CERAMIC LEADLESS CHIP CARRIER LCC 68 PAD Search Results

CERAMIC LEADLESS CHIP CARRIER LCC 68

Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC 44 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER J-Lead, plcc PLCC 44 leadless quad flat j-leaded package 12 CERAMIC LEADLESS CHIP CARRIER LCC
Contextual Info: Packages Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description 44A 44 Lead, Thin (1.0 mm) Plastic Gull Wing Quad

CERAMIC LEADLESS CHIP CARRIER LCC 24

Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 124 MIL-STD-1835 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad 20P3 TQFP 144 PACKAGE DIMENSION MS-018 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 68
Contextual Info: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44 Lead, Thin (1.0 mm)

CERAMIC LEADLESS CHIP CARRIER LCC 24

Abstract: 20P3 JEDEC TSSOP 28 LEAD PACKAGE DIMENSIONS PQFP 132
Contextual Info: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description 44A 44 Lead, Thin (1.0 mm)

Atmel 918

Abstract: c22v10 atv750-15dm SMD CODE list smd code book "SMD Code" transistor smd list "SMD Code" 15 SMD CODES AT22V10L
Contextual Info: SMD PLDs Introduction to the SMD Product Listing Each Standardized Military Drawing SMD part number that Atmel supplies corresponds to an Atmel /883 part number. SMD products are compliant to MIL-STD-883, paragraph 1.2.1 and to the requirements of the applicable standardized military drawing. The tables in this section list the currently approved Atmel SMD parts by Atmel

CERAMIC CHIP CARRIER LCC 68 socket

Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 52 socket CERAMIC LEADLESS CHIP CARRIER LCC 124 CERAMIC LEADLESS CHIP CARRIER LCC 68 dimensions CERAMIC CHIP CARRIER LCC 68 socket LCC068 LCC124 LCC084 CERAMIC LEADLESS CHIP CARRIER LCC 52 sA 673 transistor
Contextual Info: Request / Informations diverses : a.bolis@dsmielectronics.com Sales / Ventes : sales@dsmielectronics.com HOME PRODUCT SALE DSMI Electronics SA DSMI acquires Precicontact SA assets All the standard products are available as ROHS compliant and as non ROHS upon request

CERAMIC LEADLESS CHIP CARRIER LCC 124

Contextual Info: INTL. M I C R O C I R C U I T S INC MÔE D MflSGMlfl OGDOSMfl fl4b • I f I T IMIK3000 FAMILY 1.0 Micron CMOS GATE ARRA YS T- V2 -IÌ-D 1 '•*{ r, In t e r n a t io n a l M icro cir cuit s Inc PRELIMINARY PRODUCT FEATURES March 1991 PRODUCT DESCRIPTION The IMIK3000 family of gate arrays from International

231369

Abstract: TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package
Contextual Info: Package Module PC Card Outlines and Dimensions February 1996 Order Number 231369-012 PACKAGE MODULE PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369 – 1 EXAMPLES A80486DX25SX387 32-Bit Microprocessor 25 MHz 168-Lead Ceramic Pin Grid Array

Contextual Info: •A M I Packaging Availability AMERICAN MICROSYSTEMS, INC. August 1996 AMI offers you space-saving and cost-effective packages and package processes spanning a broad spectrum of capabilities. AMI can meet your package requirements in a variety of ways. You can choose from ten basic package

Contextual Info: H A R R HU 276 IS S E M I C O N D U C T O R 8-Bit, 500MSPS Flash A/D Converter March 1994 Description Features Differential Linearity Error ±0.5 LSB or Less Integral Linearity Error ±0.7 LSB or Less Built-In Integral Linearity Compensation Circuit Ultra High Speed Operation with Maximum

51C55

Abstract: l 7251 3.1 HCA6306 motorola gate array CERAMIC LEADLESS CHIP CARRIER LCC 124 HCA6348
Contextual Info: MO T OR O LA SC -CM EdORY/ASIO SI De | 636,7251 M O T O R O L A SC MEMORY/ASIC HDSiiLnfi ! 31C 55658 H J • - T - 42-'H~ O') J HGA6300 SERIES GENERAL DESCRIPTION The periphery consists of input and I/O buffer cells used to implement the interface between the internal array and

HI9P0508-5

Abstract: 100N 9c transistor HI507
Contextual Info: HI-506, HI-507 Hl~508, HIS09 H a r r is S E M I C O N D U C T O R December 1993 Single 16 and 8/Differential 8 and 4 Channel CMOS Analog Multiplexers Features Description • Low On Resistance 1 son The HI-506/HI-507 and HI-508/HI-509 monolithic CMOS multiplexers each include an array of sixteen and eight ana­

HIS07

Abstract: H1509 HIS-07 bts i17 H11-0508-5
Contextual Info: M-506, HI-507 Hl~508, Hl~509 " HAS U j S E M I C O N D U C T O R December 1993 Single 16 and 8/Differential 8 and 4 Channel CMOS Analog Multiplexers Features Description • Low On Resistance 1800 The HI-506/HI-507 and HI-508/HI-509 monolithic CMOS multiplexers each include an array of sixteen and eight ana­

1034-01

Abstract: 74 series family LP5080A LP5140A LP7080C LP7080P LP7140P LP7220P Laserpath Corporation lsi logic arrays
Contextual Info: LSP LASERPATH LP7000P, LP7000C, LP5000A Series Gate Arrays ONE DAY GATE ARRAYS A p ril 1987 Laserpath’s LP7000P, LP7000C, and LP5000A Series are high I/O gate arrays, manufac­ tured using 2-micron, 2-layer metal HCMOS technology. They have the same electrical

HI4-0508/883

Abstract: AN521 HI-506 HI-507 HI-508 HI509 HI-509 HI-549 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad
Contextual Info: HI-506, HI-507 HI-508, HI-509 S E M I C O N D U C T O R December 1993 Single 16 and 8/Differential 8 and 4 Channel CMOS Analog Multiplexers Features Description • Low On Resistance 180Ω The HI-506/HI-507 and HI-508/HI-509 monolithic CMOS multiplexers each include an array of sixteen and eight analog switches respectively, a digital decoder circuit for channel

HI1396JCP

Abstract: HI1396JCJ
Contextual Info: hWNSSf! HI1396, CXA1396 8-Bit, 125 MSPS Flash A/D Converter February 1996 Features Description • Differential Linearity Error ±0.5 LSB Typ or Less The HI1396, CXA1396 is an 8-bit ultra high speed flash analog-to-digital converter IC capable of digitizing analog signals

Contextual Info: ill H HI-506, HI-507 HI-508, HI-509 a r r is \M3 S E M I C O N D U C T O R D ecem ber 1993 Single 16 and 8/Differential 8 and 4 Channel CM O S Analog Multiplexers Features Description • Low On Resistance 180Q T he HI-506/HI-507 and HI-508/HI-509 m onolithic C M O S

XC7272

Contextual Info: XC7272 Programmable Logic Device flX IL IN X Preliminary Product Description, Feb. 1992 FEATURES metic carry lines running directly between adjacent Macrocells and Function Blocks support fast adders, subtractors and comparators of any length up to 72 bits.

High voltage diode BY 509

Abstract: I508 harris 509-5 I3-509 harris hi-508 i3-508 HI9P-0508-5 hi9p0508 H11-508
Contextual Info: S 3 h a r r HI-508/509 is HI-508/509 Single 8/Differential 4 Channel CMOS Analog Multiplexers Features • Description Low On Resistance Typ .180H • Wide Analog Signal R a n g e . ±15V • TTL/CMOS C om patible.2.4V

AAAC

Contextual Info: Philips Semiconductors-Signetlcs FAST TTL Logic Series Surface Mounted ICs SECTION 7 INTRODUCTION Easier Board Rework Economic survival is driving the electronics industry to use cheaper, faster, more reliable and more dense systems and components. Assembly technologies, such as SMD

OB 2269

Abstract: Gigabit Logic 16G071-10L1E hn 834 Fujitsu APD plcs 1530 16G071-10L1 GIGABIT LOGIC INC "gigabit logic" 16G071-10X
Contextual Info: Ig b lï G ig aB it Logic 16G071 Transimpedance Amplifier 18 dB Gain / 700 MHz Bandwidth FEATURES •High gain > 18 dB • Broad Bandwith: DC to 700 MHz typ. ■Low noise: 3 pAA/Hz typ. for 16G071-30L1 • -35.3 dBm input sensitivity for 10'9 BER @ 1.2 Gbit/s

Contextual Info: HARRIS H U 2 7 6 , C X A 1 2 7 6 S E M I C O N D U C T O R 8-Bit, 500 MSPS Flash A/D Converter February 1996 Features Description Differential Linearity Error ±0.5 LSB or Less The H11276, CXA1276 is a 8-bit ultra high speed flash Analog-to-Digital converter IC capable of digitizing analog sig­

Contextual Info: TEKTRONIX INC/ TRI rSUINT 2LE D El aiObSJa OOOOSOS a « T R Ú T 4 'j 3.11 G ig a B it L o g ic 1 -T A 16G011 Programmable GaAs Schottky Diode Arrays FEATURES • 14 Schottky barrier diodes and one full wave rectifier on each chip • 15 mA 16G010 and 100 mA (16G011) versions

Contextual Info: f lì H A R R HI1166 IS S E M I C O N D U C T O R 8>Bit, 250MSPS Flash A/D Converter March 1994 Features • Description Differential Linearity Error ±0.5 LSB or Less The H11166 is an 8-bit ultra high speed flash Analog-to-Digital converter IC capable of digitizing analog signals at a max­

CXA1276

Abstract: CXA1276K HI1276 HI1276AIL HI20201
Contextual Info: HI1276, CXA1276 S E M I C O N D U C T O R 8-Bit, 500 MSPS Flash A/D Converter February 1996 Features Description • Differential Linearity Error ±0.5 LSB or Less The HI1276, CXA1276 is a 8-bit ultra high speed flash Analog-to-Digital converter IC capable of digitizing analog signals at a maximum rate of 500 MSPS. The digital I/O levels