CERAMIC LEADLESS CHIP CARRIER 68 Search Results

CERAMIC LEADLESS CHIP CARRIER LCC 44

Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 68 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 32 LCC 44 leadless chip carrier CERAMIC LEADLESS CHIP CARRIER package datasheet
Contextual Info: Ceramic Leadless Chip Carrier LCC 20 Lead Ceramic Leadless Chip Carrier, Type C NS Package Number E20A 2000 National Semiconductor Corporation MS101105 www.national.com Ceramic Leadless Chip Carrier (LCC) August 1999 Ceramic Leadless Chip Carrier (LCC)

leadless chip carrier

Abstract: MIL-STD-1835 L55 PACKAGE DIAGRAM L51 transistor diagram L64 PACKAGE DIAGRAM 20 PIN LEADLESS CHIP CARRIER
Contextual Info: Package Diagram Ceramic Leadless Chip Carriers 32-Lead Leadless Chip Carrier L45 51-80047 1 Package Diagram 18-Pin Rectangular Leadless Chip Carrier L50 MIL-STD-1835 C-10 A 51-80063 2 Package Diagram 20-Pin Rectangular Leadless Chip Carrier L51 MIL-STD-1835 C-13

CERAMIC LEADLESS CHIP CARRIER

Abstract: MIL-STD-1835 leadless chip carrier 20 PIN LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER 68 MIL-STD square L64 PACKAGE DIAGRAM 7c79
Contextual Info: Package Diagram Ceramic Leadless Chip Carriers 32-Lead Leadless Chip Carrier L45 1 Package Diagram 18-Pin Rectangular Leadless Chip Carrier L50 MIL-STD-1835 C-10 A 2 Package Diagram 20-Pin Rectangular Leadless Chip Carrier L51 MIL-STD-1835 C-13 3 Package Diagram

44 Lead Ceramic Leadless Chip Carrier

Abstract: leadless chip carrier MIL-STD-1835
Contextual Info: Package Diagrams Ceramic Leadless Chip Carriers 32-Lead Leadless Chip Carrier L45 51-80047 1 Package Diagrams 18-Pin Rectangular Leadless Chip Carrier L50 MIL-STD-1835 C-10 A 51-80063 2 Package Diagrams 20-Pin Rectangular Leadless Chip Carrier L51 MIL-STD-1835 C-13

CERAMIC LEADLESS CHIP CARRIER

Abstract: J68.A Package
Contextual Info: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J68.A 0.010 S E H S 68 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE D INCHES D3 j x 45o E3 B E SYMBOL MIN MAX MIN MAX NOTES A 0.067 0.087 1.70 2.20 6, 7 A1 0.058 0.072 1.47 1.83 - B - - - - - B1 0.033

CERAMIC LEADLESS CHIP CARRIER

Abstract: h 033 clcc 68
Contextual Info: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J68.B j x 45o 0.010 S E H S 68 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE D INCHES D3 E3 B E 0.010 S E F S h HEAT SINK BASE A SYMBOL MIN MAX MIN MAX NOTES A 0.092 0.118 2.34 3.00 6, 7 A1 0.067 0.083

ordering information

Contextual Info: Mechanical Drawings DEVICES INCORPORATED Mechanical Drawings ❑ Ceramic Dual In-line Package ❑ Sidebraze, Hermetic Dual In-line Package ❑ Flatpack ❑ Ceramic Pin Grid Array ❑ Plastic J-Lead Chip Carrier ❑ Ceramic Leadless Chip Carrier ❑ Ceramic Flatpack

EB 203 D

Abstract: CERAMIC LEADLESS CHIP CARRIER
Contextual Info: PACKAGE INFORMATION DRAWING C1 – 28-Pad Ceramic Leadless Chip Carrier CLLCC (Package Type C) 3 2 1 B1 A1 28 B e1 E E3 E2 A D3 D D2 Family: Ceramic Leadless Chip Carrier Millimeters Symbol Min Max A 2.41 A1 1.37 B Inches Min Max 3.30 0.095 0.130 1.96 0.054

Contextual Info: IA82510 ASYNCHRONOUS SERIAL CONTROLLER Data Sheet As of Production Ver. 01 FEATURES • Form, Fit, and Function Compatible with the Intel 82510 • Packaging options available: 28 Pin Plastic or Ceramic DIP, 28 Pin Plastic Leaded Chip Carrier, 28 Pin Ceramic Leadless Chip Carrier

P82510

Abstract: n82510 8250 uart intel 8250 intel uart intel 8250 UART 8250a uart intel TN82510 82510 uart 8250A uart 82510 loopback
Contextual Info: IA82510 ASYNCHRONOUS SERIAL CONTROLLER Data Sheet As of Production Ver. 01 FEATURES • Form, Fit, and Function Compatible with the Intel 82510 • Packaging options available: 28 Pin Plastic or Ceramic DIP, 28 Pin Plastic Leaded Chip Carrier, 28 Pin Ceramic Leadless Chip Carrier

P82510

Abstract: n82510 8250 uart intel intel 8250 UART P8251 8250 ic pin intel 82510 tp82510 IA82510 IA82510-PDW28I-01
Contextual Info: IA82510 ASYNCHRONOUS SERIAL CONTROLLER Data Sheet As of Production Ver. 01 FEATURES • Form, Fit, and Function Compatible with the Intel 82510 • Packaging options available: 28 Pin Plastic or Ceramic DIP, 28 Pin Plastic Leaded Chip Carrier, 28 Pin Ceramic Leadless Chip Carrier

Contextual Info: IA82510 ASYNCHRONOUS SERIAL CONTROLLER Data Sheet As of Production Ver. 01 FEATURES • Form, Fit, and Function Compatible with the Intel 82510 • Packaging options available: 28 Pin Plastic or Ceramic DIP, 28 Pin Plastic Leaded Chip Carrier, 28 Pin Ceramic Leadless Chip Carrier

intel PLCC packaging draw

Contextual Info: Page 1 of 12 IA82510 ASYNCHRONOUS SERIAL CONTROLLER Data Sheet FEATURES • Form, Fit, and Function Compatible with the Intel 82510 • Packaging options available: 28 Pin Plastic or Ceramic DIP, 28 Pin Plastic Leaded Chip Carrier, 28 Pin Ceramic Leadless Chip Carrier

pj 69

Contextual Info: 64-Channel Serial To Parallel Converter With Ruggedized High Voltage CMOS Outputs Ordering Information Package Options Device Recommended Operating Vpp Max 84-Pad Ceramic Leadless Chip Carrier 84-J Lead Plastic Chip Carrier 60V HV04H06LC HV04H06PJ 80V HV04H08LC

Contextual Info: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier

documentation for 32 bit alu in vlsi

Abstract: EPROM 27001 TMS320C25 starter
Contextual Info: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier

k534

Contextual Info: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier

SMJ320C25GBM

Abstract: smj320c25
Contextual Info: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier

Contextual Info: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier

documentation for 32 bit alu in vlsi

Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame SMJ320C25 D1057 5962-8861902XA SMJ320C25-50
Contextual Info: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier

Contextual Info: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier

SMJ320C25

Abstract: SMJ320C25-50
Contextual Info: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier

LACT

Contextual Info: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier

SMJ320C25

Abstract: SMJ320C25-50 0006H rfid
Contextual Info: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier