CABGA 6x6
Abstract: CABGA CABGA 8X8 bga 6x8 BGA Package 14x14 CABGA 48 7x7 CABGA 56
Text: CABGA Color.FRM Page 1 Tuesday, February 9, 1999 3:58 PM CABGA Packaging Capabilities Surface Mount Description 11 mm square in 1mm increments. Ball pitches are 0.5 to 1.0 mm. Rectangular packages are also available in a variety of package sizes. The maximum mounted height is
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CABGA 6x6
CABGA
CABGA 8X8
bga 6x8
BGA Package 14x14
CABGA 48 7x7
CABGA 56
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TQ32
Abstract: ablestik amkor amkor cabga Nitto ASE LQFP 208 CABGA 6x6
Text: Atmel Lead Pb -Free Plan Jul-00 Subcontractor Oct-00 Jan-01 Apr-01 Jul-01 Package AIC(Malaysia) 32 lead TSOP AIC(Malaysia) 8 lead SOIC Amkor(Korea) 81 ball CABGA Amkor(Korea) 44 lead TQFP Amkor(Phillip.) 5 X 8 LAP (replaces 8 lead SOIC) Amkor(Korea) 64 lead 10 X 10 LQFP*
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Jul-00
Oct-00
Jan-01
Apr-01
Jul-01
Oct-01
10X10,
TQ32
ablestik
amkor
amkor cabga
Nitto
ASE LQFP 208
CABGA 6x6
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LFXP2-8E
Abstract: LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132
Text: Thermal Management July 2009 Introduction Thermal management is recommended as part of any sound CPLD and FPGA design methodology. To properly assess the thermal characteristics of the system, Lattice Semiconductor specifies a maximum allowable junction temperature in all device data sheets. The system designer should always complete a thermal analysis of their specific design to ensure that the device and package does not exceed the junction temperature requirements.
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64-ball
144-ball
LFXP2-8E
LFXP2-40E
LFXP2-5E
LFXP20C
theta jc FCBGA
LFXP2-17E
LFE3-17
Theta JB
LFXP15C
LFXP2-8E 132
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1f1-1717-a19
Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O
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60WMBG
60M/54WBGA-8
10X15
10-8X12-A
LA69-00635A
48TBGA
48-TBGA-10
0-8X16-O
LA69-00267A
ADS11981
1f1-1717-a19
153FBGA
BGA 6x6 tray
FBGA tray kostat
tray bga 6x6
169fbga-12.0x16.0-8x16-0
78BOC-11
78BOC
ePAK BGA 5x5 tray
153FBGA-9
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HL832N
Abstract: FCCSP HL832 Amkor CSP mold compound cu pillar amkor cabga thermal resistance CABGA 6x6 flip chip bga 0,8 mm BGA 64 PACKAGE thermal resistance amkor Cu pillar
Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or
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BGA 11x11 junction to board thermal resistance
Abstract: 45x45 mm bga BGA 64 PACKAGE thermal resistance qfn jc jb 45x45 bga BGA 23X23 PQFP 32X32 QFN 48 JC JB 35x35 bga QFN 20X20
Text: Thermal Management February 2004 Introduction to Thermal Management Thermal considerations are rarely an issue with low-density PLDs such as the Lattice Semiconductor GAL products, however, high-density PLDs often require consideration of thermal issues as part of any sound design methodology. To avoid reliability problems, Lattice Semiconductor specifies a maximum allowable junction temperature
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320-ball
432-ball
27x27
31x31
35x35
40x40
45x45
BGA 11x11 junction to board thermal resistance
45x45 mm bga
BGA 64 PACKAGE thermal resistance
qfn jc jb
45x45 bga
BGA 23X23
PQFP 32X32
QFN 48 JC JB
35x35 bga
QFN 20X20
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BGA 64 PACKAGE thermal resistance
Abstract: FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45
Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package — a flip chip solution in a CSP package format. This package construction utilizes eutectic tin/lead (63Sn/37Pb) flip chip interconnect
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BGA 64 PACKAGE thermal resistance
FCCSP
CABGA 6x6
amkor flip
fcBGA PACKAGE thermal resistance
bga 9x9 Shipping Trays
CABGA 8X8
BGA 256 PACKAGE power dissipation
BGA 256 PACKAGE thermal resistance
BGA45
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cu pillar
Abstract: Flip Chip Substrate HL832 ds7409 FCCSP amkor flip chiparray amkor HL832N CABGA 48 7x7 amkor cabga thermal resistance
Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or
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LE79Q2281
Abstract: 1N6761-1 2N2369AU 2N2907AUB BR17 datasheet transistor SI 6822 Dimming LED aplications Dimming LED Driver aplications GC4600 IC ZL70572
Text: Product Portfolio 2013-2014 ng-edge Embed Power Matters. About Microsemi Microsemi Corporation is a leading provider of semiconductor solutions differentiated by power, security, reliability and performance. The company concentrates on providing solutions for applications where power matters, security
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MAGNACHIP MAP 9000
Abstract: DIGRAM FOR TEST IC 324 smd transistor marking H1A smd marking H1A smd marking H1A 3 pin transistor H1A smd smd marking code H1A samsung "nand flash" derating H1A transistor SMD marking date code samsung semiconductor
Text: HMS30C7210 ARM Based 32-Bit Microprocessor DATASHEET 7210 DS-07 Copyright. 2004 MagnaChip Semiconductor Ltd. ALL RIGHTS RESERVED. No part of this publication may be copied in any form, by photocopy, microfilm, retrieval system, or by any other means now known or hereafter invented without the prior written permission of MagnaChip Semiconductor Ltd.
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HMS30C7210
32-Bit
DS-07)
0x8005
MAGNACHIP MAP 9000
DIGRAM FOR TEST IC 324
smd transistor marking H1A
smd marking H1A
smd marking H1A 3 pin
transistor H1A smd
smd marking code H1A
samsung "nand flash" derating
H1A transistor SMD
marking date code samsung semiconductor
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MAGNACHIP MAP 9000
Abstract: No abstract text available
Text: HMS30C7210 ARM Based 32-Bit Microprocessor DATASHEET 7210 DS-08 Copyright. 2004 MagnaChip Semiconductor Ltd. ALL RIGHTS RESERVED. No part of this publication may be copied in any form, by photocopy, microfilm, retrieval system, or by any other means now known or hereafter invented without the prior written permission of MagnaChip Semiconductor Ltd.
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HMS30C7210
32-Bit
DS-08)
0x8005
MAGNACHIP MAP 9000
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smd 9103 manual
Abstract: csc 9102
Text: HMS30C7210 ARM Based 32-Bit Microprocessor Datasheet Preliminary MagnaChip Semiconductor Ltd. HMS30C7210 ii 2004 MagnaChip Semiconductor Ltd. All Rights Reserved. - ii - Preliminary HMS30C7210 Copyright. 2004 MagnaChip Semiconductor Ltd. ALL RIGHTS RESERVED. No part of this publication may be copied in any form, by photocopy, microfilm, retrieval
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32-Bit
0x8005
smd 9103 manual
csc 9102
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