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    CMLD2838 Search Results

    CMLD2838 Datasheets (3)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    CMLD2838 Central Semiconductor SURFACE MOUNT PICOmini DUAL PAIR, SILICON SWITCHING DIODES Original PDF
    CMLD2838 BK Central Semiconductor DIODE Original PDF
    CMLD2838 TR Central Semiconductor DIODE Original PDF

    CMLD2838 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    CMLD2838

    Abstract: No abstract text available
    Text: CMLD2838 SURFACE MOUNT DUAL PAIR, SILICON SWITCHING DIODES w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CMLD2838 type is a dual pair of common cathode silicon switching diodes manufactured by the epitaxial planar process and packaged in an epoxy molded PICOmini surface


    Original
    PDF CMLD2838 CMLD2838 OT-563 100mA 18-January

    Untitled

    Abstract: No abstract text available
    Text: CMLD2838 SURFACE MOUNT DUAL PAIR, SILICON SWITCHING DIODES w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CMLD2838 type is a dual pair of common cathode silicon switching diodes manufactured by the epitaxial planar process and packaged in an epoxy molded PICOmini surface


    Original
    PDF CMLD2838 CMLD2838 OT-563 100mA 18-January

    CMLD2838

    Abstract: No abstract text available
    Text: Central CMLD2838 TM Semiconductor Corp. SURFACE MOUNT PICOmini DUAL PAIR, SILICON SWITCHING DIODES DESCRIPTION: The CENTRAL SEMICONDUCTOR CMLD2838 type is a dual pair of common cathode silicon switching diodes manufactured by the epitaxial planar process and packaged in an epoxy


    Original
    PDF CMLD2838 OT-563 100mA 22-March CMLD2838

    Untitled

    Abstract: No abstract text available
    Text: CMLD2838 SURFACE MOUNT SILICON DUAL PAIR SWITCHING DIODE w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CMLD2838 type is a dual pair of common cathode silicon switching diodes manufactured by the epitaxial planar process and packaged in an epoxy molded SOT-563 surface mount


    Original
    PDF CMLD2838 CMLD2838 OT-563 100mA

    CMLD2838

    Abstract: No abstract text available
    Text: PROCESS CPD30V Central Dual Switching Diode TM Semiconductor Corp. Dual, Common Cathode, High Speed Switching Diode Chip PROCESS DETAILS Die Size 15.4 X 15.4 MILS Die Thickness 7.1 MILS Anode 1 Bonding Pad Area 5.9 X 5.9 X 8.3 MILS Anode 2 Bonding Pad Area


    Original
    PDF CPD30V CMLD2838 28-September CMLD2838

    3SMC30A

    Abstract: CMPZ4614 P6SMB56CA CMSD4448 sod-80 stabistor 882L CMOZ20V STB-400 3smc60ca CMZ5945B
    Text: Diodes Surface Mount Packages Actual Size SOD-923 SOT-923 SOT-953 SOD-523 SOT-523 SOT-563 SOD-323 SOT-323 SOT-363 SOD-123 SOD-123F SOT-23 SOT-23F SOT-143 SOT-26 SOT-28 SOT-89 SOT-223 SOT-228 SMA SMB SMC SOIC-16 HD DIP TLP Tiny Leadless Package Bottom View


    Original
    PDF OD-923 OT-923 OT-953 OD-523 OT-523 OT-563 OD-323 OT-323 OT-363 OD-123 3SMC30A CMPZ4614 P6SMB56CA CMSD4448 sod-80 stabistor 882L CMOZ20V STB-400 3smc60ca CMZ5945B

    BF244 datasheet

    Abstract: 2N5133 equivalent MPS5771 BD345 BD347 BF244 2n5248 bf256 2N3304 2n5910
    Text: Index Industry Part Number Central Process No. Page # Industry Part Number 1N456 .CPD64 . 216 1N456A.CPD64 . 216 1N457 .CPD64 . 216


    Original
    PDF 1N456 CPD64 1N456A. 1N457 1N457A. 1N458 BF244 datasheet 2N5133 equivalent MPS5771 BD345 BD347 BF244 2n5248 bf256 2N3304 2n5910

    UJT 2n3904

    Abstract: transistor 2N4033 ujt 2N6027 2n4209 datasheet mj15003 equivalent transistor 2N5401 mj15004 2N4393 MJ15003 MJ15004 BAV45
    Text: Selection Guide Page Small Signal Transistors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Bipolar Power Transistors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Programmable UJT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24


    Original
    PDF

    Untitled

    Abstract: No abstract text available
    Text: PROCESS CPD30V Dual Switching Diode Dual, Common Cathode, High Speed Switching Diode Chip PROCESS DETAILS Die Size 15.4 x 15.4 MILS Die Thickness 7.1 MILS Anode 1 Bonding Pad Area 5.9 x 5.9 x 8.3 MILS Anode 2 Bonding Pad Area 5.9 x 5.9 x 8.3 MILS Top Side Metalization


    Original
    PDF CPD30V CMLD2838 29-April