COLD SOLDER JOINT Search Results

CP30338

Contextual Info: REV. A DESCRIPTION NEW DRAWING DATE 10/3/2007 100.0 5.0 30.0 0.3 7.0 3.0 Red + 30.0 0.3 Black (-) SCALE 1:1 0.80 (TYP) Cold Side 3.8 0.01 Hot Side Parameters Remarks 4.00 Ω ± 10% 3.0 A 15.4 V Th=50°C Th=27°C Qmax 27.0 W 30.1 W ΔTmax 66°C 72°C Solder melting point

CP85338

Contextual Info: REV. A DESCRIPTION NEW DRAWING DATE 10/3/2007 100.0 5.0 30.0 0.3 7.0 3.0 Red + 30.0 0.3 Black (-) SCALE 1:1 0.80 (TYP) Cold Side 3.8 0.01 Hot Side Parameters Remarks 0.9 Ω ± 10% 8.5 A 8.6 V Th=50°C Th=27°C Qmax 42.0 W 46.9 W ΔTmax 68°C 75°C Solder melting point

CP85438

Contextual Info: REV. A 40.0 0.3 DESCRIPTION NEW DRAWING DATE 10/3/2007 100.0 5.0 Red + 7.0 3.0 40.0 0.3 SCALE 1:1 Black (-) 0.80 (TYP) Cold Side 3.8 0.01 Parameters Remarks 1.5 Ω ± 10% 8.5 A 15.4 V Th=50°C Th=27°C 75.0 W 83.9 W Qmax 68°C 75°C ΔTmax 138°C Solder melting point

silicon sealer

Abstract: CP60333
Contextual Info: REV. A DESCRIPTION NEW DRAWING DATE 10/3/2007 100.0 5.0 30.0 0.3 7.0 3.0 Red + 30.0 0.3 Black (-) SCALE 1:1 0.80 (TYP) Cold Side 3.3 0.01 Hot Side Parameters Remarks 2.20 Ω ± 10% 6.0 A 15.4 V Th=50°C Th=27°C Qmax 50.5 W 56.5 W ΔTmax 66°C 72°C Solder melting point

CP40336

Contextual Info: REV. A DESCRIPTION NEW DRAWING DATE 10/3/2007 100.0 5.0 30.0 0.3 7.0 3.0 Red + 30.0 0.3 Black (-) SCALE 1:1 0.80 (TYP) Cold Side 3.6 0.01 Hot Side Parameters Remarks 3.5 Ω ± 10% 4.0 A 15.4 V Th=50°C Th=27°C Qmax 33.4 W 37.3 W ΔTmax 66°C 72°C Solder melting point

Contextual Info: REV. A DESCRIPTION NEW DRAWING DATE 10/3/2007 100.0 5.0 30.0 0.3 7.0 3.0 Red + 30.0 0.3 Black (-) SCALE 1:1 0.80 (TYP) Cold Side 5.1 0.01 Hot Side Parameters Remarks 6.7 Ω ± 10% 2.0 A 15.4 V Th=50°C Th=27°C Qmax 15.2 W 16.9 W ΔTmax 66°C 72°C Solder melting point

ul1332

Abstract: CP602 Peltier module
Contextual Info: REV. A DESCRIPTION NEW DRAWING DATE 10/3/2007 100.0 5.0 7.0 3.0 20.0 0.3 Red + 20.0 0.3 Black (-) SCALE 1:1 0.80 (TYP) Cold Side 4.0 0.01 Hot Side Parameters Remarks 0.53 Ω ± 10% 6.0 A 3.8 V Th=50°C Th=27°C Qmax 13.0 W 14.5 W ΔTmax 68°C 75°C Solder melting point

Contextual Info: REV. A 40.0 0.3 DESCRIPTION NEW DRAWING DATE 10/3/2007 100.0 5.0 Red + 7.0 3.0 40.0 0.3 SCALE 1:1 Black (-) 0.80 (TYP) Cold Side 4.0 0.01 Parameters Remarks 2.17 Ω ± 10% 6.0 A 15.4 V Th=50°C Th=27°C Qmax 53.0 W 59.3 W ΔTmax 68°C 75°C Solder melting point

Contextual Info: REV. A DESCRIPTION NEW DRAWING DATE 10/3/2007 100.0 5.0 30.0 0.3 7.0 3.0 Red + 30.0 0.3 Black (-) SCALE 1:1 0.80 (TYP) Cold Side 4.0 0.01 Hot Side Parameters Remarks 1.21 Ω ± 10% 6.0 A 8.6 V Th=50°C Th=27°C Qmax 29.0 W 32.4 W ΔTmax 68°C 75°C Solder melting point

Contextual Info: page 1/5 Surface Mount Terminal Blocks 120-M-221-THR | 5.00 mm 0.197 in Spacing - 2-24 poles PICTURES 120-M-221-THR 120-M-221-THR & 120-D-111 TECHNICAL INFORMATION Description Standoffs underneath the molding prevent bottom of molding from touching the solder paste and allow for a visual inspection of the solder joints and

peltier element schematic

Abstract: peltier cooler schematic peltier schematic pitarresi IC SEM 2005 smema A356 Theory of Modern Electronic Semiconductor Device
Contextual Info: Powercycling Reliability, Failure Analysis and Acceleration Factors of Pb-free Solder Joints Kaushik Setty1, Ganesh Subbarayan1 and Luu Nguyen2 School of Mechanical Engineering, Purdue University, W. Lafayette, IN 47907-2088 2 National Semiconductor Corporation, Santa Clara, CA 95051

Contextual Info: page 1/5 Surface Mount Terminal Blocks 971-SLR-THR-1.1 | 5.00 mm 0.197 in Spacing - 2-12 poles PICTURES 971-SLR-THR-1.1 TECHNICAL INFORMATION Description Standoffs underneath the molding prevent bottom of molding from touching the solder paste and allow for a visual inspection of the solder joints and

Contextual Info: page 1/5 Surface Mount Terminal Blocks 110-M-221-THR | 3.50 mm 0.138 in Spacing - 2-12 poles PICTURES 110-M-221-THR 110-M-221-THR & 110-A-111 TECHNICAL INFORMATION Description Standoffs underneath the molding prevent bottom of molding from touching the solder paste and allow for a visual inspection of the solder joints and

semikron skiip 30

Abstract: 30 kw motor miniskiip board semikron spring contact reliability
Contextual Info: MiniSKiiP Converter Inverter Brake CIB modules Technology ♦ Spring contacts for all power and auxiliary connections instead of soldered joints. ♦ Integration of latest chip technology: ♦ Low switching loss 1200 V and 600 V, homogeneous (NPT) IGBTs

Cold solder joint

Abstract: IPC-A-610C
Contextual Info:  Soldering Methods and Procedures for 1st and 2nd Generation Power Modules Overview This document is intended to provide guidance in utilizing soldering practices to make high quality connections of Vicor Power Modules to printed circuit boards. Some care

astm d 876

Abstract: ASTM D 638 pvdf clear heat shrink
Contextual Info: It reliably protects wires, solder joints, terminals, connections, and components from most industrial fuels, solvents and chemicals. AKY-175 Excellent to insulate from high temperatures. Semi rigid tubing, ideal for applications that require high-temperature

module vicor

Abstract: SAC305 V300
Contextual Info: 123333333333333333333333 Soldering Methods and Procedures for Vicor ROHS Compliant Power Modules Overview This document is intended to provide guidance for making high quality solder connections of RoHS Compliant Vicor Power Modules to printed circuit boards. This application note applies to lead free

IPC-A-610C

Abstract: VI-J00 Kit-18156 Kit-18146 SURFACE CLEANING SUPPLIES
Contextual Info: Design Guide & Applications Manual For VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies 23. Recommended Soldering Methods, Tin Lead Pins, and InMate Sockets OVERVIEW The following chapters contain soldering information for the following Vicor product families; Maxi, Mini, Micro;

pcb thermal Design guide pcb trace

Abstract: vicor module VI-J00 IPC-A-610C Bag-19133 Kit-18150
Contextual Info: Design Guide & Applications Manual For Maxi, Mini, Micro Family DC-DC Converters and Configurable Power Supplies 14. Recommended Soldering Methods, Tin Lead Pins, and InMate Sockets OVERVIEW The following chapters contain soldering information for the following Vicor product families; Maxi, Mini, Micro;

VE-200

Abstract: solder joint SAC305 Kit-18146
Contextual Info: 13. Recommended Soldering Methods, Lead Free Pins RoHS Design Guide & Applications Manual For Maxi, Mini, Micro Family DC-DC Converters and Configurable Power Supplies OVERVIEW The following chapters contain soldering information for the following Vicor product families; Maxi, Mini, Micro;

VE-200

Abstract: pcb thermal Design guide pcb trace SAC305 VI-J00 Kit-18151 Kit-18156 VE-J00
Contextual Info: 22. Recommended Soldering Methods, Lead Free Pins RoHS Design Guide & Applications Manual For VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies OVERVIEW The following chapters contain soldering information for the following Vicor product families; Maxi, Mini, Micro;

Contextual Info: . FEBRUARY 9,1998 TEST REPORT #98040 SMT SOLDER JOINT EVALUATION SAMTEC CORPOR?iTION APPROVED BY: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. Contech Research CERTIFICATION This is to certify that the evaluation described herein was

Cu3Sn

Abstract: HVQFN48 J-STD-020D SSOP20 Cu6Sn5 Solder Paste, Indium 5.1, Type 3 AN10365
Contextual Info: AN10365 Surface mount reflow soldering description Rev. 03 — 22 April 2008 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.

Lead Free reflow soldering profile BGA

Abstract: AN10365 HVQFN48 SSOP20 Solder Paste, Indium, Type 3 Cu3Sn philips pb-free products
Contextual Info: AN10365 Surface mount reflow soldering description Rev. 01 — 24 May 2005 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.