C92237 Search Results

Intel reflow soldering profile BGA

Abstract: Intel reflow soldering profile BGA ich7 ich7 bga ICH7 C92237-001 Intel reflow soldering profile BGA intel intel package drawings 6702PXH BGA OUTLINE DRAWING T-710
Contextual Info: Intel 3000 and 3010 Chipset Memory Controller Hub MCH Thermal/Mechanical Design Guide August 2006 Reference Number: 313955 Revision: 001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL ® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

C92210

Abstract: C9224 C92112
Contextual Info: C92000 Power Inductors for Commercial Applications FEATURES Compact, low profile package, ideal for automatic placement. Leadless Device for minimum footprint. Low Thermal Expansion permits mounting on most substrate materials. Different values and tighter tolerances

Contextual Info: 8 P A R T N UMBER 922-373A-B3B 6 COMPLIANT PIN IMPEDANCE TABLE 1 DESCRIPTION 922-373A-B3C 922-373A-B3D 00.0177" 922-373A-B3F 922-373A-B3G 922-373A-B3H 100G H I G H SPEED MODULE Ni S U L F A M A T E , H I G H G OL D , L E A D F R E E 922-373A-B3J 922-373F-B3B