CERDIP 16 LEAD Search Results

MIL-STD-1835

Abstract: D22 PACKAGE DIAGRAM 40 PIN CERDIP D2 Package diagram D2 Package MIL-STD d 1835 D5011 cerdip cerdip 16 lead
Contextual Info: Package Diagram Ceramic Dual-In-Line Packages 16-Lead 300-Mil CerDIP D2 MIL-STD-1835 D-2 Config. A 18-Lead (300-Mil) CerDIP D4 MIL-STD-1835 D-6 Config. A 1 Package Diagram 20-Lead (300-Mil) CerDIP D6 MIL-STD-1835 D-8 Config. A 22–Lead (400–Mil) CerDIP D8

ad7543kn

Abstract: AD7543JN
Contextual Info: Package/Price Information 12-Bit, Multiplying Iout, SERIAL Model Status Package Description Pin Count Temperature Range Price* 100-499 AD7543AQ PRODUCTION CERDIP GLASS SEAL 16 COMMERCIAL - AD7543BQ PRODUCTION CERDIP GLASS SEAL 16 COMMERCIAL - AD7543GBQ OBSOLETE

80041

Abstract: MIL-STD-1835 40 PIN CERDIP cerdip D16 PACKAGE DIAGRAM 80046 CERDIP 52 D2 Package diagram D22 PACKAGE DIAGRAM D50 transistor
Contextual Info: Package Diagram Ceramic Dual-In-Line Packages 16-Lead 300-Mil CerDIP D2 MIL-STD-1835 D-2 Config. A 51-80027 18-Lead (300-Mil) CerDIP D4 MIL-STD-1835 D-6 Config. A 51-80028 1 Package Diagram 20-Lead (300-Mil) CerDIP D6 MIL-STD-1835 D-8 Config. A 51-80029

MIL-STD-1835

Abstract: sidebraze
Contextual Info: Package Diagrams Ceramic Dual-In-Line Packages 16-Lead 300-Mil CerDIP D2 MIL-STD-1835 D-2 Config. A 51-80027 18-Lead (300-Mil) CerDIP D4 MIL-STD-1835 D-6 Config. A 51-80028 1 Package Diagrams 20-Lead (300-Mil) CerDIP D6 MIL-STD-1835 D-8 Config. A 51-80029

SOT-74

Abstract: SOT74
Contextual Info: Philips Semiconductors Package outlines SOT74 16-lead dual in-line; ceramic cerdip Dimensions in mm. August 1994 1

FPT-16C-C01

Contextual Info: SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN CERAMIC FPT-16C-C01 16-pin ceramic SOP Lead pitch 50 mil Lead shape Straight Sealing method Cerdip FPT-16C-C01 16-pin ceramic SOP (FPT-16C-C01) +0.51 9.53 –0.13 0.125±0.025 (.005±.005) +.020

Q-16

Contextual Info: a 16-Lead Ceramic Dip-Glass Hermetic Seal Package [CERDIP] Q-16 Dimensions shown in inches and (millimeters) 0.005 (0.13) MIN 0.098 (2.49) MAX 16 9 0.310 (7.87) 0.220 (5.59) PIN 1 1 0.200 (5.08) MAX 8 0.840 (21.34) MAX 0.060 (1.52) 0.015 (0.38) 0.320 (8.13)

780102

Abstract: FPT-16C-C01 16PIN
Contextual Info: SMALL OUTLINE PACKAGE 16 PIN CERAMIC FPT-16C-C01 16-pin ceramic SOP Lead pitch 50mil Lead shape Straight Sealing method Cerdip FPT-16C-C01 16-pin ceramic SOP (FPT-16C-C01) +0.51 9.53 –0.13 +.020 .375 –.005 0.125±0.025 (.005±.005) 0.58(.023)MAX 7.80±1.02

209MIL

Contextual Info: SMALL OUTLINE PACKAGE 16 PIN CERAMIC FPT-16C-C02 16-pin ceramic SOP Lead pitch 50mil Row spacing 209mil Lead shape Gullwing Sealing method Cerdip FPT-16C-C02 16-pin ceramic SOP (FPT-16C-C02) 0.43±0.05 (.0170±.002) 2.41(.095) MAX 0.05(.002) MIN 0.76(.030)

HCT137

Contextual Info: ^Supertex inc. HCT137 HCT237 Octal D ecoders/D em ultiplexers Ordering Information Package 16-pin plastic DIP 16-pin CERDIP 16-pin ceram ic side-brazed DIP 20-pin ceram ic leadless chip carrier Outputs Com m ercial 74HCT Inverted 74H CT137P Non-lnverted 74H CT237P

Contextual Info: SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN CERAMIC To Top / Package Lineup / Package Index FPT-16C-C02 16-pin ceramic SOP Lead pitch 50 mil Row spacing 209 mil Lead shape Gullwing Sealing method Cerdip FPT-16C-C02 16-pin ceramic SOP (FPT-16C-C02)

7705201EX

Abstract: adg509akn
Contextual Info: Package/Price Information 8-Channel Analog Multiplexer Superior DG508A Replacement Status Package Description 77052012X PRODUCTION CER. LEADLESS CHIP CARRIER 20 MILITARY $21.16 7705201EX PRODUCTION CERDIP GLASS SEAL 16 MILITARY $13.07 ADG508ABCHIPS PRODUCTION

50 mil pitch ceramic package

Abstract: FPT-16C-C01 78002
Contextual Info: SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN CERAMIC To Top / Package Lineup / Package Index FPT-16C-C01 16-pin ceramic SOP Lead pitch 50 mil Lead shape Straight Sealing method Cerdip FPT-16C-C01 16-pin ceramic SOP (FPT-16C-C01) +0.51 9.53 –0.13

Q-16

Contextual Info: a 16-Lead Ceramic Dual In-Line Package [CERDIP] Q-16 Dimensions shown in inches and (millimeters) 0.005 (0.13) MIN 0.098 (2.49) MAX 16 9 0.310 (7.87) 0.220 (5.59) PIN 1 1 0.200 (5.08) MAX 8 0.840 (21.34) MAX 0.060 (1.52) 0.015 (0.38) 0.320 (8.13) 0.290 (7.37)

Q-16

Contextual Info: 16-Lead Ceramic Dual In-Line Package [CERDIP] Q-16 Dimensions shown in inches and (millimeters) a 0.005 (0.13) MIN 0.098 (2.49) MAX 16 9 1 PIN 1 8 0.310 (7.87) 0.220 (5.59) 0.100 (2.54) BSC 0.840 (21.34) MAX 0.200 (5.08) MAX 0.200 (5.08) 0.125 (3.18) 0.023 (0.58)

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN CERAMIC To Top / Package Lineup / Package Index DIP-16C-C01 EIAJ code :∗DIP016-G-0300-2 16-pin ceramic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Cerdip DIP-16C-C01 16-pin ceramic DIP

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN CERAMIC To Top / Package Lineup / Package Index DIP-16C-C02 EIAJ code :∗DIP016-G-0300-3 16-pin ceramic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Cerdip DIP-16C-C02 16-pin ceramic DIP

Contextual Info: DUAL IN-LINE PACKAGE 16 PIN CERAMIC DIP-16C-C01 EIAJ code : ∗DIP016-G-0300-2 Lead pitch 100mil Row spacing 300mil Sealing method Cerdip 16-pin ceramic DIP DIP-16C-C01 16-pin ceramic DIP (DIP-16C-C01) +0.71 19.30 –0.15 .760 +.028 –.006 R0.64(.025) REF

Contextual Info: DUAL IN-LINE PACKAGE 16 PIN CERAMIC DIP-16C-C04 EIAJ code : ∗DIP016-G-0300-5 Lead pitch 100mil Row spacing 300mil Sealing method Cerdip 16-pin ceramic DIP DIP-16C-C04 16-pin ceramic DIP (DIP-16C-C04) +0.71 19.30 –0.15 +.028 .760 –.006 R0.64(.025) REF

16-Pin Ceramic DIP

Abstract: DIP-16C-C01 d16011
Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN CERAMIC DIP-16C-C01 EIAJ code :∗DIP016-G-0300-2 16-pin ceramic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Cerdip DIP-16C-C01 16-pin ceramic DIP (DIP-16C-C01) +0.71 19.30 –0.15

Contextual Info: DUAL IN-LINE PACKAGE 16 PIN CERAMIC DIP-16C-C02 EIAJ code : ∗DIP016-G-0300-3 Lead pitch 100mil Row spacing 300mil Sealing method Cerdip 16-pin ceramic DIP DIP-16C-C02 16-pin ceramic DIP (DIP-16C-C02) +0.71 19.30 –0.15 .760 +.028 –.006 R0.64(.025) REF

508 DIP 16

Abstract: 16-Pin Ceramic DIP
Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN CERAMIC DIP-16C-C02 EIAJ code :∗DIP016-G-0300-3 16-pin ceramic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Cerdip DIP-16C-C02 16-pin ceramic DIP (DIP-16C-C02) +0.71 19.30 –0.15

Contextual Info: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN CERAMIC To Top / Package Lineup / Package Index DIP-16C-C04 EIAJ code :∗DIP016-G-0300-5 16-pin ceramic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Cerdip DIP-16C-C04 16-pin ceramic DIP

ADG506A DIE

Abstract: ADG526ATE/plji
Contextual Info: Package/Price Information Latchable 16-Channel Multiplexer Latched ADG506A Status Package Description 5962-89710013X PRODUCTION CER. LEADLESS CHIP CARRIER 28 MILITARY $54.75 5962-8971001XX PRODUCTION CERDIP GLASS SEAL 28 MILITARY $30.01 ADG526ABCHIPS PRODUCTION