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    Infineon Technologies AG IGC89T170S8RMX1SA1

    - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: IGC89T170S8RMX1SA1)
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    Avnet Americas IGC89T170S8RMX1SA1 Waffle Pack 111 Weeks 2,655
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    EBV Elektronik IGC89T170S8RMX1SA1 71 Weeks 1
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