BSC-1 DATE SHEET Search Results

SOT23-5 JEDEC standard

Abstract: POD-SOT23 SOT235 MO-178 sot 23- POD 527AH
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOT−23, 5 Lead CASE 527AH−01 ISSUE O D DATE 19 DEC 2008 SYMBOL E1 MIN NOM A 0.90 1.45 A1 0.00 0.15 A2 0.90 b 0.30 0.50 c 0.08 0.22 E 1.15 1.30 D 2.90 BSC E 2.80 BSC E1 1.60 BSC 0.95 BSC e e L 0.45 0.30 L1 PIN #1 IDENTIFICATION

POD-SOT23

Abstract: 527AK MO-178 L2 SOT23-8
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOT−23, 8 Lead CASE 527AK−01 ISSUE A DATE 18 MAR 2009 SYMBOL E1 e E b PIN #1 IDENTIFICATION NOM MAX A 0.90 1.45 A1 0.00 0.15 A2 0.90 A3 0.60 0.80 b 0.28 0.38 c 0.08 0.22 1.10 1.30 D 2.90 BSC E 2.80 BSC E1 1.60 BSC

MTR28515TF

Abstract: QML-38534 mtr28515
Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Chanaes in accordance with NOR 5962-R006-96. 95-10-18 K.A. Cottonaim B Correct oaraarach 1.4, output currents. 97-10-22 K.A. Cottonaim C Figure 1, dimension table, symbol q: inches column, change 1.950 BSC to 1.950 maximum and millimeters column, 49.53 BSC to 49.53

AT 980202

Abstract: QML-38534 980202 MTR28512T883 MTR28512TF DSCC 93073
Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Chanaes in accordance with NOR 5962-R005-96. 95-10-18 K.A. Cottonaim B Figure 1, dimension table, symbol q: inches column, change 1.950 BSC to 1.950 maximum and millimeters column, 49.53 BSC to 49.53 maximum. Table I, delete note 4 from output current test (Iq u t ) ancl

l282

Abstract: L-282
Contextual Info: PACKAGE DIAGRAM OUTLINES LEADLESS CHIP CARRIER C o n t i n u e d DCN REV DESCRIPTION 17288 03 UPDATE TO STANDARDIZE DRAWING DATE APPROVAL A A1 NOTES: (UNLES OTHERWISE SPECIFIED; 1. ALL DIMENSIONS ARE IN INCHES. 2. BSC - BASIC LEAD SPACING BETWEEN CENTERS.

28 LEADLESS CHIP CARRIER DWG

Abstract: MS-009-AE
Contextual Info: PACKAGE DIAGRAM OUTLINES LEADLESS CHIP CARRIER DCN REV DESCRIPTION 17 295 05 UPDATE TO STANDARDIZE DRAWING DATE APPROVAL A E NOTES: 2. E UNLES OTHERWISE SPECIFIED; BSC - BASIC LEAD SPACING BETWEEN CENTERS. DWG # SYMBOL MIN A .060 .075 A1 .050 .065 B1 R9 L 20-1

Contextual Info: REV 00 DCN DESCRIPTION 20289 ORIGINAL ISSUE ——I |—— bl DATE APPROVED ——Ie |—— S1 - mwwffl b — ► li^ — £11 L1 _\w S —• — SEATING PLANE NOTES: UNLESS OTHERWISE SPECIFIED 1. ALL DIMENSIONS ARE IN INCHES. 2. BSC - BASIC LEAD SPACING BETWEEN CENTERS.

SO16WB

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SO−16 WB CASE 751G−03 ISSUE C DATE 30 APR 2004 1 SCALE 1:1 A D 9 h X 45 _ E H 0.25 8X M B M 16 q 1 MILLIMETERS DIM MIN MAX A 2.35 2.65 A1 0.10 0.25 B 0.35 0.49 C 0.23 0.32 D 10.15 10.45 E 7.40 7.60 e 1.27 BSC

Contextual Info: DCN 17289 REV 03 DESCRIPTION UPDATE TO STANDARDIZE DRAWING DATE APPROVAL A A1 3 PL \3 NOTES: UNLES OTHERWISE SPECIFIED 1. ALL DIMENSIONS ARE IN INCHES. 2. BSC - BASIC LEAD SPACING BETWEEN CENTERS. SYMBOL A1 B1 B2 B3 D1/E1 D2/E2 D3/E3 e1 L1 L2 L3 ND/NE N

Contextual Info: DCN 17289 REV 03 DESCRIPTION UPDATE TO STANDARDIZE DRAWING DATE APPROVAL A A1 NOTES: UNLES OTHERWISE SPECIFIED 1. ALL DIMENSIONS ARE IN INCHES. 2. BSC - BASIC LEAD SPACING BETWEEN CENTERS. SYMBOL A1 B1 B2 B3 .D/E. D1/E1 D2/E2 D3/E3 e1 L1 L2 L3 ND/NE N MIN

7X-XXXSXX-X20X

Abstract: ERN REL 37 FOOTPRINT PCB d0120 6E-17 e646
Contextual Info: , E .3 1 8 [8 .0 8 ] STANDARD PCB F REVISIONS FOOTPRINT REV LAYOUT ECN, ERN NO. PRODUCT DRAWING (EAR B 12937) DATE APPRD. A P R 2 8 /0 6 K.L. 242 [6 .1 5 ] DIMFNSIONS [ @ _§ B ± .0 0 5 C ± .0 0 5 [0 .1 3 ] [0 .1 3 ] D BSC. SIZE A ± .0 1 5 [0 .3 8 ]

MS-013

Abstract: SOIC24
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−24, 300 mils CASE 751BK−01 ISSUE O E1 DATE 19 DEC 2008 SYMBOL MIN A 2.35 E e PIN#1 IDENTIFICATION MAX 2.65 A1 0.10 0.30 A2 2.05 2.55 b 0.31 0.51 c 0.20 0.33 D 15.20 15.40 E 10.11 10.51 E1 7.34 7.60 1.27 BSC

soic14 150

Abstract: SOIC14
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−14, 150 mils CASE 751BF−01 ISSUE O E1 DATE 19 DEC 2008 SYMBOL MIN A 1.35 1.75 A1 0.10 0.25 b 0.33 0.51 E MAX c 0.19 D 8.55 8.65 8.75 E 5.80 6.00 6.20 E1 3.80 3.90 4.00 0.25 1.27 BSC e PIN#1 IDENTIFICATION

751BD

Abstract: 751BD-01
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC 8, 150 mils CASE 751BD−01 ISSUE O E1 DATE 19 DEC 2008 E SYMBOL MIN A 1.35 1.75 A1 0.10 0.25 b 0.33 0.51 c 0.19 0.25 D 4.80 5.00 E 5.80 6.20 E1 3.80 4.00 MAX 1.27 BSC e PIN # 1 IDENTIFICATION NOM h 0.25 0.50

Contextual Info: PACKAGE DIAGRAM OUTLINES LEADLESS CHIP C ARRIER C o 11 1i 1111 e d DCN REV 17294 02 DESCRIPTION UPDATE DATE TO S T A N D A R D I Z E APPROVAL DRAWI NG A A1 NOTES: (UNLES OTHERWI SE 1. A LL DI MENSI ONS ARE 2. BSC - BASI C LEAD BETWEEN CENTERS. IN INCHES.

PDIP-18

Abstract: P-DIP-18 MS-001 PDIP18
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS PDIP−18, 300 mils CASE 646AG−01 ISSUE O DATE 13 MAR 2009 MIN SYMBOL PIN #1 ID E1 D NOM A 5.33 A1 0.38 A2 3.23 3.48 b 0.36 0.56 b1 1.14 1.78 c 0.20 0.36 D 22.22 23.24 E 7.62 8.13 E1 6.10 e 6.60 2.54 BSC 9.78 eB

EDR-7320

Abstract: SOIC8-208 SOIK8-031-01 eiaj edr-7320 751BE-01 soik8
Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−8, 208 mils CASE 751BE−01 ISSUE O DATE 19 DEC 2008 SYMBOL MIN NOM A E1 E MAX 2.03 A1 0.05 0.25 b 0.36 0.48 c 0.19 0.25 D 5.13 5.33 E 7.75 8.26 E1 5.13 5.38 e 1.27 BSC L 0.51 0.76 θ 0º 8º PIN#1 IDENTIFICATION

Contextual Info: LTR A A1 B B1 c CH1 D D1 D2 E E1 E2 e1 MIN MAX .160 .190 .034 .026 .032 .017 .023 .005 .010 .035 .045 .978 .998 .940 .960 .910 .930 .978 .998 .940 .960 .910 .930 .050 BSC SIGNATURE >— B1 NOTES: A PIN-1 2. ALL DIMENSIONS SHOWN ARE IN INCHES. DATE 3r DOC. CONTROL:

E16-1

Abstract: MO-092AC
Contextual Info: PACKAGE DIAGRAM O U T L I N E S CERPACK REV DCN 04 17576 DESCRIPTION UPDATED TO DATE STANDARDIZE APPROVED 4- 6-90 DWG Thomas - i T E1 D e- NOTES: UNLESS OTHERWISE SPECIEIED 1. ALL DIMENSIONS ARE IN INCHES. 2. BSC - BASIC LEAD SPACING BETWEEN CENTERS. 3. SYMBOL ”N” REPRESENTS THE NUMBER OF LEAD!:

MO-092AC

Abstract: E16-1
Contextual Info: PACKAGE DIAGRAM O U T L I N E S CERPACK REV DCN 04 17576 DESCRIPTION U P D A TE D DATE TO S T A N D A R D IZ E DWG APPROVED 4-6-90 Thomas - i T E1 D eNOTES: UNLESS OTHERWISE SPECIEIED 1. ALL DIMENSIONS ARE IN INCHES. 2. BSC - BASIC LEAD SPACING BETWEEN CENTERS.

Contextual Info: 4 PART NO. 3 1 2 REVISIONS CA-XXSCA2-XF-22 LTR DESCRIPTION A INITIAL RELEASE SEE DO 4793 .039±.006 0.98±0.15 B DIM.'A' ±0.30 [.012] 0.08 S D DIM. 'B' Z S SEE DO 4879 CP DATE APPROVED 3-21-02 L.F. 6-14-02 A.J. X S 0.08 [.003] D DIM. 'D' BSC DIM. 'E' X 0.10 [.004]

Contextual Info: LTR A A1 A2 B B1 c D D1 D2 E E1 E2 L1 N e1 CH1 SIGNATURE A2 — 1 A1 • MIN MAX .165 .180 .090 .120 .020 .026 .033 .013 .021 .009 .012 .485 .495 .450 .456 .390 .430 .485 .495 .450 .456 .390 .430 .060 28 .050 BSC .042 .048 L1 DATE 3! DOC. CONTROL: ENGR. MGR:

MS-004-OB

Contextual Info: PACKAGE DIAGRAM OUTLINES LEADLESS CHIP CARRIER C o n tin u e d DON REV 17287 03 DESCRIPTION ÜPDATE DATE TO S T A N D A R D I Z E APPROVAL DRAWI NG A A1 E E D3 NOTES: 1. (UNLES OTHERWI SE A L L DI MENSI ONS 2. A RE BSC - BA SI C LEAD BETWEEN CENTERS. IN INCHES.

Contextual Info: PACKAGE DIAGRAM O U T L I N E S SIDEBRAZE C o r 1 1 in u e d REV DCN 05 7554 DESCRIPTION 06 22248 UPDATED CHA N GED b1 MIN DWG JO APPROVED 4/2/90 DI MENSI ON SEATING RLANE b1 _( U DATE TO S T A N D A R D I Z E L1 1. 2. 3. A RE A L L Dl BSC - DWG # jpecified: