CDFP4 Search Results

DG509A

Abstract: CERAMIC FLATPACK 20pin dg509aal
Contextual Info: SCOPE: MONOLITHIC CMOS, ANALOG MULTIPLEXER Device Type 01 02 Generic Number DG508AA x /883B DG509AA(x)/883B Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows: Outline Letter K L P Z Mil-Std-1835 GDIP1-T16 or CDIP2-T16 CDFP4-16

CDFP4-F24

Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K24.A MIL-STD-1835 CDFP4-F24 (F-6A, CONFIGURATION B) 24 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN

5962-8750401XA

Abstract: qml-38535 5962-8750401EA CDFP4-F16 GDFP2-F16 GDIP1-T16 AS10H504F16
Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Changes according to NOR 5962-R029-92. thn 91-11-22 Mionica L. Poelking B Changes according to NOR 5962-R130-93. tvn 93-04-12 Thomas M. Hess C Add package CDFP4-F16. Change document to current electronic format.

cdfp4-f16

Contextual Info: Ceramic Package Ceramic Metal Seal Flatpack Packages Flatpack K16.A MIL-STD-1835 CDFP4-F16 (F-5A, CONFIGURATION B) 16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.045

cdfp4-f16

Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K16.A MIL-STD-1835 CDFP4-F16 (F-5A, CONFIGURATION B) 16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN

10H524

Abstract: 5962-8756001ea qml-38535 CDFP4-F16 GDFP2-F16 GDIP1-T16 "5962-8756001FA"
Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Made technical changes in Table I. Editorial changes throughout. mlp 92-01-27 Monica L. Poelking B Changes in accordance with NOR 5962-R268-92. tvn 92-08-04 Monica L. Poelking C Add package CDFP4-F16. Use new boilerplate. ljs

10H525

Abstract: 5962-8750801ea MTL10H525EA qml-38535 AS10H525F16/883C MTL10H5252A CDFP4-F16 GDFP2-F16 GDIP1-T16 MTL10H525FA
Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Made technical changes to Table I. Figure 4 added. Editorial changes throughout. mlp 92-01-27 Monica L. Poelking B Changes in accordance with NOR 5962-R107-93. tvn 93-04-01 Monica L. Poelking C Add package CDFP4-F16. Use new boilerplate. ljs

qml-38535

Abstract: CDFP4-F16 GDFP2-F16 GDIP1-T16 10h576
Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Changes according to NOR 5962-R106-93. - ltg 93-03-29 Monica L. Poelking B Add package CDFP4-F16. Change document to current electronic format. Editorial changes throughout. - les 98-02-04 Raymond Monnin

Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Made technical changes to Table I. Figure 4 added. Editorial changes throughout. mlp 92-01-27 Monica L. Poelking B Changes in accordance with NOR 5962-R107-93. tvn 93-04-01 Monica L. Poelking C Add package CDFP4-F16. Use new boilerplate. ljs

Contextual Info: SCOPE: QUAD SPST CMOS ANALOG SWITCHES Device Type 01 02 Generic Number DG201AA x /883B DG202A(x)/883B Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows: Outline Letter L K Z Mil-Std-1835 CDFP4-F16 GDIP1-T16 or CDIP2-T16

Contextual Info: SCOPE: QUAD SPST CMOS ANALOG SWITCHES Device Type 01 02 Generic Number DG201AA x /883B DG202A(x)/883B Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows: Outline Letter L K Z Mil-Std-1835 CDFP4-F16 GDIP1-T16 or CDIP2-T16

CDFP4-F20

Abstract: K20.A Package k20a
Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K20.A MIL-STD-1835 CDFP4-F20 (F-9A, CONFIGURATION B) 20 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN

5962-8756001EA

Abstract: 87-11-24 qml-38535 CDFP4-F16 GDFP2-F16 GDIP1-T16 10H524 C0840
Contextual Info: REVISIONS LTR DESCRIPTIO N DATE YR -M O -D A A PPR O VED A Made technical changes in Table I. Editorial changes throughout, mlp 92-01-27 Monica L. Poelking B C hanges in accordance with NOR 5962-R268-92. tvn 92-08-04 Monica L. Poelking C Add package CDFP4-F16. Use new boilerplate.

SMD ic 431c

Abstract: 10H525 5962-8750801ea qml-38535 CDFP4-F16 GDFP2-F16 GDIP1-T16
Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA A Made technical changes to Table 1. Figure 4 added. throughout, mlp B Editorial changes APPROVED 92-01-27 Monica L. Poelking Changes in accordance with NOR 5962-R107-93. tvn 93-04-01 Monica L. Poelkinq C Add package CDFP4-F16. Use new boilerplate. Ijs

max703mja

Abstract: MAX643 MAX813LMJA OP-07P DG509AAL max708MJA MAX8211MFB MX7502SQ Group Specs 82 19-0053 G100 10 CAN DG200AAK/883B DG200AAK/883B DG201AAK/883B DG201AA IH5048
Contextual Info: SCOPE: QUAD SPST CMOS ANALOG SWITCHES Device Type 01 02 Generic Number DG201AA x /883B DG202A(x)/883B Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows: Outline Letter L K Z Mil-Std-1835 CDFP4-F16 GDIP1-T16 or CDIP2-T16

K20.A Package

Abstract: CDFP4-F20 AA2020
Contextual Info: Ceramic Package Ceramic Metal Seal Flatpack Packages Flatpack K20.A MIL-STD-1835 CDFP4-F20 (F-9A, CONFIGURATION B) 20 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.045

CDFP4-F24

Contextual Info: Ceramic Package Ceramic Metal Seal Flatpack Packages Flatpack K24.A MIL-STD-1835 CDFP4-F24 (F-6A, CONFIGURATION B) 24 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.045

CDFP4-F16

Abstract: HCTS193DMSR HCTS193HMSR HCTS193KMSR HCTS193MS
Contextual Info: HCTS193MS Radiation Hardened Synchronous 4-Bit Up/Down Counter September 1995 Features • • • • • • • • • • • • • Pinouts 3 Micron Radiation Hardened CMOS SOS Total Dose 200K RAD Si SEP Effective LET No Upsets: >100 MEV-cm2/mg Single Event Upset (SEU) Immunity < 2 x 10-9 Errors/BitDay (Typ)

HCS109MS

Abstract: CDFP4-F16 HCS109DMSR HCS109HMSR HCS109KMSR HCS109
Contextual Info: HCS109MS Radiation Hardened Dual JK Flip Flop September 1995 Features Pinouts • 3 Micron Radiation Hardened SOS CMOS 16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T16, LEAD FINISH C TOP VIEW • Total Dose 200K RAD (Si) • SEP Effective LET No Upsets: >100 MEV-cm2/mg

HCS244DMSR

Abstract: HCS244HMSR HCS244KMSR HCS244MS
Contextual Info: HCS244MS Radiation Hardened Octal Buffer/Line Driver, Three-State September 1995 Features Pinouts 20 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T20 TOP VIEW • 3 Micron Radiation Hardened CMOS SOS • Total Dose 200K RAD (Si)/s

ISL4422ARH

Abstract: 5962F0152101QXC ISL7442ARH 5962F0152101VXC CDFP4-F16 HS-1825ARH IS-1845ASRH ISL74422ARH ISL74422ARHQF ISL74422ARHVF
Contextual Info: ISL74422ARH Data Sheet itle L74 2AR ea bt adian rded , nertwer ST iv utho ) eyrds terrpoion, minctor, dian rded, d rd, ace, tel, June 2001 Radiation Hardened 9A, Non-Inverting Power MOSFET Drivers File Number 9031.1 Features • QML Qualified per MIL-PRF-38535 Requirements

CDFP4-F16

Abstract: HCS193DMSR HCS193HMSR HCS193KMSR HCS193MS
Contextual Info: HCS193MS Radiation Hardened Synchronous 4-Bit Up/Down Counter September 1995 Features Pinouts • 3 Micron Radiation Hardened CMOS SOS 16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T16, LEAD FINISH C TOP VIEW • Total Dose 200K RAD (Si)

5962F9956002VXC

Abstract: 5962F9956001VXC HS-4424RH 4424 FS055 HS-4424BRH HS9-4424BRH-8 5962-F9956002QXC HS9-4424RH-8 SMD SINGLE GATE
Contextual Info: HS-4424RH, HS-4424BRH Data Sheet June 1999 Radiation Hardened Dual, Non-Inverting Power MOSFET Drivers The Radiation Hardened HS-4424RH and HS-4424BRH are non-inverting, dual, monolithic high-speed MOSFET drivers designed to convert TTL level signals into high current

vw 9a engines

Abstract: ACTS373DMSR ACTS373HMSR ACTS373KMSR ACTS373MS
Contextual Info: ACTS373MS Radiation Hardened Octal Transparent Latch, Three-State April 1995 Features Pinouts 20 LEAD CERAMIC DUAL-IN-LINE MIL-STD-1835 DESIGNATOR, CDIP2-T20, LEAD FINISH C TOP VIEW • 1.25 Micron Radiation Hardened SOS CMOS • Total Dose 300K RAD Si • Single Event Upset (SEU) Immunity