BK2125F0805G Search Results

lk2125

Abstract: R39G 1r2g K7512 lk1608 1R0G r68g
Contextual Info: 積層チップインダクタ MULTILAYER CHIP INDUCTORS LK SERIES OPERATING TEMP. K40V85C 特長 FEATURES Y磁気シールドタイプのためクロストークの発生がなく、高密度実装に最 適 Y完全モノリシック構造のため、高い信頼性を実現

10p05

Abstract: DM10L
Contextual Info: 積層チップインダクタ MULTILAYER CHIP INDUCTORS LK SERIES OPERATING TEMP. K40V85C ＊LK1005を除く ＊Except for LK1005 特長 FEATURES Y磁気シールドタイプのためクロストークの発生がなく、高密度実装に最 適 Y完全モノリシック構造のため、高い信頼性を実現

4L241

Abstract: BK3216 BK3216 4M601
Contextual Info: 積層ハイロスインダクタアレイ MULTILAYER FERRITE CHIP BEAD ARRAY BK ARRAY SERIES OPERATING TEMP. K55VJ125C 特長 FEATURES YAvailable in a wide range of frequency characteristics and impedance values providing excellent suppression of various noise.

Contextual Info: 積層チップインダクタ MULTILAYER CHIP INDUCTORS LK SERIES OPERATING TEMP. K40V85C 特長 FEATURES Y磁気シールドタイプのためクロストークの発生がなく、高密度実装に最 適 Y完全モノリシック構造のため、高い信頼性を実現

lm 7412

Contextual Info: 積層ハイロスインダクタ MULTILAYER FERRITE CHIP BEADS BK SERIES OPERATING TEMP. –55V+125C 特長 FEATURES YInternal silver printed layer creates a closed circuit which acts as a magnetic shield minimizing heat generation and crosstalk. YNo need for grounding provides greater circuit design flexibility.

Contextual Info: 高周波積層チップインダクタ MULTILAYER CHIP INDUCTOR FOR HIGH FREQUENCY HK SERIES 0603D｜55V125C 1005D｜55V125C＊ OPERATING TEMP. ｜55V85C＊ 1608D｜40V85C ＊保証定格により変わります。 ＊Operating temperature depends on rated current.

Contextual Info: 積層ハイロスインダクタ MULTILAYER FERRITE CHIP BEADS BK SERIES OPERATING TEMP. –55V+125C 特長 FEATURES YInternal silver printed layer creates a closed circuit which acts as a magnetic shield minimizing heat generation and crosstalk. YNo need for grounding provides greater circuit design flexibility.

10V18

Abstract: BK3216 4M601
Contextual Info: 積層ハイロスインダクタアレイ MULTILAYER FERRITE CHIP BEAD ARRAY BK ARRAY SERIES OPERATING TEMP. K55VJ125C 特長 FEATURES YAvailable in a wide range of frequency characteristics and impedance values providing excellent suppression of various noise.

Contextual Info: 積層パワーチョークコイル MULTILAYER CHIP INDUCTORS FOR POWER SUPPLY LINES CK SERIES P TYPE OPERATING TEMP. K40V85C 特長 FEATURES Y3.2P1.6mm高さ1mm未満のコンパクトサイズ。 Y内部電極の印刷技術及びセラミックスグリーンシート技術の向上により、

BK32164S601

Abstract: BK20104L050 BK3216 4M601
Contextual Info: 積層ハイロスインダクタアレイ MULTILAYER FERRITE CHIP BEAD ARRAY BK ARRAY SERIES OPERATING TEMP. K55VJ125C 特長 FEATURES YAvailable in a wide range of frequency characteristics and impedance values providing excellent suppression of various noise.

079J

Abstract: 10p05 P270
Contextual Info: 電源用積層ハイロスインダクタ MULTILAYER FERRITE CHIP BEADS FOR POWER SUPPLY LINES BK SERIES P TYPE –55V+85C OPERATING TEMP. 特長 FEATURES YLow Rdc value brings about low power dissipation and extending the life of batteries. That stands on the high advanced green sheet and printing technologies.

18M5L

Abstract: 3N3S 30E K03
Contextual Info: 高周波積層チップインダクタ MULTILAYER CHIP INDUCTOR FOR HIGH FREQUENCY HK SERIES 0603D｜55V125C 1005D｜55V125C＊ OPERATING TEMP. ｜55V85C＊ 1608D｜40V85C ＊保証定格により変わります。 ＊Operating temperature depends on rated current.

DM10L

Abstract: 065-M01 K40V
Contextual Info: 積層チップインダクタ MULTILAYER CHIP INDUCTORS CK SERIES OPERATING TEMP. K40V85C 特長 FEATURES Y磁気シールドタイプのためクロストークの発生がなく、高密度実装に最 適 Y完全モノリシック構造のため、高い信頼性を実現

Contextual Info: 積層ハイロスインダクタ MULTILAYER FERRITE CHIP BEADS BK SERIES OPERATING TEMP. –55V+125C 特長 FEATURES YInternal silver printed layer creates a closed circuit which acts as a magnetic shield minimizing heat generation and crosstalk. YNo need for grounding provides greater circuit design flexibility.

j85c

Contextual Info: 積層チップインダクタ MULTILAYER CHIP INDUCTORS CK SERIES OPERATING TEMP. K40V85C 特長 FEATURES Y磁気シールドタイプのためクロストークの発生がなく、高密度実装に最 適 Y完全モノリシック構造のため、高い信頼性を実現

BKP1608

Abstract: m30 smd
Contextual Info: 電源用積層ハイロスインダクタ MULTILAYER FERRITE CHIP BEADS FOR POWER SUPPLY LINES BK SERIES P TYPE –55V+85C OPERATING TEMP. 特長 FEATURES YLow Rdc value brings about low power dissipation and extending the life of batteries. That stands on the high advanced green sheet and printing technologies.

HKQ0603

Abstract: BK1005 LL330 BKP2125 HW601 079J0
Contextual Info: 積層ハイロスインダクタ MULTILAYER FERRITE CHIP BEADS BK SERIES OPERATING TEMP. –55V+125C ＊BK0603, BK1005は除く ＊Except for BK0603, BK1005 特長 FEATURES YInternal silver printed layer creates a closed circuit which acts as a magnetic shield minimizing heat generation and crosstalk.

Contextual Info: 電源用積層ハイロスインダクタ MULTILAYER FERRITE CHIP BEADS FOR POWER SUPPLY LINES BK SERIES P TYPE –55V+85C OPERATING TEMP. 特長 FEATURES YLow Rdc value brings about low power dissipation and extending the life of batteries. That stands on the high advanced green sheet and printing technologies.

Contextual Info: 積層チップインダクタ MULTILAYER CHIP INDUCTORS CK SERIES OPERATING TEMP. K40V85C 特長 FEATURES Y磁気シールドタイプのためクロストークの発生がなく、高密度実装に最 適 Y完全モノリシック構造のため、高い信頼性を実現

Contextual Info: 積層チップインダクタ MULTILAYER CHIP INDUCTORS CK SERIES OPERATING TEMP. K40V85C 特長 FEATURES Y磁気シールドタイプのためクロストークの発生がなく、高密度実装に最 適 Y完全モノリシック構造のため、高い信頼性を実現

LK2125

Abstract: m100bb
Contextual Info: 積層チップインダクタ MULTILAYER CHIP INDUCTORS LK SERIES OPERATING TEMP. K40V85C 特長 FEATURES Y磁気シールドタイプのためクロストークの発生がなく、高密度実装に最 適 Y完全モノリシック構造のため、高い信頼性を実現

LK2125

Abstract: 5r6g LK3216
Contextual Info: MULTILAYER CHIP INDUCTORS LK SERIES OPERATING TEMP. K40V85C FEATURES YInternal printed coil structure creates a closed magnetic circuit which acts as a magnetic shield eliminating crosstalk, thus permitting higher mounting densities. YMultilayer block structure yields higher reliability.

079J

Contextual Info: 積層ハイロスインダクタ MULTILAYER FERRITE CHIP BEADS BK SERIES OPERATING TEMP. –55V+125C 特長 FEATURES YInternal silver printed layer creates a closed circuit which acts as a magnetic shield minimizing heat generation and crosstalk. YNo need for grounding provides greater circuit design flexibility.

Contextual Info: 積層ハイロスインダクタ MULTILAYER FERRITE CHIP BEADS BK SERIES OPERATING TEMP. –55V+125C 特長 FEATURES YInternal silver printed layer creates a closed circuit which acts as a magnetic shield minimizing heat generation and crosstalk. YNo need for grounding provides greater circuit design flexibility.