CERAMIC QUAD FLATPACK CQFP Search Results

CERAMIC QUAD FLATPACK CQFP

Abstract: CQFP64 Cqfp128 CQFP CQFP256 CQFP-128 EL28B 64 ceramic quad flatpack EL116A EL132B
Contextual Info: Ceramic Quad Flatpack CQFP 28 Lead Ceramic Quad Flatpack NS Package Number EL28B 2000 National Semiconductor Corporation MS101107 www.national.com Ceramic Quad Flatpack (CQFP) August 1999 Ceramic Quad Flatpack (CQFP) 64 Lead Ceramic Quad Flatpack NS Package Number EL64A

CERAMIC QUAD FLATPACK CQFP

Abstract: R84 Package
Contextual Info: Ceramic Packages Ceramic Quad Flatpack CQFP 0.012 M C A S - B S R84.A D S 84 LEAD CERAMIC QUAD FLATPACK PACKAGE 0.012 M C A S - B S D D S D1 PIN #1 L e A A e2 E E1 -A-B- bxN A S -B S e1 C D S -D- MILLIMETERS MIN MAX MIN A - 0.105 - MAX 2.67 NOTES - b 0.015

48 Lead Ceramic Quad Flatpack

Abstract: CERAMIC QUAD FLATPACK CQFP 96 CERAMIC QUAD FLATPACK CQFP
Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Quad Flatpack CQFP 0.012 M C A S - B S R48.A D S 48 LEAD CERAMIC QUAD FLATPACK PACKAGE 0.012 M C A S - B S INCHES D S D SYMBOL D1 A PIN NO. 1 L e A A -AE1 E e2 -B- e1 bxN 0.008 M A S -B S C D S MIN MILLIMETERS

CERAMIC QUAD FLATPACK CQFP

Abstract: CERAMIC QUAD FLATPACK CQFP 96
Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Quad Flatpack CQFP 0.012 M C A S - B S R68.A D S 68 LEAD CERAMIC QUAD FLATPACK PACKAGE 0.012 M C A S - B S D INCHES D S SYMBOL D1 A PIN NO. 1 L e A A -AE1 e2 E -B- e1 bxN 0.008 M A S -B S C D S MIN MILLIMETERS

CERAMIC QUAD FLATPACK CQFP

Abstract: 8361H CY7C37512P208B-UM
Contextual Info: Cypress Semiconductor Assembly Site Transfer Qualification Report QTP# 003102 VERSION 1.0 December, 2000 160/208-pin Ceramic Quad Flatpack CQFP Alphatec, Bangkok CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director (408) 432-7069

transistor tip 41a

Abstract: WC32P040-XXM MC68040 41 bb FPN 82 gigabyte diagram
Contextual Info: WC32P040-XXM White Electronic Designs 68040 FEATURES „ Selection of Processor Speeds: 25, 33MHz „ Military Temperature Range: -55°C to +125°C „ Packaging • 179 pin Ceramic PGA P4 • 184 lead Ceramic Quad Flatpack, CQFP (Q4) „ 32-Bit, Nonmultiplexed External Address and Data

CERAMIC QUAD FLATPACK CQFP

Contextual Info: Cypress Semiconductor Qualification Report QTP# 97061 VERSION 1.0 November, 1997 160-pins Ceramic Quad Flatpack CQFP Golden Altos Assembly Cypress Semiconductor Assembly: Golden Altos, USA Package: 160-pins CQFP QTP# 97304, V. 1.0 Page 2 of 4 August, 1997

68851

Abstract: W47B b9 39a 68881
Contextual Info: WC32P020-XXM White Electronic Designs 68020 FEATURES „ Selection of Processor Speeds: 16.67, 20, 25 MHz „ Military Temperature Range: -55°C to +125°C „ Packaging • 114 pin Ceramic PGA P2 • 132 lead Ceramic Quad Flatpack, CQFP (Q2) „ Object-code compatible with earlier 68000

RadTol Eclipse FPGA

Abstract: SW-DIP JP35 C143 T transistor fpq-352 C143 E S S transistor D 1413 transistor UT8RHEEB-208C H11-201 SN74HC14D
Contextual Info: Standard Products UT8RHEEB-208C RadTol Eclipse FPGA UT6325 Evaluation Board Preliminary Data Sheet September 2008 www.aeroflex.com/FPGA INTRODUCTION FEATURES ‰ User configurable evaluation board for the UT6325 RadTol Eclipse FPGAs ‰ Supports the 208 ceramic quad flatpack

Contextual Info: Hermetic Packages for Integrated Circuits Package Outline Drawing R48.A 48 CERAMIC QUAD FLATPACK PACKAGE CQFP Rev 3, 10/12 1.118 (28.40) 1.080 (27.43) 0.572 (14.53) 0.555 (14.10) #1 #48 0.287 (7.29) 0.253 (6.43) 0.040 (1.02) BSC PIN 1 INDEX AREA 0.572 (14.53)

Contextual Info: Hermetic Packages for Integrated Circuits Package Outline Drawing R64.C 64 CERAMIC QUAD FLATPACK PACKAGE CQFP WITH BOTTOM HEATSINK Rev 1, 10/13 1.118 (28.40) 1.080 (27.43) 0.567 (14.40) 0.547 (13.90) 0.290 (7.37) 0.255 (6.48) 64 0.025 (0.635) BSC 1 49 PIN 1

Contextual Info: Hermetic Packages for Integrated Circuits Package Outline Drawing R48.B 48 CERAMIC QUAD FLATPACK PACKAGE CQFP WITH BOTTOM HEATSINK Rev 0, 10/12 1.118 (28.40) 1.080 (27.43) 0.572 (14.53) 0.555 (14.10) #1 #48 0.287 (7.29) 0.253 (6.43) 0.040 (1.016) BSC PIN 1

sc 1365

Contextual Info: MECHANICAL DATA MCFP023B – DECEMBER 1996 HFG S-CQFP-F196 CERAMIC QUAD FLATPACK WITH TIE BAR Thermal Resistance Characteristics 1.365 (34,67) 1.325 (33,66) PARAMETER °C/W RθJC 1.3 RθJA 28.9 1.200 (30,48) TYP 0.600 (15,20) TYP “A” 49 0.225 (5,72)

Contextual Info: Hermetic Packages for Integrated Circuits Package Outline Drawing R64.A 64 CERAMIC QUAD FLATPACK PACKAGE CQFP Rev 5, 10/13 1.118 (28.40) 1.080 (27.43) 0.567 (14.40) 0.547 (13.90) 0.290 (7.37) 0.255 (6.48) 64 0.025 (0.635) BSC 49 1 PIN 1 INDEX AREA 48 0.567 (14.40)

Contextual Info: MECHANICAL DATA MCFP021B – DECEMBER 1996 HFG S-CQFP-F172 CERAMIC QUAD FLATPACK WITH TIE BAR 1.165 (29,59) 1.125 (28,58) 1.052 (26,72) 1.048 (26,61) “A” 43 0.275 (6,99) Tie Bar Width 0.175 (4,44) 1 44 172 1.710 (43,43) 1.690 (42,93) 2.505 (63,63) 2.485 (63,12)

CERAMIC QUAD FLATPACK CQFP

Abstract: CQFP 240
Contextual Info: CQFP.FRM Page 1 Tuesday, February 9, 1999 4:20 PM CQFP Packaging Capabilities Surface Mount Description The Ceramic Quad Flatpack CQFP is a high-density package for high lead count surface mount applications. It has a higher lead count and smaller lead pitch than most

64 ceramic quad flatpack

Abstract: MO-113AE
Contextual Info: MECHANICAL DATA MCQF007B – DECEMBER 1996 HFG S-CQFP-F164 CERAMIC QUAD FLATPACK WITH TIE-BAR 1.165 (29,59) 1.125 (28,58) 0.275 (6,99) Tie Bar Width 0.175 (4,44) 1.002 (25,45) 0.998 (25,35) ”A” 41 1 42 164 Heatsink 1.710 (43,43) 1.690 (42,93) 2.505 (63,63)

S-CQFP-F84

Contextual Info: MECHANICAL DATA MCFP014C – JANUARY 1995 – REVISED JUNE 1999 HFG S-CQFP-F84 CERAMIC QUAD FLATPACK WITH NCTB 0.660 (16,76) SQ 0.640 (16,26) 0.500 (12,70) BSC 0.160 (4,06) Tie Bar Width 0.120 (3,05) ”A” 21 1 84 22 0.970 (24,64) 0.940 (23,88) 42 1.620 (41,15)

MO-113AC

Abstract: 64 ceramic quad flatpack
Contextual Info: MECHANICAL DATA MCFP019C – JANUARY 1995 – REVISED JUNE 1999 HFG S-CQFP-F132 CERAMIC QUAD FLATPACK WITH NCTB 0.960 (24,38) SQ 0.940 (23,88) 0.800 (20,32) BSC 0.375 (9,53) Tie Bar Width 0.325 (8,26) ”A” 33 1 34 132 1.520 (38,61) 1.480 (37,59) 66 100

404-0170

Abstract: 4040170
Contextual Info: MECHANICAL DATA MCFP037 – OCTOBER 1994 HU S-CQFP-F196 CERAMIC QUAD FLATPACK 1.555 (39,50) SQ 1.545 (39,24) 1.365 (34,67) SQ 1.335 (33,91) 25 1 172 171 26 1.200 (30,48) TYP 0.025 (0,64) MIN 73 0.014 (0,36) 0.002 (0,05) 123 74 0.025 (0,64) 0.008 (0,20) 0.004 (0,10)

Contextual Info: MECHANICAL DATA MCFP025 – OCTOBER 1994 HFA S-CQFP-F256 CERAMIC QUAD FLATPACK 1.260 (32,00) TYP 0.020 (0,51) 64 1 DETAIL A 65 256 0.120 (3,04) MAX 0.008 (0,20) 0.004 (0,11) 0.012 (0,30) 0.006 (0,15) 193 128 0.101 (2,57) 0.083 (2,11) DETAIL A 129 192 DETAIL B

dallas 2505

Abstract: 64 ceramic quad flatpack MCFP016C MO-113AD
Contextual Info: MECHANICAL DATA MCFP016C – JANUARY 1995 – REVISED JUNE 1999 HFG S-CQFP-F100 CERAMIC QUAD FLATPACK WITH NCTB 0.760 (19,30) 0.740 (18,80) SQ 0.600 (15,24) BSC 0.475 (12,07) ”A” 25 Tie Bar Width 0.425 (10,80) 1 100 26 1.520 (38,61) 1.480 (37,59) 2.505 (63,63)

S-CQFP-F84

Abstract: 64 ceramic quad flatpack S-CQFP-F84 Package
Contextual Info: MECHANICAL DATA MCFP014B – DECEMBER 1996 HFG S-CQFP-F84 CERAMIC QUAD FLATPACK WITH TIE BAR 0.660 (16,76) SQ 0.640 (16,26) 0.160 (4,06) Tie Bar Width 0.120 (3,05) “A” 21 1 22 84 44 67 45 0.975 (24,77) 0.935 (23,75) 1.620 (41,15) SQ 1.590 (40,39) 66

Contextual Info: MECHANICAL DATA MCFP019C – JANUARY 1995 – REVISED JUNE 1999 HFG S-CQFP-F132 CERAMIC QUAD FLATPACK WITH NCTB 0.960 (24,38) SQ 0.940 (23,88) 0.800 (20,32) BSC 0.375 (9,53) Tie Bar Width 0.325 (8,26) ”A” 33 1 34 132 1.520 (38,61) 1.480 (37,59) 66 100