CMLD2838
Abstract: No abstract text available
Text: CMLD2838 SURFACE MOUNT DUAL PAIR, SILICON SWITCHING DIODES w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CMLD2838 type is a dual pair of common cathode silicon switching diodes manufactured by the epitaxial planar process and packaged in an epoxy molded PICOmini surface
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CMLD2838
CMLD2838
OT-563
100mA
18-January
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Untitled
Abstract: No abstract text available
Text: CMLD2838 SURFACE MOUNT DUAL PAIR, SILICON SWITCHING DIODES w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CMLD2838 type is a dual pair of common cathode silicon switching diodes manufactured by the epitaxial planar process and packaged in an epoxy molded PICOmini surface
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CMLD2838
CMLD2838
OT-563
100mA
18-January
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CMLD2838
Abstract: No abstract text available
Text: Central CMLD2838 TM Semiconductor Corp. SURFACE MOUNT PICOmini DUAL PAIR, SILICON SWITCHING DIODES DESCRIPTION: The CENTRAL SEMICONDUCTOR CMLD2838 type is a dual pair of common cathode silicon switching diodes manufactured by the epitaxial planar process and packaged in an epoxy
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CMLD2838
OT-563
100mA
22-March
CMLD2838
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Untitled
Abstract: No abstract text available
Text: CMLD2838 SURFACE MOUNT SILICON DUAL PAIR SWITCHING DIODE w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CMLD2838 type is a dual pair of common cathode silicon switching diodes manufactured by the epitaxial planar process and packaged in an epoxy molded SOT-563 surface mount
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CMLD2838
CMLD2838
OT-563
100mA
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CMLD2838
Abstract: No abstract text available
Text: PROCESS CPD30V Central Dual Switching Diode TM Semiconductor Corp. Dual, Common Cathode, High Speed Switching Diode Chip PROCESS DETAILS Die Size 15.4 X 15.4 MILS Die Thickness 7.1 MILS Anode 1 Bonding Pad Area 5.9 X 5.9 X 8.3 MILS Anode 2 Bonding Pad Area
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CPD30V
CMLD2838
28-September
CMLD2838
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3SMC30A
Abstract: CMPZ4614 P6SMB56CA CMSD4448 sod-80 stabistor 882L CMOZ20V STB-400 3smc60ca CMZ5945B
Text: Diodes Surface Mount Packages Actual Size SOD-923 SOT-923 SOT-953 SOD-523 SOT-523 SOT-563 SOD-323 SOT-323 SOT-363 SOD-123 SOD-123F SOT-23 SOT-23F SOT-143 SOT-26 SOT-28 SOT-89 SOT-223 SOT-228 SMA SMB SMC SOIC-16 HD DIP TLP Tiny Leadless Package Bottom View
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OD-923
OT-923
OT-953
OD-523
OT-523
OT-563
OD-323
OT-323
OT-363
OD-123
3SMC30A
CMPZ4614
P6SMB56CA
CMSD4448
sod-80 stabistor
882L
CMOZ20V
STB-400
3smc60ca
CMZ5945B
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BF244 datasheet
Abstract: 2N5133 equivalent MPS5771 BD345 BD347 BF244 2n5248 bf256 2N3304 2n5910
Text: Index Industry Part Number Central Process No. Page # Industry Part Number 1N456 .CPD64 . 216 1N456A.CPD64 . 216 1N457 .CPD64 . 216
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1N456
CPD64
1N456A.
1N457
1N457A.
1N458
BF244 datasheet
2N5133 equivalent
MPS5771
BD345
BD347
BF244
2n5248
bf256
2N3304
2n5910
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UJT 2n3904
Abstract: transistor 2N4033 ujt 2N6027 2n4209 datasheet mj15003 equivalent transistor 2N5401 mj15004 2N4393 MJ15003 MJ15004 BAV45
Text: Selection Guide Page Small Signal Transistors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Bipolar Power Transistors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Programmable UJT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
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Untitled
Abstract: No abstract text available
Text: PROCESS CPD30V Dual Switching Diode Dual, Common Cathode, High Speed Switching Diode Chip PROCESS DETAILS Die Size 15.4 x 15.4 MILS Die Thickness 7.1 MILS Anode 1 Bonding Pad Area 5.9 x 5.9 x 8.3 MILS Anode 2 Bonding Pad Area 5.9 x 5.9 x 8.3 MILS Top Side Metalization
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CPD30V
CMLD2838
29-April
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