CERAMIC LEADLESS CHIP CARRIER CLCC Search Results

CERAMIC LEADLESS CHIP CARRIER

Abstract: J68.A Package
Contextual Info: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J68.A 0.010 S E H S 68 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE D INCHES D3 j x 45o E3 B E SYMBOL MIN MAX MIN MAX NOTES A 0.067 0.087 1.70 2.20 6, 7 A1 0.058 0.072 1.47 1.83 - B - - - - - B1 0.033

CERAMIC LEADLESS CHIP CARRIER

Abstract: 8512E
Contextual Info: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J20.B 0.010 S E H S 20 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE D INCHES D3 j x 45 SYMBOL o E3 B E A1 0.097 1.78 2.46 6, 7 0.077 1.37 1.96 - B - - - - - B1 0.020 0.030 0.51 0.76 2, 4 0.15 0.56

CERAMIC LEADLESS CHIP CARRIER

Contextual Info: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J44.B 0.010 S E H S 44 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE D INCHES D3 j x 45o E3 B E SYMBOL MIN MAX MIN MAX NOTES A 0.067 0.087 1.70 2.20 6, 7 A1 0.058 0.072 1.47 1.83 - B - - - - - B1 0.022

CQCC1-N20

Abstract: CERAMIC LEADLESS CHIP CARRIER n20 n
Contextual Info: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J20.A MIL-STD-1835 CQCC1-N20 (C-2) 20 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES D3 j x 45 o E3 B E MIN MAX MIN MAX NOTES A 0.060 0.100 1.52 2.54 6, 7 A1 0.050 0.088 1.27 2.23

CERAMIC LEADLESS CHIP CARRIER CLCC 28

Abstract: MIL-STD-1835 CQCC1-N28 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER package CQCC1-N28
Contextual Info: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J28.A MIL-STD-1835 CQCC1-N28 (C-4) 28 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES D3 j x 45 o E3 B E MIN MAX MIN MAX NOTES A 0.060 0.100 1.52 2.54 6, 7 A1 0.050 0.088 1.27 2.23

CERAMIC LEADLESS CHIP CARRIER

Abstract: h 033 clcc 68
Contextual Info: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J68.B j x 45o 0.010 S E H S 68 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE D INCHES D3 E3 B E 0.010 S E F S h HEAT SINK BASE A SYMBOL MIN MAX MIN MAX NOTES A 0.092 0.118 2.34 3.00 6, 7 A1 0.067 0.083

CERAMIC LEADLESS CHIP CARRIER

Abstract: E2318
Contextual Info: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J18.A 0.010 S E H S 18 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE D INCHES D3 j x 45o E3 B E h x 45o 0.010 S E F S A A1 PLANE 2 SYMBOL MIN MAX MIN MAX NOTES A 0.054 0.075 1.37 1.91 6, 7 A1 0.044

CERAMIC LEADLESS CHIP CARRIER

Abstract: CQCC1-N32
Contextual Info: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J32.A MIL-STD-1835 CQCC1-N32 (C-12) 32 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES D3 j x 45o E3 B E 0.010 S E F S A A1 PLANE 2 PLANE 1 -E- SYMBOL MIN MAX MIN MAX NOTES A 0.060

CERAMIC LEADLESS CHIP CARRIER

Abstract: J18B CERAMIC LEADLESS CHIP CARRIER package
Contextual Info: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J18.B 0.010 S E H S 18 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE D INCHES D3 j x 45o E3 B E h x 45o 0.010 S E F S A A1 PLANE 2 PLANE 1 -E- SYMBOL MIN MAX MIN MAX NOTES A 0.054 0.075 1.37 1.91 6, 7

CERAMIC LEADLESS CHIP CARRIER

Abstract: J20.C Package
Contextual Info: Ceramic Packages Ceramic Leadless Chip Carrier Packages CLCC J20.C MIL-STD-1835 CQCC3-N20 (C-13) 20 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES D3 j x 45o E3 B E 0.010 S E F S A A1 PLANE 2 PLANE 1 -E- SYMBOL MIN MAX MIN MAX NOTES A 0.060

CERAMIC LEADLESS CHIP CARRIER

Abstract: J44.A Package CQCC1-N44 CERAMIC LEADLESS CHIP CARRIER package
Contextual Info: Ceramic Package Ceramic Leadless Chip Carrier Packages CLCC J44.A MIL-STD-1835 CQCC1-N44 (C-5) 44 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES D3 j x 45o E3 B E 0.010 S E F S A A1 PLANE 2 PLANE 1 -E- SYMBOL MIN MAX MIN MAX NOTES A 0.064

CQCC1-N32

Abstract: CERAMIC LEADLESS CHIP CARRIER
Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Leadless Chip Carrier Packages CLCC J32.A MIL-STD-1835 CQCC1-N32 (C-12) 32 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES SYMBOL D3 j x 45 o E3 E A PLANE 2 PLANE 1 -E- 0.007 M E F S H S

Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Leadless Chip Carrier Packages CLCC J20.C MIL-STD-1835 CQCC3-N20 (C-13) 20 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES D3 j x 45o E3 B E h x 45o 0.010 S E F S A A1 PLANE 2 PLANE 1 -E-

MIL-STD-1835 CQCC1-N28

Abstract: clcc 68 CQCC1-N28 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER 68 datasheet d 442 CERAMIC LEADLESS CHIP CARRIER CLCC 28
Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Leadless Chip Carrier Packages CLCC J28.A MIL-STD-1835 CQCC1-N28 (C-4) 28 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES D3 j x 45o E3 B E h x 45o 0.010 S E F S A A1 PLANE 2 PLANE 1 -E-

CQCC1-N20

Abstract: ne55 CERAMIC LEADLESS CHIP CARRIER
Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Leadless Chip Carrier Packages CLCC J20.A MIL-STD-1835 CQCC1-N20 (C-2) 20 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES D3 j x 45o E3 B E h x 45o 0.010 S E F S A PLANE 2 PLANE 1 -E- MIN

CERAMIC LEADLESS CHIP CARRIER

Abstract: CQCC1-N44
Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Leadless Chip Carrier Packages CLCC J44.A MIL-STD-1835 CQCC1-N44 (C-5) 44 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE 0.010 S E H S D INCHES D3 j x 45o E3 B E h x 45o 0.010 S E F S A A1 PLANE 2 PLANE 1 -E-

Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Leadless Chip Carrier Packages CLCC J3.A B D 3 PAD HERMETIC SMD.5 PACKAGE CERAMIC BOTTOM TERMINAL CHIP CARRIER INCHES E A TOP VIEW SYMBOL MIN MAX MIN MAX NOTES A 0.110 0.124 2.79 3.15 3 A1 0.010 0.020 0.25

b3 smd transistor

Abstract: CBCC1-N3 SMD Transistor Y14 smd diode B3 CERAMIC LEADLESS CHIP CARRIER HERMETIC SMD smd b3 SMD y14
Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Leadless Chip Carrier Packages CLCC J3.A 3 PAD HERMATIC SMD.5 PACKAGE CERAMIC BOTTOM TERMINAL CHIP CARRIER B D INCHES E A TOP VIEW MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.110 0.124 2.79 3.15 3 A1 0.010

pkg 4015

Contextual Info: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier

Contextual Info: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier

documentation for 32 bit alu in vlsi

Abstract: EPROM 27001 TMS320C25 starter
Contextual Info: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier

k534

Contextual Info: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier

SMJ320C25GBM

Abstract: smj320c25
Contextual Info: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier

Contextual Info: SMJ320C25, SMJ320C25Ć50 DIGITAL SIGNAL PROCESSOR SGUS007D – AUGUST 1988 – REVISED OCTOBER 2001 D D D D D D D D D D D D D D D D D D – 68-Pin Leaded Ceramic Chip Carrier FJ Suffix – 68-Pin Ceramic Grid Array (GB Suffix) – 68-Pin Leadless Ceramic Chip Carrier