CERAMIC LEADLESS CHIP CARRIER LCC 32 SOCKET Search Results

CERAMIC CHIP CARRIER LCC 68 socket

Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
Contextual Info: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a

28 PIN lcc socket

Contextual Info: CMOS EPROM Surface Mount Programming Adapter Manufacturers As the market for nonvolatile memory parts in surface mount packages increases, so does the interest in simple, low cost pro­ gramming socket adapters. These adapters allow users of standard programming equip­

231369

Abstract: TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package
Contextual Info: Package Module PC Card Outlines and Dimensions February 1996 Order Number 231369-012 PACKAGE MODULE PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369 – 1 EXAMPLES A80486DX25SX387 32-Bit Microprocessor 25 MHz 168-Lead Ceramic Pin Grid Array

Side Brazed Ceramic Dual-In-Line Packages

Abstract: intel packaging databook Side Brazed Ceramic Dual-In-Line Packages 28 outline of the heat slug for JEDEC 64 CERAMIC LEADLESS CHIP CARRIER LCC 68 pin plcc socket view bottom BGA and QFP Package BGA package tray 64 tray tsop 1220 gate count
Contextual Info: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than nineteen million transistors, and device count is expected to increase to 100 million by the year

i87C51

Abstract: i87C52 ST72T71N5B1 i80c51 i87c51fa sab8031 89CXX 80c154 intel PIC16C84 MICROCHIP DATA BOOK Z08614
Contextual Info: Flash MCU Order Code Guide Atmel Intel Philips AMD Microchip Zilog Matra Dallas Siemens AT89C51 i80C31 i80C51 i87C51 PCx80C31 SC80C31 PCx80C51 SC80C51 SC87C51 8751 87C51 PIC16C73 PIC16C74 Z84C01, Z84C50, Z08614 Z80C30, Z85C30, Z86C15 Z85230, Z850230, Z86C30

intel packaging

Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays
Contextual Info: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than

Contextual Info: Raytheon Electronics Semiconductor Division R296XX/R297XX S tandard PROMs and P ow er-S w itched SPROMs Features Description • Devices are available in military -55°C to +125°C temperature range • Standard PROMs are offered in power-switched SPROM

TSOP 56 socket

Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817
Contextual Info: CHAPTER 1 INTRODUCTION OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex electronics designers are challenged to fully harness their computing power Today’s products can feature more than three million transistors and device count is expected to increase to one hundred million by the

Contextual Info: LPR520/521 LPR520/521 DEVICES INCORPORATED 4 x 16-bit Multilevel Pipeline Register 4 x 16-bit Multilevel Pipeline Register DEVICES INCORPORATED FEATURES DESCRIPTION ❑ Four 16-bit Registers ❑ Implements Double 2-Stage Pipeline or Single 4-Stage Pipeline

Contextual Info: PRECISION BULK METAL FOIL TECHNOLOGY A COM PANY OF V I S H A Y VISHAY MODELS VSM85, VSM86, VSM87, VSM88 and VSM89 VISHAY RESISTORS Surface Mount Hermetic Resistor Networks In Leadless Chip Carrier LCC Configuration Vishay Model VSM networks incorporate all the performance

Contextual Info: WTL 2516/2516A/2516B/2516C PARALLEL ARRAY MULTIPLIER PRELIMINARY DATA APRIL, 1986 Features SELECTABLE O U TPU T M ODE 16 x 16 PA R A LLEL ARRAY M U LTIPLIER O utput latch m ode selectable for clocked or transpar­ ent operation LOW P O W E R k C M O g ^ IT H T T L C O M PA TIB LE I/O

Contextual Info: VSM85, 86, 87, 88, 89 Vishay Foil Resistors SURFACE MOUNT Bulk Metal Foil Technology Surface Mount Hermetic Resistor Networks In Leadless Chip Carrier LCC Configuration Vishay Model VSM networks incorporate all the performance features of Vishay Bulk Metal® Foil technology in a product

CERAMIC LEADLESS CHIP CARRIER LCC 52 socket

Abstract: VSM85 VSM85, 86, 87, 88, 89 CERAMIC LEADLESS CHIP CARRIER LCC 32 socket
Contextual Info: VSM85, 86, 87, 88, 89 Vishay Foil Resistors SURFACE MOUNT Bulk Metal Foil Technology Surface Mount Hermetic Resistor Networks In Leadless Chip Carrier LCC Configuration Vishay Model VSM networks incorporate all the performance features of Vishay Bulk Metal® Foil technology in a product

lcc 44 socket

Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 52 socket
Contextual Info: VSM85, 86, 87, 88, 89 Vishay Foil Resistors SURFACE MOUNT Bulk Metal Foil Technology Surface Mount Hermetic Resistor Networks In Leadless Chip Carrier LCC Configuration Vishay Model VSM networks incorporate all the performance features of Vishay Bulk Metal® Foil technology in a product

CERAMIC LEADLESS CHIP CARRIER LCC 52

Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 52 socket lcc 28 socket
Contextual Info: VSM85, 86, 87, 88, 89 Vishay Foil Resistors SURFACE MOUNT Bulk Metal Foil Technology Surface Mount Hermetic Resistor Networks In Leadless Chip Carrier LCC Configuration Vishay Model VSM networks incorporate all the performance features of Vishay Bulk Metal® Foil technology in a product

y10 smd

Abstract: PR521
Contextual Info: LPR520/521 4 x 16-bit Multilevel Pipeline Register Üfc.VlO t-S IN C O R P O R A I L U DESCRIPTION FEATURES □ Four 16-bit Registers □ Implements Double 2-Stage Pipe­ line or Single 4-Stage Pipeline Register □ Hold, Shift, and Load Instructions □ Separate Data In and Data Out Pins

VSM85

Abstract: 29r4 R757 VSM87 CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC 32 socket 12 CERAMIC LEADLESS CHIP CARRIER LCC lcc 28 socket
Contextual Info: P R E C I S I O N B U L K M E T A L F O I L T E C H N O L O G Y VISHAY MODELS VSM85, VSM86, VSM87, VSM88 and VSM89 Surface Mount Hermetic Resistor Networks In Leadless Chip Carrier LCC Configuration Vishay Model VSM networks incorporate all the performance

Contextual Info: mm « _ _ LMU08/8U — 8 x 8-bit Parallel Multiplier D E V IC F S IN C O R P O R A TE D [ FEATURES □ □ □ □ □ 20 ns Worst-Case Multiply Time Low Power CMOS Technology LMU08 Replaces TRW TMC208K LMU8U Replaces TRW TMC28KU T w o’s Complement LMU08 , or

Contextual Info: VITESSE FEATURES • Serial Data Rates up to 1.25 Gb/s • Parallel Data Rates up to 155 Mb/s • ECL 100K Compatible Parallel Data I/Os • Divide-by-8 Clock for Synchronization of Par­ allel Data to Interfacing Chips • SONET Frame Recovery Circuitry VS8012

Contextual Info: I mi in«/«11 LMÜ03/EU 8 x 8-bit Parallel Multiplier IJbVIÜI-S INuuHHÜKA IH □ 20 ns Worst-Case Multiply Time □ LMU8U Replaces TRW TMC28KU □ Tw o’s Complement LMU08 , or Unsigned Operands (LMU8U) □ Three-State Outputs The LMU08 and LMU8U are high­

Contextual Info: LPR520/521 4 x 16-bit Multilevel Pipeline Register V IC I S INCORPORA ILL DESCRIPTION FEATURES □ Four 16-bit Registers □ Implements Double 2-Stage Pipe­ line or Single 4-Stage Pipeline Register □ Hold, Shift, and Load Instructions □ Separate Data In and Data Out Pins

LMU08PC70

Abstract: smd diode 8U LMU08 LMU08PC35 LMU08PC50 TMC208K TMC28KU LMU08JC70
Contextual Info: LMU08/8U LMU08/8U DEVICES INCORPORATED 8 x 8-bit Parallel Multiplier 8 x 8-bit Parallel Multiplier DEVICES INCORPORATED FEATURES ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ ❑ DESCRIPTION 20 ns Worst-Case Multiply Time Low Power CMOS Technology LMU08 Replaces TRW TMC208K

2Mbit EPROM

Abstract: 7LV02
Contextual Info: PRELIMINARY Advanced Micro Devices Am27LV020/Am27LV020B 2 Megabit 262,144 x 8-Bit Low Voltage CMOS EPROM DISTINCTIVE CHARACTERISTICS • Single 3.3 V power supply — Regulated power supply 3.0 V -3.6 V — Unregulated power supply 2.7 V -3 .6 V (battery-operated systems)

AA10

Abstract: PIC16C54 32816 C038A
Contextual Info: PACKAGING Commercial/Industrial Outlines and Parameters PART NUMBER SUFFIX DESIGNATIONS: Examples: XXXXXXXXXX - XX X/XX XXX QTP, SQTP, or ROM Code or Special Requirements Case D J K L P S W CB JN JW PQ SJ SL SM SN SO SP SS TS VS 27C256T - 15I/J PIC16C54 - RCI/SO