BURNDY PCB CONNECTOR Search Results

Contextual Info: B U R N DY Burndy POSTLATCH : Printed Circuit board post connector on .156 pitch POSTLATCH simplifies the job of connecting discrete wire to the PCB, provides separability, offers discrimination feature. • Widely used by the personal computer industry as a power header.

burndy qilext-1

Abstract: Connectral QSIE44P burndy pcb CONNECTOR burndy 12 pin burndy connector 36 pin pga socket 604 QILE JUPITER e series connector
Contextual Info: _ an FCI Com pany SMT CHIPAK PLCC Surface Mount Sockets BURNS019 11 c ™ F ram&tome Connectors - IN T E R N A T IO N A L - BURNDY • JUPITER • SOURIAU • CONNECTRAL •m m m m wm SMT CHIPAK Surface Mount Sockets: Design Features You Want.

burndy 12 pin

Abstract: burndy msm burndy 8 pin CONNECTOR burndy connector NFC93426 ms50pm MS14PM57 burndy connector 36 pin MS26PM1 MS50RM58
Contextual Info: MSM Series Burndy Connector High Performance rectangular cable connector MSM rectangular connetors can be used for cable to cable and cable to board. They are a range of multiway connectors available in 7 sizes from 14 to 75 positions. MSM cable connectors can be

MS14RM58

Abstract: burndy connector burndy ms MS50PM118K MS50RMJT3 MS20RM1 burndy 12 pin burndy ms 26 NFC93426 MS26RM1
Contextual Info: MSM Series Burndy Connector High Performance rectangular cable connector MSM rectangular connetors can be used for cable to cable and cable to board. They are a range of multiway connectors available in 7 sizes from 14 to 75 positions. MSM cable connectors can be

SEMA09SN

Abstract: SBMA25SN SAMA15SN 8630-06A burndy military connector SEMA09PN FCI Connector m24308 SEMA09PLN connectors m24308 M24308 series
Contextual Info: S *M A Series • • • • Polyester two piece bonded insulator Crimp termination Qualified to MIL-C-24308 Removable rear entry/rear release machined contacts S t a lls Contacts Cnnnectors williout Contacts Connectors with Contacts P. Pin Standard Confiijiir;i!mns

Contextual Info: Series '223’: The Design Features You Want Large target area for easy insertion Dual face wiping contacts Metal-to-metal contacts One piece glass filled polyester housing Stackable end to end Design for low contact resistance high normal force Closed bottom

souriau 8609

Contextual Info: DIN 41612 Contents Page Introduction/performance classes . 3 Product overview . 4-5 Selection guide , specifications and technical data . 6-7 Introduction to pressfit technology .

burndy 8 pin male

Contextual Info: F C 1/ BURNDY CORP 3M37Tbfl DD0222M 525 blE D Technical Characteristics Electrical: Maximum current rating: 5 Amps per contact Maximum voltage: 1,000 V r.m.s. Rated voltage: 300 V r.m.s. Initial Contact Resistance: < 10 mQ Shell Resistance: < 5mQ Insulation Resistance: > 5,000 mQ

burndy military connector

Abstract: microtxpc microtxpctang burndy 8 pin male IEC61076-2-101 M12-RJ45 burndy CONNECTOR PCB BASED INDUSTRIAL AUTOMATION SYSTEM RJ45 plug pcb connector Burndy 23 pin connector
Contextual Info: microFX & microTX Ethernet Solution for the Automation World Souriau is a member of and fffffffffff microFX SOURIAU Connectors and interconnect systems for severe environments The company designs, manufactures and markets high performance interconnect solutions for severe

burndy military connector

Abstract: ESCC-Q-70-02A 100S QQ-P-35 NUMBER 2 .086-56 UNC souriau accessories d type backshells D-SUB 50 PIN feMALE CONNECTOR souriau burndy pcb CONNECTOR souriau 842 8995-3093
Contextual Info: microComp series ® micro micro miniature miniature composite composite connectors connectors ® microComp Connectors and interconnect systems for harsh environments The company designs, manufactures and markets high performance interconnect solutions for severe environments

Contextual Info: SM364T8AO83XGXX May 1995 Rev 3 SMART Modular Technologies SM364T8AO83XGXX 256KByte 32Kx64 Asynchronous Secondary Cache SRAM Module General Description Features The SM364T8AO83XGXX is a high performance, 256 Kilobyte asynchronous secondary cache SRAM module

Contextual Info: SM364TCSQ83XGXX November 1995 Rev 1 SMART Modular Technologies SM364TCSQ83XGXX 256KByte 32Kx64 Synchronous Secondary Cache SRAM Module General Description Features The SM364TCSQ83XGXX is a high performance, 256 Kilobyte synchronous secondary cache SRAM module. It

Contextual Info: SM364T8AOM3XGXX May 1995 Rev 1 SMART Modular Technologies SM364T8AOM3XGXX 256KByte 32Kx64 Asynchronous Secondary Cache SRAM Module General Description Features The SM364T8AOM3XGXX is a high performance, 256 Kilobyte asynchronous secondary cache SRAM module

SM364TCSP83UI15

Abstract: 32Kx64 D37 connector pcb
Contextual Info: SM364TCSP83UI15 August 1996 Rev 3 SMART Modular Technologies SM364TCSP83UI15 256KByte 32Kx64 Synchronous Secondary Cache SRAM Module General Description Features The SM364TCSP83UI15 is a high performance, 256 Kilobyte synchronous secondary cache SRAM module for

Contextual Info: SM364T8AO84XGXX May 1995 Rev 3 SMART Modular Technologies SM364T8AO84XGXX 256KByte 32Kx64 Asynchronous Secondary Cache SRAM Module General Description Features The SM364T8AO84XGXX is a high performance, 256 Kilobyte asynchronous secondary cache SRAM module

XVPC09B

Abstract: XVPC21 XVP-C21 yav14rl33 DL1-BDB8 9001CT0001 DL1-BDM4 XVPC21W 24v LED Bulb circuit diagram DL1BDB4
Contextual Info: Push Buttons and Operator Interface Specifiers Guide XVP Illuminated Indicating Banks Supplement Class 9001 CONTENTS Schneider Electric Brands Description Page XVP Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

mosfet p0603

Abstract: schematic atx 160 W BAV99TA 450 atx power supply circuit schematic atx 250 atx 400 power supply schematic DIPSW10 atx 300 power supply schematic atx 350 power supply schematic P0603 equivalent
Contextual Info: ISL6560/62 Evaluation Board Application Note April 2002 AN1009.0 Author: Hal Wittlinger Introduction Description The ISL6560/62 Evaluation Board was designed to accommodate either the ISL6560 or the ISL6562 power supply controller ICs. CORE voltage is set by a five bit DAC

Contextual Info: High-Performance 256/512/1024 KByte SRAM Module : AS7M64Ï*256 AS7M64P5Ï2 AS7M64PI024 WÊ 256/512/1024 KByte Asynchronous SRAM Module I PIN ARRANGEMENT FEATURES 80-pin dual-readout DIMM - Same pinout for 256/512/1024KB - Burst-mode control signals - No motherboard jumpers required

btb 137

Contextual Info: HI High- Performan ce 256/512/1024 KB vie 3.3V SRAM Module AS7M64f*3256 AS7M64P3512 AS7M64P31024 Low Voltage 256/512/1024 KByte Asynchronous Sit AM Module . PIN ARRANGEMENT FEATURES 80 pin dual-readout DIMM - Same pinout for 256/512/1024KB - Same pinout for burst mode 64B3256

Contextual Info: Application Note 1655 ISL8200MEVAL1PHZ Evaluation Board User’s Guide VIN = 3V TO 20V PGOOD VOUT REMOTE SENSING POINTS MODULE GROUP VOUT LOAD UP TO 10A DIMENSIONS: 2.5 X 4.5 INCHES VOUT MONITORING POINTS FIGURE 1. ISL8200MEVAL1PHZ EVALUATION BOARD ISL8200MEVAL1PHZ Evaluation

an17380

Abstract: S/an17380
Contextual Info: Application Note 1738 ISL8200AMEV1PHZ Evaluation Board User’s Guide VIN = 3V TO 20V PGOOD VOUT REMOTE SENSING POINTS MODULE GROUP VOUT LOAD UP TO 10A DIMENSIONS: 2.5 X 4.5 INCHES VOUT MONITORING POINTS FIGURE 1. ISL8200AMEV1PHZ EVALUATION BOARD ISL8200AMEV1PHZ Evaluation

ISL6609A

Contextual Info: Application Note 1726 ISL78220EVAL1Z: 6-Phase Interleaved Synchronous Boost Converter ISL78220EVAL1Z Evaluation Board The ISL78220EVAL1Z evaluation board features the ISL78220 6-phase interleaved boost controller and six ISL6609A MOSFET drivers. The ISL78220 and ISL6609A are configured

transistor c018

Abstract: smd transistor c014
Contextual Info: Application Note 1789 ISL8225MEVAL2Z 6-Phase, 90A Evaluation Board Setup Procedure The ISL8225M is a complete, dual step-down switching mode DC/DC module. The dual outputs can easily be paralleled for single-output, high-current use. It is easy to apply this

AN619

Abstract: 133M SIGNAL PATH designer
Contextual Info: AN619 APPLICATION NOTE FAST BURST SRAM DESIGN CONSIDERATIONS by Rickie TUTTLE INTRODUCTION This application note will discuss the definition of the fast Burst RAM BRAM for high performance systems, and consider application issues to ensure proper design techniques. Design issues become more