MIL-STD-1835
Abstract: D22 PACKAGE DIAGRAM 40 PIN CERDIP D2 Package diagram D2 Package MIL-STD d 1835 D5011 cerdip cerdip 16 lead
Text: Package Diagram Ceramic Dual-In-Line Packages 16-Lead 300-Mil CerDIP D2 MIL-STD-1835 D-2 Config. A 18-Lead (300-Mil) CerDIP D4 MIL-STD-1835 D-6 Config. A 1 Package Diagram 20-Lead (300-Mil) CerDIP D6 MIL-STD-1835 D-8 Config. A 22–Lead (400–Mil) CerDIP D8
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16-Lead
300-Mil)
MIL-STD-1835
18-Lead
20-Lead
D22 PACKAGE DIAGRAM
40 PIN CERDIP
D2 Package diagram
D2 Package
MIL-STD
d 1835
D5011
cerdip
cerdip 16 lead
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ad7543kn
Abstract: AD7543JN
Text: Package/Price Information 12-Bit, Multiplying Iout, SERIAL Model Status Package Description Pin Count Temperature Range Price* 100-499 AD7543AQ PRODUCTION CERDIP GLASS SEAL 16 COMMERCIAL - AD7543BQ PRODUCTION CERDIP GLASS SEAL 16 COMMERCIAL - AD7543GBQ OBSOLETE
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12-Bit,
AD7543AQ
AD7543BQ
AD7543GBQ
AD7543GKN
AD7543GKR
AD7543GKR-REEL
AD7543GKR-REEL7
AD7543GTQ
AD7543GTQ/883B
ad7543kn
AD7543JN
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80041
Abstract: MIL-STD-1835 40 PIN CERDIP cerdip D16 PACKAGE DIAGRAM 80046 CERDIP 52 D2 Package diagram D22 PACKAGE DIAGRAM D50 transistor
Text: Package Diagram Ceramic Dual-In-Line Packages 16-Lead 300-Mil CerDIP D2 MIL-STD-1835 D-2 Config. A 51-80027 18-Lead (300-Mil) CerDIP D4 MIL-STD-1835 D-6 Config. A 51-80028 1 Package Diagram 20-Lead (300-Mil) CerDIP D6 MIL-STD-1835 D-8 Config. A 51-80029
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16-Lead
300-Mil)
MIL-STD-1835
18-Lead
20-Lead
22-Lead
80041
40 PIN CERDIP
cerdip
D16 PACKAGE DIAGRAM
80046
CERDIP 52
D2 Package diagram
D22 PACKAGE DIAGRAM
D50 transistor
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MIL-STD-1835
Abstract: sidebraze
Text: Package Diagrams Ceramic Dual-In-Line Packages 16-Lead 300-Mil CerDIP D2 MIL-STD-1835 D-2 Config. A 51-80027 18-Lead (300-Mil) CerDIP D4 MIL-STD-1835 D-6 Config. A 51-80028 1 Package Diagrams 20-Lead (300-Mil) CerDIP D6 MIL-STD-1835 D-8 Config. A 51-80029
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16-Lead
300-Mil)
MIL-STD-1835
18-Lead
20-Lead
22-Lead
sidebraze
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SOT-74
Abstract: SOT74
Text: Philips Semiconductors Package outlines SOT74 16-lead dual in-line; ceramic cerdip Dimensions in mm. August 1994 1
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16-lead
SOT-74
SOT74
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FPT-16C-C01
Abstract: No abstract text available
Text: SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN CERAMIC FPT-16C-C01 16-pin ceramic SOP Lead pitch 50 mil Lead shape Straight Sealing method Cerdip FPT-16C-C01 16-pin ceramic SOP (FPT-16C-C01) +0.51 9.53 –0.13 0.125±0.025 (.005±.005) +.020
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FPT-16C-C01
16-pin
FPT-16C-C01)
F16006SC-4-2
FPT-16C-C01
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Q-16
Abstract: No abstract text available
Text: a 16-Lead Ceramic Dip-Glass Hermetic Seal Package [CERDIP] Q-16 Dimensions shown in inches and (millimeters) 0.005 (0.13) MIN 0.098 (2.49) MAX 16 9 0.310 (7.87) 0.220 (5.59) PIN 1 1 0.200 (5.08) MAX 8 0.840 (21.34) MAX 0.060 (1.52) 0.015 (0.38) 0.320 (8.13)
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16-Lead
Q-16
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780102
Abstract: FPT-16C-C01 16PIN
Text: SMALL OUTLINE PACKAGE 16 PIN CERAMIC FPT-16C-C01 16-pin ceramic SOP Lead pitch 50mil Lead shape Straight Sealing method Cerdip FPT-16C-C01 16-pin ceramic SOP (FPT-16C-C01) +0.51 9.53 –0.13 +.020 .375 –.005 0.125±0.025 (.005±.005) 0.58(.023)MAX 7.80±1.02
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FPT-16C-C01
50mil
16-pin
FPT-16C-C01)
F16006SC-4-2
780102
FPT-16C-C01
16PIN
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209MIL
Abstract: No abstract text available
Text: SMALL OUTLINE PACKAGE 16 PIN CERAMIC FPT-16C-C02 16-pin ceramic SOP Lead pitch 50mil Row spacing 209mil Lead shape Gullwing Sealing method Cerdip FPT-16C-C02 16-pin ceramic SOP (FPT-16C-C02) 0.43±0.05 (.0170±.002) 2.41(.095) MAX 0.05(.002) MIN 0.76(.030)
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FPT-16C-C02
50mil
209mil
16-pin
FPT-16C-C02)
F16016SC-1-2
209MIL
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Untitled
Abstract: No abstract text available
Text: SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN CERAMIC To Top / Package Lineup / Package Index FPT-16C-C02 16-pin ceramic SOP Lead pitch 50 mil Row spacing 209 mil Lead shape Gullwing Sealing method Cerdip FPT-16C-C02 16-pin ceramic SOP (FPT-16C-C02)
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FPT-16C-C02
16-pin
FPT-16C-C02)
F16016SC-1-2
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7705201EX
Abstract: adg509akn
Text: Package/Price Information 8-Channel Analog Multiplexer Superior DG508A Replacement Status Package Description 77052012X PRODUCTION CER. LEADLESS CHIP CARRIER 20 MILITARY $21.16 7705201EX PRODUCTION CERDIP GLASS SEAL 16 MILITARY $13.07 ADG508ABCHIPS PRODUCTION
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DG508A
77052012X
7705201EX
ADG508ABCHIPS
ADG508ABQ
ADG508AKN
ADG508AKN/+
ADG508AKP
ADG508AKP-REEL
ADG508AKR
adg509akn
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50 mil pitch ceramic package
Abstract: FPT-16C-C01 78002
Text: SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN CERAMIC To Top / Package Lineup / Package Index FPT-16C-C01 16-pin ceramic SOP Lead pitch 50 mil Lead shape Straight Sealing method Cerdip FPT-16C-C01 16-pin ceramic SOP (FPT-16C-C01) +0.51 9.53 –0.13
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FPT-16C-C01
16-pin
FPT-16C-C01)
F16006SC-4-2
50 mil pitch ceramic package
FPT-16C-C01
78002
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Q-16
Abstract: No abstract text available
Text: a 16-Lead Ceramic Dual In-Line Package [CERDIP] Q-16 Dimensions shown in inches and (millimeters) 0.005 (0.13) MIN 0.098 (2.49) MAX 16 9 0.310 (7.87) 0.220 (5.59) PIN 1 1 0.200 (5.08) MAX 8 0.840 (21.34) MAX 0.060 (1.52) 0.015 (0.38) 0.320 (8.13) 0.290 (7.37)
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16-Lead
Q-16
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Untitled
Abstract: No abstract text available
Text: SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN CERAMIC FPT-16C-C02 16-pin ceramic SOP Lead pitch 50 mil Row spacing 209 mil Lead shape Gullwing Sealing method Cerdip FPT-16C-C02 16-pin ceramic SOP (FPT-16C-C02) 0.43±0.05 (.0170±.002) 2.41(.095)
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FPT-16C-C02
16-pin
FPT-16C-C02)
F16016SC-1-2
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Untitled
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN CERAMIC To Top / Package Lineup / Package Index DIP-16C-C01 EIAJ code :∗DIP016-G-0300-2 16-pin ceramic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Cerdip DIP-16C-C01 16-pin ceramic DIP
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DIP-16C-C01
DIP016-G-0300-2
16-pin
DIP-16C-C01)
D16011SC-2-3
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Untitled
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN CERAMIC To Top / Package Lineup / Package Index DIP-16C-C02 EIAJ code :∗DIP016-G-0300-3 16-pin ceramic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Cerdip DIP-16C-C02 16-pin ceramic DIP
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DIP-16C-C02
DIP016-G-0300-3
16-pin
DIP-16C-C02)
D16012SC-3-3
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Untitled
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE 16 PIN CERAMIC DIP-16C-C01 EIAJ code : ∗DIP016-G-0300-2 Lead pitch 100mil Row spacing 300mil Sealing method Cerdip 16-pin ceramic DIP DIP-16C-C01 16-pin ceramic DIP (DIP-16C-C01) +0.71 19.30 –0.15 .760 +.028 –.006 R0.64(.025) REF
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DIP-16C-C01
DIP016-G-0300-2
100mil
300mil
16-pin
DIP-16C-C01)
D16011SC-2-3
Dimensi16
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Untitled
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE 16 PIN CERAMIC DIP-16C-C04 EIAJ code : ∗DIP016-G-0300-5 Lead pitch 100mil Row spacing 300mil Sealing method Cerdip 16-pin ceramic DIP DIP-16C-C04 16-pin ceramic DIP (DIP-16C-C04) +0.71 19.30 –0.15 +.028 .760 –.006 R0.64(.025) REF
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DIP-16C-C04
DIP016-G-0300-5
100mil
300mil
16-pin
DIP-16C-C04)
D16032SC-4-3
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16-Pin Ceramic DIP
Abstract: DIP-16C-C01 d16011
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN CERAMIC DIP-16C-C01 EIAJ code :∗DIP016-G-0300-2 16-pin ceramic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Cerdip DIP-16C-C01 16-pin ceramic DIP (DIP-16C-C01) +0.71 19.30 –0.15
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DIP-16C-C01
DIP016-G-0300-2
16-pin
DIP-16C-C01)
D16011SC-2-3
16-Pin Ceramic DIP
DIP-16C-C01
d16011
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Untitled
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE 16 PIN CERAMIC DIP-16C-C02 EIAJ code : ∗DIP016-G-0300-3 Lead pitch 100mil Row spacing 300mil Sealing method Cerdip 16-pin ceramic DIP DIP-16C-C02 16-pin ceramic DIP (DIP-16C-C02) +0.71 19.30 –0.15 .760 +.028 –.006 R0.64(.025) REF
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DIP-16C-C02
DIP016-G-0300-3
100mil
300mil
16-pin
DIP-16C-C02)
D16012SC-3-3
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508 DIP 16
Abstract: 16-Pin Ceramic DIP
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN CERAMIC DIP-16C-C02 EIAJ code :∗DIP016-G-0300-3 16-pin ceramic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Cerdip DIP-16C-C02 16-pin ceramic DIP (DIP-16C-C02) +0.71 19.30 –0.15
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DIP-16C-C02
DIP016-G-0300-3
16-pin
DIP-16C-C02)
D16012SC-3-3
508 DIP 16
16-Pin Ceramic DIP
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Untitled
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN CERAMIC To Top / Package Lineup / Package Index DIP-16C-C04 EIAJ code :∗DIP016-G-0300-5 16-pin ceramic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Cerdip DIP-16C-C04 16-pin ceramic DIP
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DIP-16C-C04
DIP016-G-0300-5
16-pin
DIP-16C-C04)
D16032SC-4-3
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ADG506A DIE
Abstract: ADG526ATE/plji
Text: Package/Price Information Latchable 16-Channel Multiplexer Latched ADG506A Status Package Description 5962-89710013X PRODUCTION CER. LEADLESS CHIP CARRIER 28 MILITARY $54.75 5962-8971001XX PRODUCTION CERDIP GLASS SEAL 28 MILITARY $30.01 ADG526ABCHIPS PRODUCTION
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16-Channel
ADG506A)
5962-89710013X
5962-8971001XX
ADG526ABCHIPS
ADG526ABQ
ADG526AKN
ADG526AKP
ADG526AKP-REEL
ADG526AKR
ADG506A DIE
ADG526ATE/plji
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HCT137
Abstract: No abstract text available
Text: ^Supertex inc. HCT137 HCT237 Octal D ecoders/D em ultiplexers Ordering Information Package 16-pin plastic DIP 16-pin CERDIP 16-pin ceram ic side-brazed DIP 20-pin ceram ic leadless chip carrier Outputs Com m ercial 74HCT Inverted 74H CT137P Non-lnverted 74H CT237P
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OCR Scan
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PDF
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HCT137
HCT237
16-pin
74HCT
CT137P
CT237P
20-pin
CT137D
RB54HCT137D
HCT137
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