CHIP FUSE 3A Search Results

Contextual Info: Thin Film Chip Fuse 1. Scope This specification applies for the thin film chip fuse 2. Construction Over Coat Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating 3. Type Designation MF 06 050 T 32V 2 Chip Fuse Size 0603 Rated Current 050: 0.5A

CQ06PF

Contextual Info: P TYPE CHIP FUSE Type CQ06PF 1.55mmx 0.8mm 0603 Fast-Acting Fuse Series Patent Feature Material Construction Body Material: FR4 Board Termination Material: Copper(Cu),Tin(Sn) Fuse Element: Copper(Cu),Tin(Sn) a. Chip Fuse structure design with PCB body and copper &

Contextual Info: P TYPE CHIP FUSE Type CQ06PT 1.55mmx 0.8mm 0603 High Inrush Fuse Series Patent Feature Material Construction Body Material: FR4 Board Termination Material: Copper(Cu),Tin(Sn) Fuse Element: Copper(Cu),Tin(Sn) a. Chip Fuse structure design with PCB body and copper &

CQ06PT

Abstract: CQ06PT004
Contextual Info: P TYPE CHIP FUSE Type CQ06PT 1.55mmx 0.8mm 0603 Slow Blow Fuse Series Patent Feature Material Construction Body Material: FR4 Board Termination Material: Copper(Cu),Tin(Sn) Fuse Element: Copper(Cu),Tin(Sn) a. Chip Fuse structure design with PCB body and copper &

Contextual Info: P TYPE CHIP FUSE Type CQ06PF 1.55mmx 0.8mm 0603 Fast-Acting Fuse Series Patent Feature Material Construction Body Material: FR4 Board Termination Material: Copper(Cu),Tin(Sn) Fuse Element: Copper(Cu),Tin(Sn) a. Chip Fuse structure design with PCB body and copper &

smd fuse marking code 20

Contextual Info: Document No TCP-XXOS006H Issued date 2011/04/22 Page 1/17 Thin Film Chip Fuse 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

smd fuse marking code J

Abstract: 25 smd fuse marking code smd fuse marking code K smd fuse marking code 4 Fuse 1206 1A CFS12V6T1R25 CFS12V3T2R50 smd fuse marking code T 1206 FUSE marking 20
Contextual Info: Thin Film Chip Fuse Document No TCFS-XXOS004H Issued date 2011/03/01 Page 1/20 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

Contextual Info: Thin Film Chip Fuse Document No TCFS-XX0S004I Issued date 2012/11/26 Page 1/20 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

smd fuse marking 20

Abstract: fuse smd code N smd fuse marking code K fuse smd code k k smd fuse marking code fuse smd code P smd fuse marking code 15 smd fuse marking code T fuse smd code D fuse smd code c
Contextual Info: Document No TCF-04OS029E Issued date 2009/5/27 Page 1/15 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

CF06V2T2R50

Abstract: CF06V fuse i2t CF06V3T1R25 fuse smd code c fuse smd code N CF06V3T1R0 Chip Fuse smd marking code 45 Smd fuse marking 45 CF06V3TR63
Contextual Info: Document No TCF-06OS030E Issued date 2009/5/27 Page 1/15 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

1 smd fuse marking code 32

Abstract: cfs12V CFS12V3T7R0 smd fuse marking 20 smd fuse marking code 20 CFS12V3T2R50 k smd fuse marking code fuse smd code N smd fuse marking code smd fuse marking code T
Contextual Info: Lead Free Thin Film Chip Fuse Document No TCFS-12OS051E Issued date 2009/5/27 Page 1/15 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate

fuse smd code N

Abstract: smd fuse marking code T smd fuse marking 1 smd fuse marking code n smd fuse marking code K fuse smd code S FUSE SMD k smd fuse marking code CFS04V3T2R0 fuse smd code p
Contextual Info: Document No TCFS-04OS049E Lead Free Thin Film Chip Fuse 1. Issued date 2009/5/27 Page 1/15 Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate

Contextual Info: P TYPE CHIP FUSE Type CQ12PT 3.1mmx 1.6mm 1206 Slow Blow Fuse Series Patent Feature Material a. Chip Fuse structure design with PCB body and copper & tin alloy element b. Use optical lithography & etching skill to make refinement element c. Complete on element with the terminal electrode plating

AT350V

Abstract: MIL-STD-202G CQ24PF
Contextual Info: P TYPE CHIP FUSE Type CQ24PF 6.1mmx 2.6mm 2410 Fast-Acting Fuse Series Patent Feature Material a. Chip Fuse structure design with PCB body and copper & tin alloy element b. Use optical lithography & etching skill to make refinement element c. Complete on element with the terminal electrode plating

Contextual Info: P TYPE CHIP FUSE Type CQ12PF 3.1mmx 1.6mm 1206 Fast-Acting Fuse Series Patent Feature Material a. Chip Fuse structure design with PCB body and copper & tin alloy element b. Use optical lithography & etching skill to make refinement element c. Complete on element with the terminal electrode plating

1R50

Contextual Info: Surface Mount Typed Fuse Circuit Protector Micro Chip Fuse Industry/Field: AV, OA / Information, Mobile communication, Amusement New entry, Business magnification Small surface typed fuse with sharp fusing characteristics • Development Target: Small surface typed safety device for information

FERRITE TRANSFORMER 20khz toroid

Abstract: ctx 300v buss fusetron mdl EI transformer core power ratings X1 CTX 0402ESDA-MLP 0603ESDA-MLP7 datasheets FERRITE TRANSFORMER 20khz toroid 0603FA 0603ESDA-TR1
Contextual Info: Power Stor www.cooperbussmann.com ® OvercurrentProt The Bussmann® Electronic Fuse family offers fail-safe circuit protection devices in SMD, Thru-Hole, and traditional Ferrule Fuse packages. BUSSMANN CHIP Fuses 0603FA & 3216FF Series Bussmann's patented Solid Matrix CHIP™ fuses provide

BUSS SR-5 T3.15A 250V

Abstract: Buss SR-5 T2A 250v OC-106 94V0 C T2A 250v BUSS SS-5 OC106 BUSS SR-5 T1.25A 250V T4A 250V buss ss-5 oc103 94vo c T2A 250v BUSS T2A 250v SS-5
Contextual Info: CIRCUIT PROTECTION Circuit Protection G r o u The Cooper Bussmann Electronic Fuse family offers fail-safe circuit protection devices in SMD, Thru-Hole, and traditional Ferrule Fuse p RoHS 2002/95/EC packages. CHIP Fuses 0603FA & 3216FF Series Cooper Bussmann's patented Solid Matrix CHIP™ fuses

smd fuse IEC60127

Abstract: Edison Fuse chip fuse 3A smd fuses GE SMD FUSE 52887 IEC60127-4 delay Fuses fuse L G FUSE SMD 0603
Contextual Info: VISHAY BEYSCHLAG Resistive Products Tech Note TN0028 Chip Fuse Developments for Secondary Circuit Protection Surface-mount fuse links enable designers to implement circuit protection measures now obligatory in many electronic products. Next-generation fuses are combining

2T transistor surface mount

Abstract: diode Marking code A2 thermal fuse Littelfuse THERMAL Fuse 5a 2t transistor MIL-STD-202f K V 63 Marking 8A marking code 8A marking code diode 14
Contextual Info: Next Previous Surface Mount Fuses Thin-Film Surface Mount SlimLine 1206 Very Fast-Acting Fuse 433 Series • The SlimLine 1206 fuse is an extremely small, low profile design 1206 chip size utilizing thin-film technology to achieve precise control of

marking H

Contextual Info: CERAMIC CHIP FUSE Type CQ12LT 3.1mmx 1.6mm 1206 Slow Blow Fuse Series Patent Feature Material a. High voltage and high current rating b. High inrush and high breaking capacity c. Fast arcing extinguished d. Lead free & Halogen free material e. Good explosion proof

Contextual Info: CERAMIC CHIP FUSE Type CQ06LT 1.6mmx 0.8mm 0603 Slow Blow Fuse Series Patent Feature Material a. High voltage and high current rating b. High inrush and high breaking capacity c. Fast arcing extinguished d. Lead free & Halogen free material e. Good explosion proof

Contextual Info: CERAMIC CHIP FUSE Type CQ06LF 1.6mmx 0.8mm 0603 Fast-Acting Fuse Series Patent Feature Material a. High voltage and high current rating b. High inrush and high breaking capacity c. Fast arcing extinguished d. Lead free & Halogen free material e. Good explosion proof

IEC 60127-1

Abstract: 1206F SMD code mfu 1 smd fuse marking code cv SMD fuse x 153 MFU0402 MFU04
Contextual Info: MFU Series - Thin Film Fuse Vishay Beyschlag Thin Film Flat Chip Fuses FEATURES • Advanced thin film technology • Very quick acting fuse characteristics • Outstanding stability of fusing characteristics • Standard metric SMD sizes • Green product, supports lead Pb -free soldering