CI 6116 Search Results

1J24

Abstract: teledyne 333
Contextual Info: TELEDYNE COMPONENTS SÔE D • _ û ci l 7 t . a E 0üQb331 4 CDG5341 SEMICONDUCTOR DUAL MONOLITHIC SPST CMOS/D-MOS T-CONFIGURATION ANALOG SWITCH ORDERING INFORMATION Ouat SPST T Switch, Logic ‘O’ OFF, Breâk-before-make Commercial Temp. Range Industrial Temp. Range

MS-009-AR

Contextual Info: PACKAGE DIAGRAM OUTLINES LEADLESS CHIP CARRIER Ccm t i n u e d DCN 1T289 REV DESCRIPTION 05 UPDATE TO S T A N D A R D I Z E DATE APPROVAL DRAWING A1 U NL E S 2. OTHERWI SE SPECIFIED, BSC - BASI C LEAD S PA CI NG BETWEEN CENTERS. DWG # SYMBOL A .055 .120

611-2 teledyne relays

Abstract: 611-7 teledyne relay 611-4H teledyne 611-5 611-8H k 6115
Contextual Info: TELEDYNE SOLID SSE STATE jD • ITSS 6 ci l 7 b t i cl QQOObMb 4 b l ~ - 2 < 5 V / TELEDYNE SOLID STATE SOLID STATE AC RELAY OPTICALLY ISOLATED 10 THRU 40 A rms DC INPUT CONTROL s an FEATURES E L E C T R IC A L S P E C IF IC A T IO N S • 10, 15, 25, and 40 A ratings

SmD 7z

Abstract: 500kHz-50mT TDK AL-value ferrite
Contextual Info: TDK Ferrite Cores SMD CORES if*# •o - < EJ Fig. 1 Part No. Fig. PC40EE5-Z mm Dimensions in inches A 2B Ci 1 5.25 + 0.05 .2 0 7 + .002 5 .3 ± 0 .1 .2 0 9 + .004 P C 4 0 E E 1 2 /5 /6 -Z 1 1 2 .0 ± 0 .1 5 .472 ± .0 0 6 P C 40E R 9.5/5-Z P C 50E R 9.5/5-Z

16DO

Contextual Info: PACKAGE DIAGRAM OUTLINES FL.-.TPACK R EV DCN DESCRIPTION DATE 00 20433 ORI GI NAL ISSÜE 05/06/91 APPROVED E3 T E2 1 E3 1. 2. 3. u m t t w v D L SPECI FIED A LL DI MENSI ONS ARE IN INCHES. BSC - BASI C LEAD S P A CI NG BETWEEN CENTERS. S Y M B O L ”N ” R E P R E S E N T S THE NOMBER OR LEADS.

CMS TRANSIL

Abstract: 1N6102 1N6137 1N6103 1N6104 1N6105 1N6106 1N6107 1N6109 GT61
Contextual Info: S G S’-THOMSON S T C 59C ^ T H O M S O N ’C S F 0 2 6 30 d | ? cJ 5 ci a 3 7 07^ / / ' ¿ 3 G T 6102, A — DIVISION SEMICONDUCTEURS GGüat,30 1 N 6102, A ► — G T ► I N 6137,A 6137,A UNI - AND B ID IR EC TIO N A L T R A N S IE N T V O LTA G E S U P P R E S S O R S

transistor bl p89

Abstract: bl p74 transistor J955 XC4000 XC4000A XC4000D XC4000E XC4000EX XC4000H p180 g8
Contextual Info: book XC4000E and XC4000X Series Field Programmable Gate Arrays R January 29, 1999 Version 1.5 6* XC4000E and XC4000X Series Features Note: XC4000 Series devices described in this data sheet include the XC4000E family and XC4000X Series. XC4000X Series devices described in this data sheet

teletext

Abstract: 5246A 8049 microcontroller APPLICATION SAA5191 2222 philips 8049 intel microprocessor pin diagram 8049 microcontroller SAA5243 SAA5250 SAA5296
Contextual Info: Philips Semiconductors Video Products Interface information Packet and Page Teletext data reception using the SAA5250 Authors: J.R. Kinghorn A. Guenot Philips Product Concept & Applications Lab, Southampton England Philips Semiconductors, Paris France Revised:

5246A

Abstract: SAA5296 SAA5191 SAA5231 SAA5243 SAA5250 SAA9042 decoder 6116 8049 microcontroller APPLICATION 6805 motorola
Contextual Info: Philips Semiconductors Interface information Packet and Page Teletext data reception using the SAA5250 Authors: J.R. Kinghorn A. Guenot Philips Product Concept & Applications Lab, Southampton England Philips Semiconductors, Paris France Revised: M. T. Schneider

17556

Contextual Info: PACKAGE DIAGRAM [TLINES SIDEBRAZE DCN REV DATE _ DESCRIPTION_ 04 17553 05 22249 U PD ATE D TO S T A N D A R DI Z E CHANGED b1 MIN DWG ¿ S'ho^rnaA, 4/2/90 DIMENSION EATING PLANE b1 -12 APPROVED L1 NOTES: ( U NL E S S OTHERWI SE SPECI FI ED)

SERVICE MANUAL OF FLUKE 175

Abstract: SHARP IC 701 I X11 dot led display large size with circuit diagram IR power mosfet switching power supply The 555 Timer Applications Sourcebook interfacing cpld xc9572 with keyboard distributed control system of power plant 100352 XC3090-100PG175 xc95144 pinout
Contextual Info: R , XILINX, XACT, XC2064, XC3090, XC4005, XC-DS501, FPGA Architect, FPGA Foundry, NeoCAD, NeoCAD EPIC, NeoCAD PRISM, NeoROUTE, Plus Logic, Plustran, P+, Timing Wizard, and TRACE are registered trademarks of Xilinx, Inc. , all XC-prefix product designations, XACTstep, XACTstep Advanced, XACTstep Foundry, XACT-Floorplanner,

chip diagram of ram chip 6116

Abstract: ci 6116 RAM 6116
Contextual Info: SGS-THOMSON KLH Tr[^© iìOa©S M K 6116 MK6116, MKI6116, MK6116L, MKI6116L (N/S - 15/20/25 2 K X 8 CMOS STATIC RAM • BYTEWYDE 2K x 8 CMOS STATIC RAM. .« lili ■ +5 VOLT ONLY WRITE/READ. ■ HIGH PERFORMANCE WITH LOW CMOS STANDBY POWER. PIN NAMES

RAM MK6116

Abstract: MK6116-15 6116 ram 2k MK6116-25 DIP-24 MK6116 FZJ 105
Contextual Info: SGS-THOMSON M K 6116 M MK6116, MKI6116, MK6116L, MKI6116L N/S - 15/20/25 2 K X 8 C M O S STATIC RAM i BYTEWYDE 2K x 8 CM OS STATIC RAM. £.j U i +5 VOLT ONLY WRITE/READ. i 24-PIN 600 MIL PLASTIC DIP, JEDEC PINOUT 28-PIN 330 MIL SOIC. i EQUAL W RITE AND READ CYCLE TIMES.

TMS320C6X

Abstract: SPRT125 SPRU189 SPRU190 TMS320 TMS320C6201 6116 memory TMS320C62xx mobile repair tutorial spru198b
Contextual Info: TMS320C62x/C67x Programmer’s Guide 1998 Digital Signal Processing Solutions Printed in U.S.A., February 1998 SDS SPRU198B 1998 TMS320C62x/C67x TMS320C62x/C67x Programmer’s Guide Literature Number: SPRU198B February 1998 Printed on Recycled Paper IMPORTANT NOTICE

17556

Abstract: C221
Contextual Info: PACKAGE DIAGRAM OUTLINES SIDEBRAZE C ontm iied REV DCN 05 1 75 56 06 19088 07 >46 £ _DESCRIPTION_ U PD ATE D TO S T A N D A R D I Z E REVI SED CHANGED b1 b1 DATE 4/2/9O DWG DIMENSION APPROVED ^TkeymaA . 0 9, MIN DIMENSION S2 SEATING PLANE

Contextual Info: PACKAGE DIAGRAM O U T L IN E S SIBEBRAZEB C o n t i n u e c l REV 01 DCN DESCRIPTION I7567 U PD ATE D >3 5 DATE TO S T A N D A R D I Z E CHANGED DWG 3/90 APPROVED 2) '•& IN DIMENSION b1 S1 b1 SEATING ELANE Jo U L1 E1 1. 2. 3. OTHERWI SE SPECI EI ED) A LL DI MENSI ONS ARE IN INCHES.

Contextual Info: PACKAGE DIAGRAM OUTLIN ES CERDIP C o n tin u e d R EV DON 06 175 17 _DESCRIPTION_ U P D A TE D TO S T A N D A R D I Z E DATE APPROVED DWG e " ü cz? cz? mp czp ü ü ü Ü Ü Ü cz? S1 ill A -SEATING P L A N E NOTES: ( U N L E S S OTHERWISE SPECI FI ED)

C-481

Contextual Info: PACKAGE DIAGRAM OUTLINES SIDEBRAZE Continued REV DCN 06 17561 U PD A TE D 07 19501 CORRE CT ED 08 20103 09 2 22 41 DESCRIPTION DATE TO S T A N D A R D I Z E PKG WIDTH DWG 07/20/90 /MBOL 90 TYPO CHA NGED b1 MIN APPROVED /91 it)uÀ lK oym oÀ £ ib u jlK a m \& £

Contextual Info: PACKAGE DIAGRAM OUTLINES SIDEBRAZE C o n t i n u e d REV DCN 03 17557 04 19789 05 22245 d _ DESCRIPTION_ U PD AT E D TO S T A N D A R D I Z E D E CR E A SE D CHANGED b1 Q MAX MIN DATE DWG APPROVED Thomas 4/2/90 S £ 1/30/91 DIM. £uximj

L441

Abstract: B1022 MS-004-CD 5851
Contextual Info: PACKAGE DIAGRAM OUTLINES LEADLESS CHIP CARRIER C o n tin u ed DCN DESCRIPTION REV 05 UPDATE TO S T A N D A R D I Z E 1 97 90 06 ADDED 1096V 07 C O R R E C T CORNER NOTES: ( ONL ES OTHERWI SE 1. A LL DI MENSI ONS A RE 2. BSC - BASI C LEAD BETWEEN CENTERS.

R3000

Contextual Info: PACKAGE DIAGRAM OUTLINES PIN GRID ARRAY Continued R EV 00 DCN DESCRIPTION 19574 ORI GI NAL I SSUE Ü0944 UPDATE DATE TO C U R R E N T V EN D O R DWG BOTTOM VIEW 2 3 4 5/6 APPROVAL 19/90 31 /91 £ SLu TOP VIEW 7 ^ 9 101112131415 ©®@©©@©®©©©®|A

VP2410

Abstract: vP2410B
Contextual Info: SILICONIX INC 1ÔE D 0254735 0014127 1 CY'Siliconix VP2410 SE R IE S JLJm in c o rp o ra te d P-Channel Enhancem ent-M ode M O S Transistors PRODUCT SUMMARY PART NUMBER TO-92 V BR DSS fDS(ON) (Í1 ) (V) Id (A) PAC KA G E VP2410L -2 4 0 10 -0.18 TO-92 VP241QB

6116353-5

Contextual Info: 6 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - 5 4 3 2 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. LOC REVISIONS D IS T AA 00 ALL RIGHTS RESERVED. LTR DATE DESCRIPTION C 2 0D E C 2006 ECO—06—029561 C1 REVISED PER E C O - 1 0 - 0 0 0 4 4 4 APVD

IC SD 6109

Contextual Info: MITSUBISHI LSlS M5M467160/465160AJ,TP-5,-6,-5S,-6S FAST PAGE MODE 67108864-BIT 4194304-WQRD BY 16-BIT DYNAMIC RAM DESCRIPTION This is a family of 4194304-word by 16-bit dynamic RAMs, fabricated with the high Derformance CMOS process,and is ideal for large-capacity memory systems where high speed, low power