table External Dimensions

Contextual Info: Spec Sheet NOISE SUPPRESSION COMPONENTS Multilayer Chip Bead Inductors BK series BK1608HS241-T Features Item Summary 240Ω, 400mA, 0603 Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping 4000pcs Products characteristics table External Dimensions

Contextual Info: Spec Sheet NOISE SUPPRESSION COMPONENTS Multilayer Chip Bead Inductors BK series BK1608HS330-T Features Item Summary 33Ω, 1200mA, 0603 Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping 4000pcs Products characteristics table External Dimensions

Contextual Info: Spec Sheet NOISE SUPPRESSION COMPONENTS Multilayer Chip Bead Inductors BK series BK1608HS220-T Features Item Summary 22Ω, 1500mA, 0603 Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping 4000pcs Products characteristics table External Dimensions

Contextual Info: Spec Sheet NOISE SUPPRESSION COMPONENTS Multilayer Chip Bead Inductors BK series BK1608HS241-T Features Item Summary 240Ω, 400mA, 0603 Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping 4000pcs Products characteristics table External Dimensions

Contextual Info: Spec Sheet NOISE SUPPRESSION COMPONENTS Multilayer Chip Bead Inductors BK series BK1608HS102-T Features Item Summary 1000Ω, 300mA, 0603 Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping 4000pcs Products characteristics table External Dimensions

Contextual Info: Spec Sheet NOISE SUPPRESSION COMPONENTS Multilayer Chip Bead Inductors BK series BK1608HS600-T Features Item Summary 60Ω, 800mA, 0603 Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping 4000pcs Products characteristics table External Dimensions

Contextual Info: Spec Sheet NOISE SUPPRESSION COMPONENTS Multilayer Chip Bead Inductors BK series BK1608HS601-T Features Item Summary 600Ω, 350mA, 0603 Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping 4000pcs Products characteristics table External Dimensions

Contextual Info: Spec Sheet NOISE SUPPRESSION COMPONENTS Multilayer Chip Bead Inductors BK series BK1608HS241-T Features Item Summary 240Ω, 400mA, 0603 Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping 4000pcs Products characteristics table External Dimensions

BK1608HS102-T

Contextual Info: Spec Sheet NOISE SUPPRESSION COMPONENTS Multilayer Chip Bead Inductors BK series BK1608HS102-T Features Item Summary 1000Ω, 300mA, 0603 Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping 4000pcs Products characteristics table External Dimensions

Contextual Info: Spec Sheet NOISE SUPPRESSION COMPONENTS Multilayer Chip Bead Inductors BK series BK1608HS121-T Features Item Summary 120Ω, 500mA, 0603 Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping 4000pcs Products characteristics table External Dimensions

7SDMM-B0-2211-A

Abstract: 980020-48-P2 mt29f2g08aadwp connector 7sdmm-b0-2211 MT29F8G08AAAWP MT29F8G08A MT29F2G08AAD BSS138 NXP 7SDMM 7SDMM-B0-2211
Contextual Info: SCH-VAL314x-01 00 NXP Semiconductors LPC314x Validation Board Schematics 1 05 Review cleanup and Layout quotation 07/20/08 01 REFDES re-ordered; Release for Assembly 08/14/08 02 Corrected EBI Static nCS1 Addrs Space table, sht 13 10/16/08 03 Change pull-up value on GPIO0, GPIO1

980020-48-P2

Abstract: 7SDMM-B0-2211-A MT29F8G08AAAWP mt29f2g08aadwp MT29F8G08A 7SDMM-B0-2211 MT29F2G08AAD 7SDMM MT29F4G08ABCWC MT29F4G08ABCWC-et
Contextual Info: SCH-VAL313x-01 01 NXP Semiconductors LPC313x Validation Board Schematics 1 05 Initial release 09/29/08 02 Corrected EBI Static nCS1 Addrs Space table, sht 13 10/16/08 03 Change pull-up value on GPIO0, GPIO1 & GPIO2 to 4.7k; sht 7 01/22/09 04 Tie LPC313x pin K11 to SUP3;

FBM3216

Abstract: BK1005HM MMZ2012S TDK MMZ1608S BK2125HM BK2125HS BKP1005HS bk1608lm BLM15EG MZA3216S
Contextual Info: CROSS REFERENCE CUTTING-EDGE TECHNOLOGIES OF EMI/EMC SOLUTIONS Multilayer Chip Beads/Inductors Taiyoyuden TDK BLM21A Series BK2125HM Series MMZ2012S/Y Series GMLB-160808A Series BLM18A Series BK1608HM Series MMZ1608S/Y Series GMLB-100505A Series BLM15A Series

813LN

Abstract: 82c495 b30 c300 - 1 RC410M APL5531-LF 20493-21 RC400MB-AGTL ati sb400 IT8712 NS0013 LF
Contextual Info: 1 2 3 4 6 7 8 EW6 VCC_CORE CPU CORE 5 Page:26 CLOCK GEN ICS951413CGLFT A +3VPCU +3V_S5/+3VSUS +3V CELERON-M/PENTIUM-M +3VPCU +3V_S5 A Page:4 +3VSUS INTEL Mobile_479 CPU +3V Page:2, 3 +5VSUS +5VSUS/+5V +12V +5V Page:24 +12V HOST BUS 400MHZ +1.8VSUS +1.8VSUS/+1.8V

6-71-M74J0-D03A

Abstract: RTL8111 RTL8111 schematic rsn 3502 a RS780M CLEVO LG-2402P-1 RS780MC 6-71- M74 oz839
Contextual Info: Preface Notebook Computer M740J/M740JU/M760J/M760JU Service Manual Preface I Preface Notice The company reserves the right to revise this publication or to change its contents without notice. Information contained herein is for reference only and does not constitute a commitment on the part of the manufacturer or any subsequent vendor. They assume no responsibility or liability for any errors or inaccuracies that may appear in this publication nor are

74SZ125

Abstract: quanta LTN150U2-L02 quanta computer sharp lq150x1lh82 QUANTA KT5 SAMSUNG C541 LTN141 N20122PS800-0805 LQ150X1LH82
Contextual Info: 5 4 3 2 1 MODEL Model 1A KT5 MB 2A D 3A FIRST RELEASE REFERENCE THE ECN E200203-324 REFERENCE THE ECN E200203-382 3C REFERENCE THE ECN E200204-185 3 Page PRELIMINARY RELEASE 3B 3D KT5 CHANGE LIST REV REFERENCE THE ECN E200204-457 REFERENCE THE ECN E200 C B

sis m650

Abstract: MIC5245 charger HC08 bluetooth keyboard and touchpad schematic CPC24 j3 SMD 20 pin connector sis 962 southbridge Preface Notebook Computer BR408 TI1410
Contextual Info: Preface Notebook Computer D400S/D410S Service Manual Preface I Preface Notice The company reserves the right to revise this publication or to change its contents without notice. Information contained herein is for reference only and does not constitute a commitment on the part of the manufacturer or any subsequent vendor. They assume no responsibility or liability for any errors or inaccuracies that may appear in this publication nor are

Toshiba c850

Abstract: toshiba c850 r472 prescott 800 schematic 24C02 wp st RSS090 SAMSUNG lcd INVERTER Preface Notebook Computer teac DVD player power circuit diagram Etron Technology samsung lcd tv power supply schematic
Contextual Info: Preface Notebook Computer D870P Series Service Manual Preface I Preface Notice The company reserves the right to revise this publication or to change its contents without notice. Information contained herein is for reference only and does not constitute a commitment on the part of the manufacturer or any subsequent vendor. They assume no responsibility or liability for any errors or inaccuracies that may appear in this publication nor are

C6198

Abstract: a17 c178 100v 12p quanta TMS 3617 CX20468-31 mtp42 cpu c644 100v 27p capacitor 100u 63V a70 4013 100 12p Quanta KT2
Contextual Info: 5 4 3 2 PCB Rev: A 1 Sch ver : 20040402_07 KT2 BLOCK DIAGRAM D PCB STACK UP LAYER 1 : TOP D PENTIUM-M / Montara-GM / ICH4-M LAYER 2 : GND LAYER 3 : IN1 CPU PENTIUM-M CPU THERMAL SENSOR LAYER 4 : IN2 GMT-781 478 Pins micro FC-PGA PAGE: 3 LAYER 5 : VCC 14.318MHz

bosch 0 281 003 039

Abstract: kb3926 bosch amplifier 0831 006 003 IDT92HD75 bosch 0 281 003 009 rtl8102el 0 281 020 032 bosch BOSCH 0 281 005 019 BOSCH 0 281 003 024 92HD75
Contextual Info: 1 2 3 4 5 7 8 Jones/Cujo BLOCK DIAGRAM PCB STACK UP 6L UMA LAYER 2 : SGND 14.318MHz PAGE 4 A 478P uPGA /35W PAGE 3,4 LAYER 3 : IN1 01 CPU THERMAL SENSOR CPU Penryn LAYER 1 : TOP A 6 CLK_CPU_BCLK,CLK_CPU_BCLK# CLOCK GEN CLK_MCH_BCLK,CLK_MCH_BCLK# LAYER 4 : IN2