CAP 0306 PACKAGE Search Results

Contextual Info: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking

0508-8 X7S 6.3v 1

Contextual Info: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking

resistor 0306 package

Abstract: bl 0306 0306 capacitor 0508-8 X7S 6.3v Licc avx
Contextual Info: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking

resistor 0306 package

Abstract: size 0204 capacitor
Contextual Info: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking

LICA3T104P1FC1AA

Abstract: LICA3T134M1FC1AA LICA3T153P3FC4AA LICA3T193M3FC4AA LICA3T263P3FC4AA LICA3T333M1FC4AA MIL-PRF-123 S55S 97Pb cap 0306 package
Contextual Info: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking

LICA3T333M1FC4AA

Abstract: S55S LICA3T104P1FC1AA LICA3T134M1FC1AA LICA3T153P3FC4AA LICA3T193M3FC4AA LICA3T263P3FC4AA MIL-PRF-123 LICAZD504M3FC1AB current loop
Contextual Info: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking

Low Inductance Capacitors

Contextual Info: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking

LD18

Abstract: LD17
Contextual Info: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking

LD18

Abstract: Capacitor 16v LD17
Contextual Info: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking

Contextual Info: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking

Contextual Info: LGA Low Inductance Capacitors 0204/0306/0508/0805 Land Grid Arrays AVX has introduced a revolutionary new capacitor for low inductance applications. Low inductance LGA land grid array capacitors have virtually the equivalent high frequency performance of 8-terminal IDC’s (Inter-Digitated Capacitors) but are built in a simplified 2 terminal package.

HIGH VOLTAGE MLCC (SURFACE MOUNT)

Contextual Info: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking

IDC0508

Abstract: Licc avx 0612 bl 0306
Contextual Info: Low Inductance Chip Capacitors AVX's low inductance are designed for high speed IC packages and hybrid circuits. Their aspect ratio and size have been optimized to reduce inductance from the 2 nH range found in normal chip capacitors to less than 0.5 nH. Their low profile 20 mils is ideal for

mlcc AVX

Abstract: HIGH VOLTAGE MLCC (SURFACE MOUNT)
Contextual Info: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking

Contextual Info: LGA Low Inductance Capacitors 0204/0306/0805 Land Grid Arrays Land Grid Array LGA capacitors are the latest family of low inductance MLCCs from AVX. These new LGA products are the third low inductance family developed by AVX. The innovative LGA technology sets a new standard for low inductance MLCC performance.

0M0701-N

Abstract: LICC
Contextual Info: 0612/0508/0306 LICC Low Inductance Chip Capacitors GENERAL DESCRIPTION The total inductance of chip capacitor is determined both by its length to width ratio and by the mutual inductance coupling between its electrodes. Thus a 1210 chip size has a lower inductance than a 1206 chip.

LICA3T333M1FC4AA

Abstract: ld18 LD17 LICA3T104P1FC1AA LICA3T134M1FC1AA LICA3T153P3FC4AA LICA3T193M3FC4AA LGA land pattern AVX LD X5R capacitor ceramic AVX
Contextual Info: Low Inductance Capacitors SnPb LICC 0612/0508/0306 X7R & X5R Dielectric The total inductance of a chip capacitor is determined both by its length to width ratio and by the mutual inductance coupling between its electrodes. Thus a 1210 chip size has a lower inductance than a 1206 chip. This design improvement is the basis of AVX’s Low Inductance Chip Capacitors (LICC), where the electrodes are terminated on the long side of the chip instead of the short side. The 1206

Contextual Info: IDC Low Inductance Capacitors RoHS 0306/0612/0508 IDC (InterDigitated Capacitors) GENERAL DESCRIPTION 0612 + + – L – – Style 3 + 0508 0306 TYPICAL IMPEDANCE Impedance (Ohms) 10 MLCC_1206 1 LICC_0612 0.1 IDC_0612 0.01 0.001 1 10 100 1000 Frequency (MHz)

S-LICC10M1101-C

Abstract: Licc avx 0612 2000 LICC kyocera
Contextual Info: A KYOCERA GROUP COMPANY AVX Low Inductance Capacitors Table of Contents Low Inductance Capacitors Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2-3 Low Inductance Chip Capacitors

RH221C106MA3RA3

Abstract: cap 0306 package ceramic capacitor 0201 1 uf NON POLAR capacitor rh225c226
Contextual Info: 1765-2012.qxp:QuarkCatalogTempNew 9/17/12 5:47 PM Page 1765 21 Ceramic Chip and Low Inductance Capacitors AU Series MLCC Gold Termination Capacitors RoHS RoHS The AU Series MLCC Gold Termination Series provides for customers needing commercial and military Multilayer Ceramic Capacitors with gold

bl 0306

Contextual Info: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking

bl 0306

Contextual Info: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking

0306 capacitor

Abstract: LICC ZD105 cap 0306 package
Contextual Info: Low Inductance Capacitors 0612/0508/0306 LICC Low Inductance Chip Capacitors GENERAL DESCRIPTION The total inductance of a chip capacitor is determined both by its length to width ratio and by the mutual inductance coupling between its electrodes. Thus a 1210 chip size has a lower inductance than a 1206 chip. This

Contextual Info: Low Inductance Capacitors Introduction The signal integrity characteristics of a Power Delivery Network PDN are becoming critical aspects of board level and semiconductor package designs due to higher operating frequencies, larger power demands, and the ever shrinking