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    CAP 0306 PACKAGE Search Results

    CAP 0306 PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    CAP 0306 PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking


    Original     		PDF 300MHz

    0508-8 X7S 6.3v 1

    Abstract: No abstract text available
    Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking


    Original     		PDF 300MHz 0508-8 X7S 6.3v 1

    resistor 0306 package

    Abstract: bl 0306 0306 capacitor 0508-8 X7S 6.3v Licc avx
    Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking


    Original     		PDF 300MHz resistor 0306 package bl 0306 0306 capacitor 0508-8 X7S 6.3v Licc avx

    resistor 0306 package

    Abstract: size 0204 capacitor
    Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking


    Original     		PDF 300MHz resistor 0306 package size 0204 capacitor

    LICA3T104P1FC1AA

    Abstract: LICA3T134M1FC1AA LICA3T153P3FC4AA LICA3T193M3FC4AA LICA3T263P3FC4AA LICA3T333M1FC4AA MIL-PRF-123 S55S 97Pb cap 0306 package
    Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking


    Original     		PDF 300MHz H20-080 LICA3T104P1FC1AA LICA3T134M1FC1AA LICA3T153P3FC4AA LICA3T193M3FC4AA LICA3T263P3FC4AA LICA3T333M1FC4AA MIL-PRF-123 S55S 97Pb cap 0306 package

    LICA3T333M1FC4AA

    Abstract: S55S LICA3T104P1FC1AA LICA3T134M1FC1AA LICA3T153P3FC4AA LICA3T193M3FC4AA LICA3T263P3FC4AA MIL-PRF-123 LICAZD504M3FC1AB current loop
    Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking


    Original     		PDF 300MHz H20-080 LICA3T333M1FC4AA S55S LICA3T104P1FC1AA LICA3T134M1FC1AA LICA3T153P3FC4AA LICA3T193M3FC4AA LICA3T263P3FC4AA MIL-PRF-123 LICAZD504M3FC1AB current loop

    Low Inductance Capacitors

    Abstract: No abstract text available
    Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking


    Original     		PDF 300MHz H20-080 Low Inductance Capacitors

    LD18

    Abstract: LD17
    Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking


    Original     		PDF 300MHz LD18 LD17

    LD18

    Abstract: Capacitor 16v LD17
    Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking


    Original     		PDF 300MHz LD18 Capacitor 16v LD17

    Untitled

    Abstract: No abstract text available
    Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking


    Original     		PDF 300MHz

    Untitled

    Abstract: No abstract text available
    Text: LGA Low Inductance Capacitors 0204/0306/0508/0805 Land Grid Arrays AVX has introduced a revolutionary new capacitor for low inductance applications. Low inductance LGA land grid array capacitors have virtually the equivalent high frequency performance of 8-terminal IDC’s (Inter-Digitated Capacitors) but are built in a simplified 2 terminal package.


    Original     		PDF

    HIGH VOLTAGE MLCC (SURFACE MOUNT)

    Abstract: No abstract text available
    Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking


    Original     		PDF 300MHz HIGH VOLTAGE MLCC (SURFACE MOUNT)

    IDC0508

    Abstract: Licc avx 0612 bl 0306
    Text: Low Inductance Chip Capacitors AVX's low inductance are designed for high speed IC packages and hybrid circuits. Their aspect ratio and size have been optimized to reduce inductance from the 2 nH range found in normal chip capacitors to less than 0.5 nH. Their low profile 20 mils is ideal for


    Original     		PDF 000pF IDC0508 Licc avx 0612 bl 0306

    mlcc AVX

    Abstract: HIGH VOLTAGE MLCC (SURFACE MOUNT)
    Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking


    Original     		PDF 300MHz mlcc AVX HIGH VOLTAGE MLCC (SURFACE MOUNT)

    Untitled

    Abstract: No abstract text available
    Text: LGA Low Inductance Capacitors 0204/0306/0805 Land Grid Arrays Land Grid Array LGA capacitors are the latest family of low inductance MLCCs from AVX. These new LGA products are the third low inductance family developed by AVX. The innovative LGA technology sets a new standard for low inductance MLCC performance.


    Original     		PDF solLG22

    0M0701-N

    Abstract: LICC
    Text: 0612/0508/0306 LICC Low Inductance Chip Capacitors GENERAL DESCRIPTION The total inductance of chip capacitor is determined both by its length to width ratio and by the mutual inductance coupling between its electrodes. Thus a 1210 chip size has a lower inductance than a 1206 chip.


    Original     		PDF H20-080 0M0701-N LICC

    LICA3T333M1FC4AA

    Abstract: ld18 LD17 LICA3T104P1FC1AA LICA3T134M1FC1AA LICA3T153P3FC4AA LICA3T193M3FC4AA LGA land pattern AVX LD X5R capacitor ceramic AVX
    Text: Low Inductance Capacitors SnPb LICC 0612/0508/0306 X7R & X5R Dielectric The total inductance of a chip capacitor is determined both by its length to width ratio and by the mutual inductance coupling between its electrodes. Thus a 1210 chip size has a lower inductance than a 1206 chip. This design improvement is the basis of AVX’s Low Inductance Chip Capacitors (LICC), where the electrodes are terminated on the long side of the chip instead of the short side. The 1206


    Original     		PDF both10 LICA3T333M1FC4AA ld18 LD17 LICA3T104P1FC1AA LICA3T134M1FC1AA LICA3T153P3FC4AA LICA3T193M3FC4AA LGA land pattern AVX LD X5R capacitor ceramic AVX

    Untitled

    Abstract: No abstract text available
    Text: IDC Low Inductance Capacitors RoHS 0306/0612/0508 IDC (InterDigitated Capacitors) GENERAL DESCRIPTION 0612 + + – L – – Style 3 + 0508 0306 TYPICAL IMPEDANCE Impedance (Ohms) 10 MLCC_1206 1 LICC_0612 0.1 IDC_0612 0.01 0.001 1 10 100 1000 Frequency (MHz)


    Original     		PDF

    S-LICC10M1101-C

    Abstract: Licc avx 0612 2000 LICC kyocera
    Text: A KYOCERA GROUP COMPANY AVX Low Inductance Capacitors Table of Contents Low Inductance Capacitors Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2-3 Low Inductance Chip Capacitors


    Original     		PDF S-LICC10M1101-C S-LICC10M1101-C Licc avx 0612 2000 LICC kyocera

    RH221C106MA3RA3

    Abstract: cap 0306 package ceramic capacitor 0201 1 uf NON POLAR capacitor rh225c226
    Text: 1765-2012.qxp:QuarkCatalogTempNew 9/17/12 5:47 PM Page 1765 21 Ceramic Chip and Low Inductance Capacitors AU Series MLCC Gold Termination Capacitors RoHS RoHS The AU Series MLCC Gold Termination Series provides for customers needing commercial and military Multilayer Ceramic Capacitors with gold


    Original     		PDF AU01ZC103KAG2A MK02272R2BAT2A MK02275R6BATA MK0227100FAT2A MK03V1R3BAT2A MK03V72R4BAT2A MK03V72R7BAT2A MK05V72R7CAT2A MK03V73R3BAT2A MK03V79R1BAT2A RH221C106MA3RA3 cap 0306 package ceramic capacitor 0201 1 uf NON POLAR capacitor rh225c226

    bl 0306

    Abstract: No abstract text available
    Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking


    Original     		PDF 300MHz bl 0306

    bl 0306

    Abstract: No abstract text available
    Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking


    Original     		PDF 300MHz bl 0306

    0306 capacitor

    Abstract: LICC ZD105 cap 0306 package
    Text: Low Inductance Capacitors 0612/0508/0306 LICC Low Inductance Chip Capacitors GENERAL DESCRIPTION The total inductance of a chip capacitor is determined both by its length to width ratio and by the mutual inductance coupling between its electrodes. Thus a 1210 chip size has a lower inductance than a 1206 chip. This


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking


    Original     		PDF 300MHz