CERAMIC QUAD FLATPACK CQFP 96 Search Results

48 Lead Ceramic Quad Flatpack

Abstract: CERAMIC QUAD FLATPACK CQFP 96 CERAMIC QUAD FLATPACK CQFP
Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Quad Flatpack CQFP 0.012 M C A S - B S R48.A D S 48 LEAD CERAMIC QUAD FLATPACK PACKAGE 0.012 M C A S - B S INCHES D S D SYMBOL D1 A PIN NO. 1 L e A A -AE1 E e2 -B- e1 bxN 0.008 M A S -B S C D S MIN MILLIMETERS

CERAMIC QUAD FLATPACK CQFP

Abstract: CERAMIC QUAD FLATPACK CQFP 96
Contextual Info: Hermetic Packages for Integrated Circuits Ceramic Quad Flatpack CQFP 0.012 M C A S - B S R68.A D S 68 LEAD CERAMIC QUAD FLATPACK PACKAGE 0.012 M C A S - B S D INCHES D S SYMBOL D1 A PIN NO. 1 L e A A -AE1 e2 E -B- e1 bxN 0.008 M A S -B S C D S MIN MILLIMETERS

2 010 073 007

Abstract: cqfp package outline CERAMIC QUAD FLATPACK CQFP CQFP 172 PIN
Contextual Info: AMI A M I S E M IC O N D U C T O R %s CQFP Packaging Capabilities Description Surface Mount The ceramic Quad Flatpack CQFP is a high-density package for high lead count surface mount applications. It has a higher leaad count and smaller lead pitch than most other ceramic packages. It has been provided in a

transistor tip 41a

Abstract: WC32P040-XXM MC68040 41 bb FPN 82 gigabyte diagram
Contextual Info: WC32P040-XXM White Electronic Designs 68040 FEATURES „ Selection of Processor Speeds: 25, 33MHz „ Military Temperature Range: -55°C to +125°C „ Packaging • 179 pin Ceramic PGA P4 • 184 lead Ceramic Quad Flatpack, CQFP (Q4) „ 32-Bit, Nonmultiplexed External Address and Data

sc 1365

Contextual Info: MECHANICAL DATA MCFP023B – DECEMBER 1996 HFG S-CQFP-F196 CERAMIC QUAD FLATPACK WITH TIE BAR Thermal Resistance Characteristics 1.365 (34,67) 1.325 (33,66) PARAMETER °C/W RθJC 1.3 RθJA 28.9 1.200 (30,48) TYP 0.600 (15,20) TYP “A” 49 0.225 (5,72)

68851

Abstract: W47B b9 39a 68881
Contextual Info: WC32P020-XXM White Electronic Designs 68020 FEATURES „ Selection of Processor Speeds: 16.67, 20, 25 MHz „ Military Temperature Range: -55°C to +125°C „ Packaging • 114 pin Ceramic PGA P2 • 132 lead Ceramic Quad Flatpack, CQFP (Q2) „ Object-code compatible with earlier 68000

64 ceramic quad flatpack

Abstract: MO-113AE
Contextual Info: MECHANICAL DATA MCQF007B – DECEMBER 1996 HFG S-CQFP-F164 CERAMIC QUAD FLATPACK WITH TIE-BAR 1.165 (29,59) 1.125 (28,58) 0.275 (6,99) Tie Bar Width 0.175 (4,44) 1.002 (25,45) 0.998 (25,35) ”A” 41 1 42 164 Heatsink 1.710 (43,43) 1.690 (42,93) 2.505 (63,63)

Contextual Info: MECHANICAL DATA MCFP021B – DECEMBER 1996 HFG S-CQFP-F172 CERAMIC QUAD FLATPACK WITH TIE BAR 1.165 (29,59) 1.125 (28,58) 1.052 (26,72) 1.048 (26,61) “A” 43 0.275 (6,99) Tie Bar Width 0.175 (4,44) 1 44 172 1.710 (43,43) 1.690 (42,93) 2.505 (63,63) 2.485 (63,12)

S-CQFP-F84

Abstract: 64 ceramic quad flatpack S-CQFP-F84 Package
Contextual Info: MECHANICAL DATA MCFP014B – DECEMBER 1996 HFG S-CQFP-F84 CERAMIC QUAD FLATPACK WITH TIE BAR 0.660 (16,76) SQ 0.640 (16,26) 0.160 (4,06) Tie Bar Width 0.120 (3,05) “A” 21 1 22 84 44 67 45 0.975 (24,77) 0.935 (23,75) 1.620 (41,15) SQ 1.590 (40,39) 66

Contextual Info: MECHANICAL DATA MCQF010 – JUNE 1998 HFN S-CQFP-F408 CERAMIC QUAD FLATPACK WITH TIE BAR 3.850 (97,79) TYP 2.674 (67,92) SQ 2.626 (66,70) 0.225 (5,72) 0.175 (4,45) 2.525 (64,13) TYP 1 102 ”A” 103 408 Á Á Á Á Á 2.820 (71,73) 2.810 (71,37) 4.050 (102,87)

Contextual Info: MECHANICAL DATA MCFP016B – DECEMBER 1996 HFG S-CQFP-F100 CERAMIC QUAD FLATPACK WITH TIE BAR 0.750 (19,05) TYP SQ 0.600 (15,24) TYP SQ “A” 25 1 26 100 50 76 1.520 (38,61) 1.480 (37,59) 2.505 (63,63) 2.485 (63,12) “C” 51 1.150 (29,21) 8 Places 75

R-CQFP-F256

Abstract: Mechanical Products
Contextual Info: MECHANICAL DATA MCFP026A – JANUARY 1997 HFH R-CQFP-F256 CERAMIC QUAD FLATPACK WITH NCTB 76,40 74,85 75,40 74,60 57,00 55,60 36,36 35,64 1,55 Dia 1,45 4 Places 31,50 BSC 256 1 Detail “C” 193 192 70,00 3,60 3,50 64 129 65 128 Detail “B” 2,60 2,50

Contextual Info: MECHANICAL DATA MCFP019B – DECEMBER 1996 HFG S-CQFP-F132 CERAMIC QUAD FLATPACK WITH TIE BAR Thermal Resistance Characteristics 0.950 (24,13) TYP SQ 0.800 (20,32) TYP SQ “A” 33 1 34 132 66 100 67 1.150 (29,21) 8 Places PARAMETER °C/W RθJC 2.1 RθJA

Contextual Info: MECHANICAL DATA MCQF004B – DECEMBER 1996 HFG S-CQFP-F132 CERAMIC QUAD FLATPACK WITH TIE-BAR 0.960 (24,38) TYP SQ 0.945 (24,00) ”A” 0.800 (20,32) TYP SQ 33 1 34 132 1.210 (30,73) TYP 2.015 (51,18) 1.990 (50,55) 100 2.025 (51,44) MAX 66 67 99 “C”

Contextual Info: MECHANICAL DATA MCQF002 – NOVEMBER – 1995 HBB S-CQFP-G128 CERAMIC QUAD FLATPACK 0,40 0,23 0,13 96 65 0,07 M 64 97 128 33 1 0,13 NOM 32 12,40 TYP Gage Plane 14,20 SQ 13,80 16,20 SQ 15,80 0,05 MIN 1,45 1,35 0,25 0°– 7° 0,75 0,45 Seating Plane 0,08

max3200

Contextual Info: MECHANICAL DATA MCFP028A – JANUARY 1997 HFH R-CQFP-F320 CERAMIC QUAD FLATPACK WITH NCTB 76,40 74,85 75,40 74,60 57,00 55,60 44,44 43,56 1,55 Dia 1,45 4 Places 5,50 4,50 39,50 BSC 320 1 241 240 “C” 70,00 3,60 3,50 161 160 80 81 2,60 2,50 “B” 2,60

Contextual Info: MECHANICAL DATA MCFP027A – JANUARY 1997 HFH R-CQFP-F288 CERAMIC QUAD FLATPACK WITH NCTB 76,40 74,85 75,40 74,60 57,00 55,60 40,40 39,60 1,55 Dia 1,45 4 Places 5,50 4,50 35,50 BSC 217 216 288 1 “C” 70,00 3,60 145 144 72 73 3,50 2,60 2,50 “B” 2,60

Contextual Info: MECHANICAL DATA MCFP029A – JANUARY 1997 HFH S-CQFP-F352 CERAMIC QUAD FLATPACK WITH NCTB 76,40 74,85 75,40 74,60 57,00 55,60 48,48 47,52 1,55 1,45 4 Places Dia 5,50 4,50 43,50 BSC 265 264 352 1 Detail “C” 70,00 3,60 3,50 177 176 88 89 2,60 2,50 Detail “B”

Contextual Info: MECHANICAL DATA MCQF003B – DECEMBER 1996 HBY R-CQFP-G64 CERAMIC QUAD FLATPACK 0,40 0,20 1,00 51 33 32 52 18,00 17,20 14,20 13,80 12,00 TYP 64 20 1 19 0,15 NOM 18,00 TYP 20,20 19,80 24,40 23,60 0,25 MIN 0°– 7° 1,18 0,78 Seating Plane 0,10 4,26 MAX 4081543/D 08/96

Contextual Info: MECHANICAL DATA MCQF006A – JANUARY 1997 HBZ R-CQFP-G100 CERAMIC QUAD FLATPACK 0,40 0,20 0,65 80 51 81 50 12,35 TYP 100 14,20 13,80 18,00 17,20 31 1 30 0,15 NOM 18,85 TYP 20,20 19,80 24,00 23,20 0,25 MIN 0°– 7° 1,18 0,78 Seating Plane 0,10 4,26 MAX

Contextual Info: MECHANICAL DATA MCFP033 – OCTOBER 1994 HGA S-CQFP-F128 CERAMIC QUAD FLATPACK 96 65 64 97 0,35 TYP 0,80 128 33 0,15 TYP 1 32 24,80 TYP 3,46 3,12 28,10 SQ 27,90 32,30 SQ 31,70 0,20 MIN 0°– 5° 1,20 0,80 Seating Plane 0,10 3,68 MAX 4040118 / B 03/95 NOTES: A. All linear dimensions are in millimeters.

ARINC 629 sim

Abstract: m38510/55501 AMP ARINC-629 SIM MT72038 smd cmos 4435 CQFP 240 arinc 629 controller P2X smd CERAMIC PIN GRID ARRAY CPGA lead frame arinc 629
Contextual Info: The Microelectronic Specialists Product SHORT FORM January 2001 AEROFLEX UTMC UT69151 SµMMIT DXE • UT69151 SµMMIT™ XTE ■ UT69151 SµMMIT™ RTE ■ 1760 ■ ■ ■ ■ ■ ■ ■ ■ 84,132 84 1.0E6* Q,V 5962-92118 ■ ■ ■ ■ ■ ■ ■

CDR33 Reliability data

Contextual Info: Standard Products RadHard Eclipse FPGA Family 6250 and 6325 Advanced Data Sheet December, 2004 www.aeroflex.com/RadHardFPGA FEATURES ‰ Comprehensive design tools include high quality Verilog/ VHDL synthesis and simulation ‰ QuickLogic IP available for microcontrollers, DRAM

ceramic pin grid array package plating

Contextual Info: Standard Products RadHard Eclipse FPGA Family 6250 and 6325 Advanced Data Sheet May, 2005 www.aeroflex.com/RadHardFPGA FEATURES ‰ Comprehensive design tools include high quality Verilog/ VHDL synthesis and simulation ‰ QuickLogic IP available for microcontrollers, DRAM